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| 图片 | 型号 | 库存 | 数量 | 规格书 | 系列 | 包装 | 产品状态 | 类型 | 成分 | 直径 | 熔点 | 助焊剂类型 | 线规 | 网格类型 | 工艺 | 形式 | 保质期 | 保质期起始 | 储存/冷藏温度 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
24-7340-9717SOLDER FLUX-CORED/285 .025" 1LB |
4,804 |
|
规格书 |
285 | Bulk | Active | Wire Solder | Pb93.5Sn5Ag1.5 (93.5/5/1.5) | 0.025" (0.64mm) | 565 ~ 574°F (296 ~ 301°C) | Rosin Mildly Activated (RMA) | 22 AWG, 23 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) |
|
NC191LT500CSMOOTH FLOW LOW TEMP SOLDER PAST |
2,713 |
|
规格书 |
Smooth Flow™ | Bulk | Active | Solder Paste | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | - | 280°F (138°C) | No-Clean | - | 4 | - | Cartridge, 17.64 oz (500g) | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
|
24-6337-7415SOLDER FLUX-CORED/282 63/37 .015 |
2,152 |
|
规格书 |
282 | Bulk | Active | Wire Solder | Sn63Pb37 (63/37) | 0.015" (0.38mm) | 361°F (183°C) | Rosin Mildly Activated (RMA) | 27 AWG, 28 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - | - |
|
92-7068-8801SOLDER FLUX-CORED/245 .031" 500G |
1,621 |
|
规格书 |
245 | Bulk | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.031" (0.79mm) | 423 ~ 424°F (217 ~ 218°C) | No-Clean | 20 AWG, 22 SWG | - | Lead Free | Spool, 17.64 oz (500g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) |
|
44-7050-0000SOLDER BAR 1.66LB |
4,649 |
|
规格书 |
ULTRAPURE® | Bulk | Active | Bar Solder | Sn96.3Ag3.7 (96.3/3.7) | - | 430 ~ 444°F (221 ~ 223°C) | - | - | - | Lead Free | Bar, 1.66 lbs (750g) | - | - | - |
|
24-7050-9718SOLDER FLUX-CORED/285 .025" 1LB |
1,385 |
|
规格书 |
285 | Bulk | Active | Wire Solder | Sn96.3Ag3.7 (96.3/3.7) | 0.025" (0.64mm) | 430 ~ 444°F (221 ~ 223°C) | Rosin Mildly Activated (RMA) | 22 AWG, 23 SWG | - | Lead Free | Spool, 1 lb (454 g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) |
|
|
24-7070-0061SOLDER FLUX-CORED/44 .062" 1LB S |
3,979 |
|
规格书 |
44 | Bulk | Active | Wire Solder | Sn95Ag5 (95/5) | 0.062" (1.57mm) | 430 ~ 473°F (221 ~ 245°C) | Rosin Activated (RA) | 14 AWG, 16 SWG | - | Lead Free | Spool, 1 lb (454 g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) |
|
REM16-ULTRA-NLULTRA LOW TEMP FLUX CORED CHIP R |
2,739 |
|
规格书 |
CHIPQUIK® | Bulk | Active | - | - | - | 144°F (62°C) | No-Clean, Water Soluble | - | - | Lead Free | - | - | - | - |
|
|
24-7070-0027SOLDER FLUX-CORED/44 .031" 1LB S |
4,757 |
|
规格书 |
44 | Bulk | Active | Wire Solder | Sn95Ag5 (95/5) | 0.031" (0.79mm) | 430 ~ 473°F (221 ~ 245°C) | Rosin Activated (RA) | 20 AWG, 22 SWG | - | Lead Free | Spool, 1 lb (454 g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) |
|
MMF006622361-40R SOLDER TIN-LEAD, 1 LB |
2,572 |
|
规格书 |
- | Bulk | Active | Wire Solder | Sn63Pb37 (63/37) | 0.040" (1.02mm) | 361°F (183°C) | Rosin Activated (RA) | 18 AWG, 19 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - | - |
|
|
44-7033-0000SOLDER BAR BAR 1.66LB |
1,587 |
|
规格书 |
ULTRAPURE® | Bulk | Active | Bar Solder | Sn97Ag3 (97/3) | - | 430 ~ 435°F (221 ~ 224°C) | - | - | - | Lead Free | Bar, 1.66 lbs (750g) | - | - | - |
|
|
24-7050-9702SOLDER FLUX-CORED/285 .020" 1LB |
3,222 |
|
规格书 |
285 | Bulk | Active | Wire Solder | Sn96.3Ag3.7 (96.3/3.7) | 0.020" (0.51mm) | 430 ~ 444°F (221 ~ 223°C) | Rosin Mildly Activated (RMA) | 24 AWG, 25 SWG | - | Lead Free | Spool, 1 lb (454 g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) |
|
SMD291SNL500T4CSOLDER PASTE SAC305 T4 500G |
2,347 |
|
规格书 |
- | Bulk | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | 4 | Lead Free | Cartridge, 17.64 oz (500g) | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
|
SMD4300SNL500T4CSOLDER PASTE SAC305 T4 500G |
1,072 |
|
规格书 |
CHIPQUIK® SMD4300 | Bulk | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean, Water Soluble | - | 4 | Lead Free | Cartridge, 17.64 oz (500g) | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
|
|
24-7070-0025SOLDER FLUX-CORED/44 .031" 1LB S |
1,317 |
|
规格书 |
44 | Bulk | Active | Wire Solder | Sn95Ag5 (95/5) | 0.031" (0.79mm) | 430 ~ 473°F (221 ~ 245°C) | Rosin Activated (RA) | 20 AWG, 22 SWG | - | Lead Free | Spool, 1 lb (454 g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) |
|
SMDLTLFP500T3SOLDER PASTE SN42/BI58 500G |
2,370 |
|
规格书 |
- | Bulk | Active | Solder Paste | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | - | 281°F (138°C) | No-Clean | - | 3 | Lead Free | Jar, 17.64 oz (500g) | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
|
70-2102-0610SOLDER PASTE WATER SOLUBLE 500GM |
2,901 |
|
规格书 |
R562 | Bulk | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | Water Soluble | - | 4 | Leaded | Jar, 17.64 oz (500g) | 6 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) |
|
70-1302-0510SOLDER PASTE R231 ROSIN 500GM |
2,396 |
|
规格书 |
R231 | Bulk | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | Rosin Mildly Activated (RMA) | - | 3 | Leaded | Jar, 17.64 oz (500g) | 4 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) |
|
70-0102-0610SOLDER PASTE NO CLEAN 500GM |
2,277 |
|
规格书 |
EP256 | Bulk | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean | - | 3 | Leaded | Jar, 17.64 oz (500g) | 6 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) |
|
70-1002-0511SOLDER PASTE WATER SOLUBLE 600GM |
3,199 |
|
规格书 |
HydroMark 531 | Bulk | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | Water Soluble | - | 3 | Leaded | Cartridge, 21.16 oz (600g) | 6 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) |
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