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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 冷却封装 附件方式 形状 长度 宽度 直径 Fin 高度 功耗 @ 温升 热阻 @ 强制气流 热阻 @ 自然对流 材质 材料表面处理
    577002B00000G

    577002B00000G

    HEAT SINK TO-220 .250" COMPACT

    Boyd Laconia, LLC

    11,322
    577002B00000G

    规格书

    - Bag Active Board Level TO-220 Bolt On Rectangular, Fins 0.750" (19.05mm) 0.520" (13.21mm) - 0.250" (6.35mm) 1.5W @ 50°C 10.00°C/W @ 500 LFM 32.00°C/W Aluminum Black Anodized
    V2022B

    V2022B

    HEATSINK CPU XCUT

    Assmann WSW Components

    3,673
    V2022B

    规格书

    - Bulk Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Thermal Tape, Adhesive (Not Included) Square, Pin Fins 0.827" (21.00mm) 0.827" (21.00mm) - 0.236" (6.00mm) - - 24.00°C/W Aluminum Alloy Black Anodized
    240118ABHE22

    240118ABHE22

    HEATSINK TO-220 TWISTED FIN

    Wakefield-Vette

    3,195
    240118ABHE22

    规格书

    240 Bulk Active Board Level, Vertical TO-220 Bolt On and PC Pin Rectangular, Fins 1.180" (29.97mm) 0.570" (14.47mm) - 0.500" (12.70mm) 4.0W @ 55°C 5.30°C/W @ 400 LFM 13.80°C/W Aluminum Black Anodized
    HSS-B20-NP-12

    HSS-B20-NP-12

    HEATSINK TO-220 6.8W ALUMINUM

    Same Sky (Formerly CUI Devices)

    1,157
    HSS-B20-NP-12

    规格书

    HSS Bag Active Board Level TO-220 Bolt On Rectangular, Fins 1.450" (36.83mm) 0.700" (17.80mm) - 0.850" (21.60mm) 6.8W @ 75°C 3.47°C/W @ 200 LFM 14.33°C/W Aluminum Black Anodized
    591302B02800G

    591302B02800G

    HEATSINK TO-220 W/INSTALL TAB

    Boyd Laconia, LLC

    27,378
    591302B02800G

    规格书

    - Bulk Active Board Level, Vertical TO-220, TO-262 Clip and Board Locks Rectangular, Fins 0.750" (19.05mm) 0.500" (12.70mm) - 0.500" (12.70mm) 1.0W @ 30°C 7.00°C/W @ 400 LFM 26.80°C/W Aluminum Black Anodized
    V6560Y

    V6560Y

    HEATSINK ALUM ANOD

    Assmann WSW Components

    12,491
    V6560Y

    规格书

    - Tray Active Board Level TO-220 Bolt On and PC Pin Rectangular, Fins 1.969" (50.00mm) 1.181" (30.00mm) - 0.472" (12.00mm) - - 7.00°C/W Aluminum Black Anodized
    V5629W220

    V5629W220

    HEATSINK ALUM ANOD

    Assmann WSW Components

    5,741
    V5629W220

    规格书

    - Bulk Active Top Mount TO-220 Bolt On and PC Pin Square, Fins 0.984" (25.00mm) 0.449" (11.40mm) - 0.260" (6.60mm) - - 36.00°C/W Aluminum Black Anodized
    HSB01-080808

    HSB01-080808

    HEAT SINK, BGA, 8.5 X 8.5 X 8 MM

    Same Sky (Formerly CUI Devices)

    2,653
    HSB01-080808

    规格书

    HSB Box Active Top Mount BGA Adhesive (Not Included) Square, Pin Fins 0.335" (8.50mm) 0.335" (8.50mm) - 0.315" (8.00mm) 1.9W @ 75°C 16.00°C/W @ 200 LFM 39.10°C/W Aluminum Alloy Black Anodized
    V2027B

    V2027B

    HEATSINK CPU XCUT

    Assmann WSW Components

    5,084
    V2027B

    规格书

    - Bulk Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Thermal Tape, Adhesive (Not Included) Square, Pin Fins 1.098" (27.90mm) 1.098" (27.90mm) - 0.441" (11.20mm) - - 19.00°C/W Aluminum Alloy Black Anodized
    HSB03-141406

    HSB03-141406

    HEAT SINK, BGA, 14 X 14 X 6 MM

    Same Sky (Formerly CUI Devices)

    3,329
    HSB03-141406

    规格书

    HSB Box Active Top Mount BGA Adhesive (Not Included) Square, Pin Fins 0.551" (14.00mm) 0.551" (14.00mm) - 0.236" (6.00mm) 2.1W @ 75°C 15.80°C/W @ 200 LFM 35.98°C/W Aluminum Alloy Black Anodized
    272-AB

    272-AB

    HEATSINK TO-220 SM FOOTPRINT BLK

    Wakefield-Vette

    2,177
    272-AB

    规格书

    272 Bulk Active Board Level TO-220, TO-202 Bolt On and PC Pin Rectangular, Fins 1.450" (36.83mm) 1.750" (44.45mm) - 0.375" (9.52mm) 4.0W @ 42°C 3.60°C/W @ 400 LFM 10.50°C/W Aluminum Black Anodized
    V2020B

    V2020B

    HEATSINK CPU XCUT

    Assmann WSW Components

    1,750
    V2020B

    规格书

    - Bulk Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Thermal Tape, Adhesive (Not Included) Square, Pin Fins 0.551" (14.00mm) 0.551" (14.00mm) - 0.394" (10.00mm) - - 27.00°C/W Aluminum Alloy Black Anodized
    V8813W

    V8813W

    HEATSINK TO-220/TOP-3/SOT-32

    Assmann WSW Components

    1,426
    V8813W

    规格书

    - Tray Active Board Level, Vertical SOT-32, TO-220, TOP-3 Bolt On and PC Pin Rectangular, Fins 0.984" (25.00mm) 1.359" (34.50mm) - 0.492" (12.50mm) - - 6.50°C/W Aluminum Black Anodized
    HSB18-232310

    HSB18-232310

    HEAT SINK, BGA, 23 X 23 X 10 MM

    Same Sky (Formerly CUI Devices)

    4,224
    HSB18-232310

    规格书

    HSB Box Active Top Mount BGA Adhesive (Not Included) Square, Pin Fins 0.906" (23.00mm) 0.906" (23.00mm) - 0.394" (10.00mm) 3.7W @ 75°C 6.80°C/W @ 200 LFM 20.41°C/W Aluminum Alloy Black Anodized
    V-1100-SMD/A

    V-1100-SMD/A

    HEATSINK TO-263 12.70X26.20MM

    Assmann WSW Components

    1,855
    V-1100-SMD/A

    规格书

    - Tape & Reel (TR) Active Top Mount TO-263 (D²Pak) SMD Pad Rectangular, Fins 0.500" (12.70mm) 1.031" (26.20mm) - 0.390" (9.91mm) - - 23.00°C/W Copper Tin
    HSE-B20250-040H-01

    HSE-B20250-040H-01

    HEAT SINK, EXTRUSION, TO-220, 25

    Same Sky (Formerly CUI Devices)

    1,145
    HSE-B20250-040H-01

    规格书

    HSE Box Active Board Level, Vertical TO-220 PC Pin Rectangular, Angled Fins 0.984" (25.00mm) 1.359" (34.50mm) - 0.492" (12.50mm) 5.5W @ 75°C 4.44°C/W @ 200 LFM 13.64°C/W Aluminum Alloy Black Anodized
    506007B00000G

    506007B00000G

    HEATSINK TO-3 LOW PROFILE .375"

    Boyd Laconia, LLC

    3,540
    506007B00000G

    规格书

    - Bag Active Board Level TO-3 Bolt On Rectangular, Fins 2.000" (50.80mm) 1.750" (44.45mm) - 0.375" (9.52mm) 10.0W @ 70°C 3.00°C/W @ 400 LFM 7.00°C/W Aluminum Black Anodized
    ATS-PCB1025

    ATS-PCB1025

    HEATSINK TO-126 BLACK

    Advanced Thermal Solutions Inc.

    4,414
    ATS-PCB1025

    规格书

    - Bulk Active Board Level TO-126 Bolt On Rectangular, Fins 0.560" (14.22mm) 0.620" (15.75mm) - 0.370" (9.40mm) - 19.00°C/W @ 200 LFM 33.00°C/W Aluminum Black Anodized
    ATS-PCB1064

    ATS-PCB1064

    HEATSINK TO-220 CLIP-ON BLACK

    Advanced Thermal Solutions Inc.

    1,471
    ATS-PCB1064

    规格书

    - Bulk Active Board Level TO-220 Clip Rectangular, Fins 0.748" (19.00mm) 0.504" (12.80mm) - 0.500" (12.70mm) - 10.20°C/W @ 200 LFM 27.30°C/W Aluminum Black Anodized
    HSB08-212106

    HSB08-212106

    HEAT SINK, BGA, 21 X 21 X 6 MM

    Same Sky (Formerly CUI Devices)

    1,436
    HSB08-212106

    规格书

    HSB Box Active Top Mount BGA Adhesive (Not Included) Square, Pin Fins 0.827" (21.00mm) 0.827" (21.00mm) - 0.236" (6.00mm) 3.0W @ 75°C 9.70°C/W @ 200 LFM 25.40°C/W Aluminum Alloy Black Anodized
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