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    342950

    342950

    COPPER HEATSINK 90X90X10MM

    Boyd Laconia, LLC

    1,204
    342950

    规格书

    - Tray Active Top Mount, Skived BGA Push Pin Square, Fins 3.543" (90.00mm) 3.543" (90.00mm) - 0.394" (10.00mm) - 1.30°C/W @ 200 LFM 4.50°C/W Copper AavSHIELD 3C
    34097

    34097

    COOLJAG BUF-A4 FANSINK FOR TRENZ

    Trenz Electronic GmbH

    2,823
    34097

    规格书

    - Bulk Active - - - - - - - - - - - - -
    342946

    342946

    COPPER HEATSINK 60X60X22MM

    Boyd Laconia, LLC

    1,506
    342946

    规格书

    - Tray Active Top Mount, Skived BGA Push Pin Square, Fins 2.362" (60.00mm) 2.362" (60.00mm) - 0.866" (22.00mm) - 0.80°C/W @ 300 LFM 7.20°C/W Copper AavSHIELD 3C
    HSET875-X-1

    HSET875-X-1

    HEAT SPREADER FOR ET875-X7/ X5,

    iBASE Technology

    4,118
    HSET875-X-1

    规格书

    - Box Active Heat Spreader ET875-x7/x5Q/x5 - - - - - - - - - - -
    HSIB918-A

    HSIB918-A

    AC, HEATSINK + FAN FOR IB918 SER

    iBASE Technology

    2,959
    HSIB918-A

    规格书

    - Box Active Top Mount IB918 - - - - - - - - - - -
    9-1542005-7

    9-1542005-7

    35MM HS ASSY ULTEM C

    TE Connectivity AMP Connectors

    2,061
    9-1542005-7

    规格书

    - Box Obsolete Top Mount with Fan BGA Clip Cylindrical, Pin Fins - - 1.985" (50.42mm) OD 0.680" (17.27mm) - 2.90°C/W @ 200 LFM 7.90°C/W Aluminum Black Anodized
    40519

    40519

    BOM ASSY 4623 DUAL HTSNK 11MM

    Vicor Corporation

    4,787
    40519

    规格书

    * Bulk Active - - - - - - - - - - - - -
    125562

    125562

    4.429WX11.81" EXTRUS 17080-11.81

    Wakefield-Vette

    4,751
    125562

    规格书

    - Box Active Top Mount, Extrusion - Adhesive Rectangular, Fins 11.810" (299.97mm) 4.429" (112.50mm) - 3.276" (83.21mm) - - 0.15°C/W Aluminum -
    125386

    125386

    5WX36" EXTRUSION 16936 XX7330

    Wakefield-Vette

    4,397
    125386

    规格书

    - Box Active Board Level, Extrusion Power Modules Bolt On Rectangular, Fins 36.000" (914.40mm) 5.000" (127.00mm) - 2.500" (63.50mm) - - 0.43°C/W Aluminum -
    SF4P2U-F002-A01

    SF4P2U-F002-A01

    Intel FCLGA 3647 Square ILM 2U

    Cooltron Industrial Supply

    1,443
    SF4P2U-F002-A01

    规格书

    Intel FCLGA 3647 Bulk Active Top Mount with Fan Intel LGA3647 2U Active CPU Cooler Push Pin Rectangular, Fins 3.583" (91.00mm) 3.465" (88.00mm) - 2.519" (64.00mm) 205.0W @ 33.46°C - 0.16°C/W Aluminum, Copper -
    465K-MOD

    465K-MOD

    HEAT SINKS STUD MOUNTED DIODE BO

    Wakefield-Vette

    2,732
    465K-MOD

    规格书

    - Bulk Active - - - - - - - - - - - - -
    SF4P2U-F005-A01

    SF4P2U-F005-A01

    AMD SP3 & sTRX4 Series 240W 2U S

    Cooltron Industrial Supply

    1,335
    SF4P2U-F005-A01

    规格书

    AMD SP3 and sTRX4 Bulk Active Top Mount with Fan AMD SP3 2U Active CPU Cooler, AMD sTRX4 2U Active CPU Cooler Push Pin Rectangular, Fins 4.724" (120.00mm) 3.150" (80.00mm) - 2.500" (63.50mm) 240.0W @ 32.78°C - 0.14°C/W Aluminum, Copper -
    125577

    125577

    10.827WX12" EXTRUSION 19572

    Wakefield-Vette

    3,469
    125577

    规格书

    - Box Active Top Mount, Extrusion - Adhesive Rectangular, Fins 12.000" (304.80mm) 10.827" (275.01mm) - 1.220" (31.00mm) - - 0.21°C/W Aluminum -
    HSET870-A

    HSET870-A

    HEATSINK FOR ET870 (H051HSET8700

    iBASE Technology

    1,349
    HSET870-A

    规格书

    - Box Active Top Mount ET870 - - - - - - - - - - -
    HSET870-1

    HSET870-1

    HEAT SPREADER FOR ET870 (H051HSE

    iBASE Technology

    1,741
    HSET870-1

    规格书

    - Box Active Heat Spreader ET870 - - - - - - - - - - -
    486K

    486K

    HEATSINK HIGH PWR RECT/DIODES

    Wakefield-Vette

    4,150
    486K

    规格书

    486 Bulk Active Board Level, Extrusion Stud Mounted Diode Press Fit Rectangular, Fins 6.000" (152.40mm) 6.520" (165.61mm) - 6.520" (165.61mm) 50.0W @ 24°C 0.20°C/W @ 250 LFM - Aluminum Black Anodized
    342950-COPPER SKIVFIN

    342950-COPPER SKIVFIN

    342950,REV02(GP)

    Boyd Laconia, LLC

    1,345
    342950-COPPER SKIVFIN

    规格书

    - Bulk Active Board Level BGA, FPGA Push Pin, Thermal Material Square, Fins 3.543" (90.00mm) 3.543" (90.00mm) - 0.394" (10.00mm) - - - Copper -
    V5583B

    V5583B

    PROFILE HEATSINK

    Assmann WSW Components

    1,272
    V5583B

    规格书

    - Bulk Active - - - - - - - - - - - - -
    V6716B

    V6716B

    PROFILE HEATSINK

    Assmann WSW Components

    1,328
    V6716B

    规格书

    - Bulk Active - - - - - - - - - - - - -
    125454

    125454

    10.5WX12" EXTRUSION 16990 XX2904

    Wakefield-Vette

    1,825
    125454

    规格书

    - Box Active Top Mount, Extrusion - Adhesive Rectangular, Fins 12.000" (304.80mm) 10.500" (266.70mm) - 1.265" (32.13mm) - - 0.33°C/W Aluminum -
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