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    微控制器、微处理器、FPGA 模块

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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 模块/板类型 核心处理器 协处理器 速度 闪存大小 RAM 大小 连接器类型 尺寸 / 尺寸 工作温度
    TE0820-05-3BI21ML

    TE0820-05-3BI21ML

    MOD MPSOC 2GB DDR4

    Trenz Electronic GmbH

    1,446
    TE0820-05-3BI21ML

    规格书

    TE0820 Bulk Last Time Buy MPU Core - - - 8GB eMMC, 128MB QSPI 2GB - - -
    20-101-1314

    20-101-1314

    MODULE ETHERNET OP7300

    Digi

    1,372
    20-101-1314

    规格书

    - Bulk Obsolete - - - - - - - - -
    5CSX-H5-4YA-RI

    5CSX-H5-4YA-RI

    IC MOD CORTEX-A9 800MHZ 1GB 32MB

    Critical Link LLC

    1,522
    5CSX-H5-4YA-RI

    规格书

    MitySOM Bulk Active MPU, FPGA Core ARM® Cortex®-A9, Cyclone V SX/SE NEON™ SIMD 800MHz 32MB 1GB Edge Connector 3.200" L x 1.500" W (82.00mm x 39.00mm) -40°C ~ 85°C
    TE0821-01-3AE31PA

    TE0821-01-3AE31PA

    MPSOC MODULE WITH XILINX ZYNQ UL

    Trenz Electronic GmbH

    2,492
    TE0821-01-3AE31PA

    规格书

    TE0823 Bulk Discontinued MPU Core Zynq UltraScale+ XCZU3CG-1SFVC784E ARM® Cortex®-A53, ARM® Cortex®-R5 - 128MB 4GB 2 x 100 Pin 1.970" L x 1.570" W (50.00mm x 40.00mm) 0°C ~ 85°C
    5CSX-H6-53B-RC

    5CSX-H6-53B-RC

    IC MOD CORTEX-A9 800MHZ 512MB

    Critical Link LLC

    2,895
    5CSX-H6-53B-RC

    规格书

    MitySOM Bulk Active MPU, FPGA Core ARM® Cortex®-A9, Cyclone V SX/SE NEON™ SIMD 800MHz 48MB 512MB Edge Connector 3.200" L x 1.500" W (82.00mm x 39.00mm) 0°C ~ 70°C
    AM0010-02-3BE21MA

    AM0010-02-3BE21MA

    MPSOC MODULE WITH XILINX ZYNQ UL

    Trenz Electronic GmbH

    1,999
    AM0010-02-3BE21MA

    规格书

    Zynq® UltraScale+™ Bulk Active MPU Core Zynq™ UltraScale+™ ZU3EG-1E - - 128MB 4GB Board-to-Board (BTB) Socket 2.205" L x 1.575" W (56.00mm x 40.00mm) 0°C ~ 85°C
    TE0745-02-71I31-AK

    TE0745-02-71I31-AK

    MOD SOM DDR3L 1GB HEAT SPREADER

    Trenz Electronic GmbH

    4,312
    TE0745-02-71I31-AK

    规格书

    TE0745 Bulk Active MCU, FPGA ARM Cortex-A9 Zynq-7000 (Z-7030) - 64MB 1GB Board-to-Board (BTB) Socket - 480 2.990" L x 2.130" W (76.00mm x 54.00mm) -40°C ~ 85°C
    TE0803-02-03EG-1EB

    TE0803-02-03EG-1EB

    IC MODULE ZYNQ USCALE 4GB 128MB

    Trenz Electronic GmbH

    2,564
    TE0803-02-03EG-1EB

    规格书

    TE0803 Bulk Active MPU Core Zynq UltraScale+ XCZU3EG-1SFVC784E - - 128MB 4GB B2B 2.050" L x 2.990" W (52.00mm x 76.00mm) 0°C ~ 85°C
    TE0813-01-4DE11-AZ

    TE0813-01-4DE11-AZ

    MPSOC MODULE WITH XILINX ZYNQ UL

    Trenz Electronic GmbH

    2,883
    TE0813-01-4DE11-AZ

    规格书

    - Bulk Obsolete - - - - - - - - -
    TE0745-03-71I31-AK

    TE0745-03-71I31-AK

    SOM WITH AMD ZYNQ 7030-1I AND HE

    Trenz Electronic GmbH

    1,724
    TE0745-03-71I31-AK

    规格书

    Zynq Bulk Active MPU Core ARM Cortex-A9 Xilinx Zynq 7030 SoC XC7Z030-1FBG676I - 64MB 1GB Samtec ST5 2.990" L x 2.050" W (76.00mm x 52.00mm) -40°C ~ 85°C
    TE0803-04-4DE11-A

    TE0803-04-4DE11-A

    IC MODULE ZYNQ USCALE 2GB 128MB

    Trenz Electronic GmbH

    2,972
    TE0803-04-4DE11-A

    规格书

    TE0803 Bulk Active MPU Core Zynq UltraScale+ XCZU4EV-1SFVC784E - - 128MB 2GB B2B 2.050" L x 2.990" W (52.00mm x 76.00mm) 0°C ~ 85°C
    TE0821-01-3BI21MA

    TE0821-01-3BI21MA

    MPSOC MODULE WITH XILINX ZYNQ UL

    Trenz Electronic GmbH

    4,690
    TE0821-01-3BI21MA

    规格书

    TE0823 Bulk Discontinued MPU Core Zynq™ UltraScale+™ XCZU3EG-1SFVC784I ARM® Cortex®-A53, ARM® Cortex®-R5 - 128MB 2GB 2 x 160 Pin 1.970" L x 1.570" W (50.00mm x 40.00mm) -40°C ~ 85°C
    TE0820-05-4DE81MA

    TE0820-05-4DE81MA

    MPSOC MODULE WITH XILINX ZYNQ UL

    Trenz Electronic GmbH

    1,532
    TE0820-05-4DE81MA

    规格书

    - Bulk Active - - - - - - - - -
    TE0813-01-4DE11-A

    TE0813-01-4DE11-A

    MPSOC MODULE WITH XILINX ZYNQ UL

    Trenz Electronic GmbH

    4,590
    TE0813-01-4DE11-A

    规格书

    Zynq® UltraScale+™ Bulk Active MPU Core Zynq UltraScale+ XCZU4EV-1SFVC784E - - 128MB 2GB Board-to-Board (BTB) Socket - 240 2.990" L x 2.050" W (76.00mm x 52.00mm) 0°C ~ 85°C
    TE0813-02-4DE81-A

    TE0813-02-4DE81-A

    TE0813-02-4DE81-A STARTER KIT

    Trenz Electronic GmbH

    1,355
    TE0813-02-4DE81-A

    规格书

    Kintex™-7 Bulk Active FPGA Zynq™ UltraScale+™ ZU4EV - - 128MB 4GB BGA 2.990" L x 2.050" W (76.00mm x 52.00mm) 0°C ~ 85°C
    AM0010-02-3BI21MA

    AM0010-02-3BI21MA

    MPSOC MODULE WITH XILINX ZYNQ UL

    Trenz Electronic GmbH

    4,005
    AM0010-02-3BI21MA

    规格书

    Zynq® UltraScale+™ Bulk Active MPU Core Zynq™ UltraScale+™ ZU3EG-1I - - 128MB 4GB Board-to-Board (BTB) Socket 2.205" L x 1.575" W (56.00mm x 40.00mm) -40°C ~ 85°C
    L138-DG-325-RI

    L138-DG-325-RI

    MITYDSP-L138F SOM W/ OMAP-L138

    Critical Link LLC

    2,963
    L138-DG-325-RI

    规格书

    MityDSP-L138F Bag Obsolete MPU, DSP, FPGA Core ARM926EJ-S, OMAP-L138 TMS320C674x (DSP), Spartan-6, XC6SLX16 (FPGA) 375MHz 256MB (NAND), 16MB (NOR) 128MB SO-DIMM-200 2.660" L x 2.000" W (67.60mm x 50.80mm) -40°C ~ 85°C
    AM0010-02-4DE21MA

    AM0010-02-4DE21MA

    MPSOC MODULE WITH XILINX ZYNQ UL

    Trenz Electronic GmbH

    1,797
    AM0010-02-4DE21MA

    规格书

    Zynq® UltraScale+™ Bulk Active MPU Core Zynq™ UltraScale+™ ZU4EV - - 128MB 4GB Board-to-Board (BTB) Socket 2.220" L x 1.575" W (56.40mm x 40.00mm) 0°C ~ 85°C
    TE0803-01-04CG-1EA

    TE0803-01-04CG-1EA

    IC MODULE ZYNQ USCALE 2GB 128MB

    Trenz Electronic GmbH

    3,099
    TE0803-01-04CG-1EA

    规格书

    TE0803 Bulk Active MPU Core Zynq UltraScale+ XCZU4CG-1SFVC784E - - 128MB 2GB B2B 2.990" L x 2.050" W (76.00mm x 52.00mm) 0°C ~ 85°C
    EC-VA-H264-10B-60-1080-MD00C-A200T

    EC-VA-H264-10B-60-1080-MD00C-A200T

    MOD H264 ENC 60FPS 1080 SODIMM

    System-On-Chip (SOC) Technologies Inc.

    1,106
    EC-VA-H264-10B-60-1080-MD00C-A200T

    规格书

    - Box Active DSP, FPGA Core - Xilinx Artix-7 XC7A200T - 32MB 512MB SO-DIMM - -
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