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    微控制器、微处理器、FPGA 模块

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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 模块/板类型 核心处理器 协处理器 速度 闪存大小 RAM 大小 连接器类型 尺寸 / 尺寸 工作温度
    TE0745-02-91C31-A

    TE0745-02-91C31-A

    MOD SOM DDR3L 1GB

    Trenz Electronic GmbH

    1,730
    TE0745-02-91C31-A

    规格书

    TE0745 Bulk Obsolete MCU, FPGA ARM Cortex-A9 Zynq-7000 (Z-7045) - 64MB 1GB Board-to-Board (BTB) Socket - 480 2.050" L x 2.990" W (52.00mm x 76.00mm) -40°C ~ 85°C
    TE0817-01-4BE21-A

    TE0817-01-4BE21-A

    MPSOC MODULE WITH XILINX ZYNQ UL

    Trenz Electronic GmbH

    4,324
    TE0817-01-4BE21-A

    规格书

    Zynq® UltraScale+™ Bulk Obsolete MPU Core Zynq™ UltraScale+™ XCZU4EG-1FBVB900E - - 128MB 4GB Board-to-Board (BTB) Socket - 240 2.990" L x 2.050" W (76.00mm x 52.00mm) 0°C ~ 85°C
    IW-G30M-C4CG-4E002G-E008G-BIA

    IW-G30M-C4CG-4E002G-E008G-BIA

    ZU4CG (-1 Speed) MPSoC SOM

    iWave Global

    1,676
    IW-G30M-C4CG-4E002G-E008G-BIA

    规格书

    Zynq® UltraScale+™ Bulk Active MPU, FPG ARM® Cortex®-A53(x40, ARM® Cortex®-R5(x2) ARM® Mali 400 MP2 1.5GHz, 600MHz 8GB eMMC 4GB, 1GB 2 x 240 Pin 4.330" L x 2.950" W (110.00mm x 75.00mm) -40°C ~ 85°C
    TE0820-05-4DI81MA

    TE0820-05-4DI81MA

    MPSOC MODULE WITH XILINX ZYNQ UL

    Trenz Electronic GmbH

    3,430
    TE0820-05-4DI81MA

    规格书

    - Bulk Active - - - - - - - - -
    TE0807-03-4BE21-A

    TE0807-03-4BE21-A

    MPSOC MODULE WITH XILINX ZYNQ UL

    Trenz Electronic GmbH

    3,177
    TE0807-03-4BE21-A

    规格书

    TE0807 Bulk Discontinued MPU Core Zynq™ UltraScale+™ XCZU4EG-1FBVB900E - - 128MB 4GB Board-to-Board (BTB) Socket - 160 2.990" L x 2.050" W (76.00mm x 52.00mm) 0°C ~ 85°C
    TE0807-03-4BE21-AK

    TE0807-03-4BE21-AK

    MPSOC MODULE TE0807 WITH ZYNQ UL

    Trenz Electronic GmbH

    4,598
    TE0807-03-4BE21-AK

    规格书

    TE0807 Bulk Discontinued MPU Core Zynq™ UltraScale+™ XCZU4EG-1FBVB900E - - 128MB 4GB Board-to-Board (BTB) Socket - 160 2.990" L x 2.050" W (76.00mm x 52.00mm) 0°C ~ 85°C
    TE0808-05-6BE21-L

    TE0808-05-6BE21-L

    ULTRASOM+ MPSOC MODULE WITH ZYNQ

    Trenz Electronic GmbH

    4,459
    TE0808-05-6BE21-L

    规格书

    TE0808 Bulk Discontinued MPU Core Zynq™ UltraScale+™ ZU6EG-1FFVC900E - - 128MB 4GB Board-to-Board (BTB) Socket - 160 2.990" L x 2.050" W (76.00mm x 52.00mm) 0°C ~ 85°C
    TE0808-05-6BE81-L

    TE0808-05-6BE81-L

    ULTRASOM+ MPSOC MODULE WITH ZYNQ

    Trenz Electronic GmbH

    3,500
    TE0808-05-6BE81-L

    规格书

    - Bulk Discontinued - - - - - - - - -
    TE0808-05-6BE21-F

    TE0808-05-6BE21-F

    ULTRASOM+ MPSOC MODULE WITH AMD

    Trenz Electronic GmbH

    3,124
    TE0808-05-6BE21-F

    规格书

    - Bulk Active MPU Core Zynq™ UltraScale+™ ZU6EG-1FFVC900E - - 128MB 4GB Board-to-Board (BTB) 4 x 160 Pin 2.990" L x 2.050" W (76.00mm x 52.00mm) 0°C ~ 85°C
    TE0818-01-6BE21-A

    TE0818-01-6BE21-A

    ULTRASOM+ MPSOC MODULE WITH ZYNQ

    Trenz Electronic GmbH

    4,121
    TE0818-01-6BE21-A

    规格书

    Zynq® UltraScale+™ Bulk Active MPU Core Zynq UltraScale+ XCZU6EG-1FFVC900E - - 128MB 4GB Board-to-Board (BTB) Socket - 240 2.990" L x 2.050" W (76.00mm x 52.00mm) 0°C ~ 85°C
    TE0818-02-6BE81-A

    TE0818-02-6BE81-A

    ULTRASOM+ MPSOC MODULE WITH ZYNQ

    Trenz Electronic GmbH

    2,233
    TE0818-02-6BE81-A

    规格书

    Zynq UltraScale+ Bulk Active MPU Core Xilinx Zynq UltraScale+ XCZU6EG-1FFVC900E - - 128MB 4GB Board-to-Board (BTB) Socket - 4 x 240 2.990" L x 2.050" W (76.00mm x 52.00mm) 0°C ~ 85°C
    TE0808-05-6BE21-A

    TE0808-05-6BE21-A

    ULTRASOM+ MPSOC MODULE WITH ZYNQ

    Trenz Electronic GmbH

    1,803
    TE0808-05-6BE21-A

    规格书

    TE0808 Bulk Discontinued MPU Core Zynq™ UltraScale+™ ZU6EG-1FFVC900E - - 128MB 4GB 4 x 160 Pin 2.990" L x 2.050" W (76.00mm x 52.00mm) 0°C ~ 85°C
    TE0808-05-6BE81-A

    TE0808-05-6BE81-A

    ULTRASOM+ MPSOC MODULE WITH ZYNQ

    Trenz Electronic GmbH

    1,315
    TE0808-05-6BE81-A

    规格书

    - Bulk Discontinued - - - - - - - - -
    TE0808-05-6BE81-E

    TE0808-05-6BE81-E

    ULTRASOM+ MPSOC MODULE WITH AMD

    Trenz Electronic GmbH

    4,167
    TE0808-05-6BE81-E

    规格书

    - Bulk Active - - - - - - - - -
    TE0808-04-6BE21-L

    TE0808-04-6BE21-L

    IC MOD SOM MPSOC 4GB XCZU6EG

    Trenz Electronic GmbH

    3,891
    TE0808-04-6BE21-L

    规格书

    TE0808 Bulk Active MPU Core Zynq UltraScale+ XCZU6EG-1FFVC900E - - 128MB 4GB B2B 2.050" L x 2.990" W (52.00mm x 76.00mm) 0°C ~ 85°C
    TE0808-05-6BE81-AK

    TE0808-05-6BE81-AK

    ULTRASOM+ MPSOC MODULE WITH ZYNQ

    Trenz Electronic GmbH

    1,954
    TE0808-05-6BE81-AK

    规格书

    - Bulk Discontinued - - - - - - - - -
    TE0808-05-6BE21-AK

    TE0808-05-6BE21-AK

    ULTRASOM+ MPSOC MODULE WITH ZYNQ

    Trenz Electronic GmbH

    1,098
    TE0808-05-6BE21-AK

    规格书

    TE0808 Bulk Discontinued MPU Core Zynq™ UltraScale+™ ZU6EG-E - - 128MB 4GB Board-to-Board (BTB) Socket - 160 2.990" L x 2.050" W (76.00mm x 52.00mm) 0°C ~ 85°C
    TE0808-04-6BE21-AK

    TE0808-04-6BE21-AK

    IC MOD SOM MPSOC 4GB ZU6EG

    Trenz Electronic GmbH

    2,627
    TE0808-04-6BE21-AK

    规格书

    TE0808 Bulk Active MPU Core Zynq UltraScale+ XCZU6EG-1FFVC900E - - 128MB 4GB B2B 2.050" L x 2.990" W (52.00mm x 76.00mm) 0°C ~ 85°C
    TE0807-03-5AI21-A

    TE0807-03-5AI21-A

    MPSOC ZYNQ USCALE 4GB DDR4

    Trenz Electronic GmbH

    4,840
    TE0807-03-5AI21-A

    规格书

    - Box Active - - - - - - - - -
    MOD5270BXX

    MOD5270BXX

    IC MOD COLDFIRE 95MHZ 2.064MB

    NXP USA Inc.

    3,323
    MOD5270BXX

    规格书

    - Bulk Obsolete MCU, Ethernet Core ColdFire 5270 - 95MHz 512KB 2.064MB RJ-45, 2x50 Header 2.600" L x 2.000" W (66.04mm x 50.80mm) 0°C ~ 70°C
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