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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    614-87-314-31-012101

    614-87-314-31-012101

    CONN IC DIP SOCKET 14POS GOLD

    Preci-Dip

    3,924
    614-87-314-31-012101

    规格书

    614 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    05-0513-10H

    05-0513-10H

    CONN SOCKET SIP 5POS GOLD

    Aries Electronics

    3,384
    05-0513-10H

    规格书

    0513 Bulk Active SIP 5 (1 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    110-87-624-41-005101

    110-87-624-41-005101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    4,147
    110-87-624-41-005101

    规格书

    110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-87-624-41-605101

    110-87-624-41-605101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    1,582
    110-87-624-41-605101

    规格书

    110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    AR48-HZL-TT

    AR48-HZL-TT

    CONN IC DIP SOCKET 48POS TIN

    Assmann WSW Components

    2,470
    AR48-HZL-TT

    规格书

    - Bag Obsolete DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
    A-CCS52-G

    A-CCS52-G

    CONN SOCKET PLCC 52POS GOLD

    Assmann WSW Components

    2,604
    A-CCS52-G

    规格书

    - Bag Obsolete PLCC 52 (4 x 13) 0.050" (1.27mm) Gold - Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
    612-87-316-41-001101

    612-87-316-41-001101

    CONN IC DIP SOCKET 16POS GOLD

    Preci-Dip

    4,610
    612-87-316-41-001101

    规格书

    612 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-87-308-41-011101

    116-87-308-41-011101

    CONN IC DIP SOCKET 8POS GOLD

    Preci-Dip

    2,238
    116-87-308-41-011101

    规格书

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    115-87-322-41-001101

    115-87-322-41-001101

    CONN IC DIP SOCKET 22POS GOLD

    Preci-Dip

    4,359
    115-87-322-41-001101

    规格书

    115 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    AR 52-HGL-TT

    AR 52-HGL-TT

    SOCKET

    Assmann WSW Components

    2,085
    AR 52-HGL-TT

    规格书

    AR Bulk Active DIP, 0.6" (15.24mm) Row Spacing 52 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    06-6513-10

    06-6513-10

    CONN IC DIP SOCKET 6POS GOLD

    Aries Electronics

    4,346
    06-6513-10

    规格书

    Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    08-3513-10T

    08-3513-10T

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    2,475
    08-3513-10T

    规格书

    Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    08-6513-10T

    08-6513-10T

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    2,336
    08-6513-10T

    规格书

    Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    07-0518-00

    07-0518-00

    CONN SOCKET SIP 7POS GOLD

    Aries Electronics

    3,259
    07-0518-00

    规格书

    518 Bulk Active SIP 7 (1 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    11-0518-10T

    11-0518-10T

    CONN SOCKET SIP 11POS GOLD

    Aries Electronics

    4,285
    11-0518-10T

    规格书

    518 Bulk Active SIP 11 (1 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    ED068PLCZ-SM-N

    ED068PLCZ-SM-N

    CONN SOCKET PLCC 68POS

    On Shore Technology Inc.

    2,651
    ED068PLCZ-SM-N

    规格书

    ED Tube Active PLCC 68 (2 x 34) 0.050" (1.27mm) - - Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) - - Phosphor Bronze Polyphenylene Sulfide (PPS) -55°C ~ 105°C
    A-CCS68-G

    A-CCS68-G

    CONN SOCKET PLCC 68POS GOLD

    Assmann WSW Components

    3,399
    A-CCS68-G

    规格书

    - Bag Obsolete PLCC 68 (4 x 17) 0.050" (1.27mm) Gold - Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
    1-1437535-9

    1-1437535-9

    CONN IC DIP SOCKET 8POS TIN

    TE Connectivity AMP Connectors

    4,044
    1-1437535-9

    规格书

    500 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Brass - -55°C ~ 105°C
    A28-LCG-T-R

    A28-LCG-T-R

    CONN IC DIP SOCKET 28POS GOLD

    Assmann WSW Components

    1,021
    A28-LCG-T-R

    规格书

    - Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold - - Through Hole Open Frame Solder 0.100" (2.54mm) Gold - - Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
    506-AG12D-LF

    506-AG12D-LF

    CONN IC DIP SOCKET 6POS TIN

    TE Connectivity AMP Connectors

    3,976
    506-AG12D-LF

    规格书

    500 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 105°C
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