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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    05-0518-11H

    05-0518-11H

    CONN SOCKET SIP 5POS GOLD

    Aries Electronics

    3,565
    05-0518-11H

    规格书

    518 Bulk Active SIP 5 (1 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    13-0518-10

    13-0518-10

    CONN SOCKET SIP 13POS GOLD

    Aries Electronics

    2,689
    13-0518-10

    规格书

    518 Bulk Active SIP 13 (1 x 13) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    03-0508-30

    03-0508-30

    CONN SOCKET SIP 3POS GOLD

    Aries Electronics

    1,748
    03-0508-30

    规格书

    508 Bulk Active SIP 3 (1 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    SIP1X27-014B

    SIP1X27-014B

    SIP1X27-014B-SIP SOCKET 27 CTS

    Amphenol ICC (FCI)

    3,673
    SIP1X27-014B

    规格书

    SIP1x Bulk Active SIP 27 (1 x 27) 0.100" (2.54mm) Tin-Lead 150.0µin (3.81µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
    116-87-610-41-007101

    116-87-610-41-007101

    CONN IC DIP SOCKET 10POS GOLD

    Preci-Dip

    4,124
    116-87-610-41-007101

    规格书

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-83-312-41-105101

    110-83-312-41-105101

    CONN IC DIP SOCKET 12POS GOLD

    Preci-Dip

    4,600
    110-83-312-41-105101

    规格书

    110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-87-324-41-605101

    110-87-324-41-605101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    1,630
    110-87-324-41-605101

    规格书

    110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-87-324-41-005101

    110-87-324-41-005101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    1,348
    110-87-324-41-005101

    规格书

    110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    HLS-0102-G-12

    HLS-0102-G-12

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    4,853
    HLS-0102-G-12

    规格书

    HLS Tube Active SIP 2 (1 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    ARO 64-HZL/NEC-T

    ARO 64-HZL/NEC-T

    SOCKET

    Assmann WSW Components

    3,222
    ARO 64-HZL/NEC-T

    规格书

    - Bulk Active - - - - - - - - - - - - - - -
    540-99-032-24-000000

    540-99-032-24-000000

    CONN SOCKET PLCC 32POS TIN-LEAD

    Mill-Max Manufacturing Corp.

    4,551
    540-99-032-24-000000

    规格书

    540 Tube Obsolete PLCC 32 (2 x 7, 2 x 9) 0.050" (1.27mm) Tin-Lead 200.0µin (5.08µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) - Polyphenylene Sulfide (PPS) -
    AR24-HZL/7/07-TT

    AR24-HZL/7/07-TT

    CONN IC DIP SOCKET 24POS GOLD

    Assmann WSW Components

    4,088
    AR24-HZL/7/07-TT

    规格书

    - Bag Obsolete DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
    ED044PLCZ

    ED044PLCZ

    CONN SOCKET PLCC 44POS TIN

    On Shore Technology Inc.

    1,787
    ED044PLCZ

    规格书

    ED Tube Active PLCC 44 (2 x 22) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT) -55°C ~ 105°C
    A-ICS-254-08-TT50

    A-ICS-254-08-TT50

    IC SOCKET, MACHINED PIN, 7.62MM,

    Assmann WSW Components

    3,674
    A-ICS-254-08-TT50

    规格书

    - Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 0.100" (2.54mm) Nickel 78.7µin (2.00µm) Beryllium Copper Through Hole, Right Angle Open Frame Solder 0.100" (2.54mm) Tin 78.7µin (2.00µm) Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    D2614-42

    D2614-42

    CONN IC DIP SOCKET 14POS GOLD

    Harwin Inc.

    4,008
    D2614-42

    规格书

    D26 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin 196.9µin (5.00µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    AR 32 HGL-TT

    AR 32 HGL-TT

    SOCKET

    Assmann WSW Components

    4,019
    AR 32 HGL-TT

    规格书

    AR Bulk Active DIP, 0.3" (7.62mm) Row Spacing 32 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    116-83-308-41-009101

    116-83-308-41-009101

    CONN IC DIP SOCKET 8POS GOLD

    Preci-Dip

    3,069
    116-83-308-41-009101

    规格书

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    10-2513-10T

    10-2513-10T

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    2,291
    10-2513-10T

    规格书

    Lo-PRO®file, 513 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    09-0518-11

    09-0518-11

    CONN SOCKET SIP 9POS GOLD

    Aries Electronics

    1,249
    09-0518-11

    规格书

    518 Bulk Active SIP 9 (1 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    11-0518-10H

    11-0518-10H

    CONN SOCKET SIP 11POS GOLD

    Aries Electronics

    2,373
    11-0518-10H

    规格书

    518 Bulk Active SIP 11 (1 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
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