您好,欢迎来到双灏业商城!
    双灏业商城0755-83179664

    IC 插座

    制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

    全部重置
    应用所有
    结果:
    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    114-87-428-41-117101

    114-87-428-41-117101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    2,824
    114-87-428-41-117101

    规格书

    114 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-87-318-41-105191

    110-87-318-41-105191

    CONN IC DIP SOCKET 18POS GOLD

    Preci-Dip

    3,182
    110-87-318-41-105191

    规格书

    110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    614-83-314-31-012101

    614-83-314-31-012101

    CONN IC DIP SOCKET 14POS GOLD

    Preci-Dip

    2,439
    614-83-314-31-012101

    规格书

    614 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    115-87-328-41-003101

    115-87-328-41-003101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    1,647
    115-87-328-41-003101

    规格书

    115 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    540-88-028-24-008

    540-88-028-24-008

    CONN SOCKET PLCC 28POS TIN

    Preci-Dip

    3,921
    540-88-028-24-008

    规格书

    540 Bulk Active PLCC 28 (4 x 7) 0.050" (1.27mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polyphenylene Sulfide (PPS) -
    121-83-312-41-001101

    121-83-312-41-001101

    CONN IC DIP SOCKET 12POS GOLD

    Preci-Dip

    1,665
    121-83-312-41-001101

    规格书

    121 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    115-83-420-41-001101

    115-83-420-41-001101

    CONN IC DIP SOCKET 20POS GOLD

    Preci-Dip

    3,560
    115-83-420-41-001101

    规格书

    115 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-87-037-10-061101

    510-87-037-10-061101

    CONN SOCKET PGA 37POS GOLD

    Preci-Dip

    3,806
    510-87-037-10-061101

    规格书

    510 Bulk Active PGA 37 (10 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    HLS-0110-TT-2

    HLS-0110-TT-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    3,353
    HLS-0110-TT-2

    规格书

    HLS Tube Active SIP 10 (1 x 10) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - - Thermoplastic -55°C ~ 140°C
    08-2513-11

    08-2513-11

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    4,344
    08-2513-11

    规格书

    Lo-PRO®file, 513 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    09-0513-10H

    09-0513-10H

    CONN SOCKET SIP 9POS GOLD

    Aries Electronics

    2,663
    09-0513-10H

    规格书

    0513 Bulk Active SIP 9 (1 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    07-0518-11H

    07-0518-11H

    CONN SOCKET SIP 7POS GOLD

    Aries Electronics

    3,281
    07-0518-11H

    规格书

    518 Bulk Active SIP 7 (1 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    15-0518-10H

    15-0518-10H

    CONN SOCKET SIP 15POS GOLD

    Aries Electronics

    3,420
    15-0518-10H

    规格书

    518 Bulk Active SIP 15 (1 x 15) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    16-0518-10T

    16-0518-10T

    CONN SOCKET SIP 16POS GOLD

    Aries Electronics

    2,256
    16-0518-10T

    规格书

    518 Bulk Active SIP 16 (1 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    18-1518-10

    18-1518-10

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    4,020
    18-1518-10

    规格书

    518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    540-88-032-24-008

    540-88-032-24-008

    CONN SOCKET PLCC 32POS TIN

    Preci-Dip

    4,334
    540-88-032-24-008

    规格书

    540 Bulk Active PLCC 32 (4 x 8) 0.050" (1.27mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polyphenylene Sulfide (PPS) -
    10-3513-10T

    10-3513-10T

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    4,611
    10-3513-10T

    规格书

    Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    AR28-HZL/07-TT

    AR28-HZL/07-TT

    CONN IC DIP SOCKET 28POS GOLD

    Assmann WSW Components

    1,051
    AR28-HZL/07-TT

    规格书

    - Bag Obsolete DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
    117-83-620-41-005101

    117-83-620-41-005101

    CONN IC DIP SOCKET 20POS GOLD

    Preci-Dip

    2,424
    117-83-620-41-005101

    规格书

    117 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 20 (2 x 10) 0.070" (1.78mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    D0816-01

    D0816-01

    CONN IC DIP SOCKET 16POS GOLD

    Harwin Inc.

    3,966
    D0816-01

    规格书

    D0 Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 196.9µin (5.00µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    联系我们 获取更多产品资讯!
    双灏业商城

    首页

    双灏业商城

    产品中心

    双灏业商城

    电话

    双灏业商城

    会员中心

    品种齐全,轻松购物
    品种齐全,轻松购物
    多仓直发,极速配送
    多仓直发,极速配送
    正品行货,精致服务
    正品行货,精致服务
    天天低价,畅选无忧
    天天低价,畅选无忧
    版权所有©2025 双灏业商城