您好,欢迎来到双灏业商城!
    双灏业商城0755-83179664

    IC 插座

    制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

    全部重置
    应用所有
    结果:
    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    116-87-322-41-006101

    116-87-322-41-006101

    CONN IC DIP SOCKET 22POS GOLD

    Preci-Dip

    3,192
    116-87-322-41-006101

    规格书

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    2-640361-2

    2-640361-2

    CONN IC DIP SOCKET 24POS GOLD

    TE Connectivity AMP Connectors

    4,336
    2-640361-2

    规格书

    Diplomate DL Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Thermoplastic -55°C ~ 125°C
    HLS-0104-T-15

    HLS-0104-T-15

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    3,105
    HLS-0104-T-15

    规格书

    HLS Tube Active SIP 4 (1 x 4) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    SMPX-68LCC-N

    SMPX-68LCC-N

    SMT PLCC SOCKET 68P NON POLARISE

    Kycon, Inc.

    1,519
    SMPX-68LCC-N

    规格书

    SMPX Tube Active PLCC 68 (4 x 17) 0.050" (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin - Phosphor Bronze Thermoplastic, Glass Filled -50°C ~ 105°C
    614-87-324-41-001101

    614-87-324-41-001101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    1,280
    614-87-324-41-001101

    规格书

    614 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    AR 24-HZL/07-TT

    AR 24-HZL/07-TT

    CONN IC DIP SOCKET 24POS GOLD

    Assmann WSW Components

    4,844
    AR 24-HZL/07-TT

    规格书

    - Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
    D01-9951042

    D01-9951042

    CONN SOCKET SIP 10POS GOLD

    Harwin Inc.

    3,381
    D01-9951042

    规格书

    D01-995 Tube Obsolete SIP 10 (1 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Tin 196.9µin (5.00µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    114-87-628-41-134161

    114-87-628-41-134161

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    1,373
    114-87-628-41-134161

    规格书

    114 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-87-320-41-006101

    116-87-320-41-006101

    CONN IC DIP SOCKET 20POS GOLD

    Preci-Dip

    3,721
    116-87-320-41-006101

    规格书

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-83-312-41-007101

    116-83-312-41-007101

    CONN IC DIP SOCKET 12POS GOLD

    Preci-Dip

    1,485
    116-83-312-41-007101

    规格书

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    SIP050-1X22-157B

    SIP050-1X22-157B

    1X22-157B-SIP SOCKET 22 CTS

    Amphenol ICC (FCI)

    3,266
    SIP050-1X22-157B

    规格书

    SIP050-1x Bulk Active SIP 22 (1 x 22) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
    A40-LCG-T-R

    A40-LCG-T-R

    CONN IC DIP SOCKET 40POS GOLD

    Assmann WSW Components

    2,875
    A40-LCG-T-R

    规格书

    - Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold - - Through Hole Open Frame Solder 0.100" (2.54mm) Gold - - Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
    05-0513-11H

    05-0513-11H

    CONN SOCKET SIP 5POS GOLD

    Aries Electronics

    3,576
    05-0513-11H

    规格书

    0513 Bulk Active SIP 5 (1 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    06-0513-11

    06-0513-11

    CONN SOCKET SIP 6POS GOLD

    Aries Electronics

    4,254
    06-0513-11

    规格书

    0513 Bulk Active SIP 6 (1 x 6) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    07-0513-10H

    07-0513-10H

    CONN SOCKET SIP 7POS GOLD

    Aries Electronics

    1,545
    07-0513-10H

    规格书

    0513 Bulk Active SIP 7 (1 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    114-83-320-41-117101

    114-83-320-41-117101

    CONN IC DIP SOCKET 20POS GOLD

    Preci-Dip

    1,963
    114-83-320-41-117101

    规格书

    114 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    9-1437535-4

    9-1437535-4

    CONN IC DIP SOCKET 14POS GOLD

    TE Connectivity AMP Connectors

    4,181
    9-1437535-4

    规格书

    500 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper - -55°C ~ 125°C
    116-87-314-41-009101

    116-87-314-41-009101

    CONN IC DIP SOCKET 14POS GOLD

    Preci-Dip

    2,017
    116-87-314-41-009101

    规格书

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-87-320-41-003101

    116-87-320-41-003101

    CONN IC DIP SOCKET 20POS GOLD

    Preci-Dip

    4,540
    116-87-320-41-003101

    规格书

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICO-308-ZSTT

    ICO-308-ZSTT

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    3,651
    ICO-308-ZSTT

    规格书

    ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
    联系我们 获取更多产品资讯!
    双灏业商城

    首页

    双灏业商城

    产品中心

    双灏业商城

    电话

    双灏业商城

    会员中心

    品种齐全,轻松购物
    品种齐全,轻松购物
    多仓直发,极速配送
    多仓直发,极速配送
    正品行货,精致服务
    正品行货,精致服务
    天天低价,畅选无忧
    天天低价,畅选无忧
    版权所有©2025 双灏业商城