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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    116-83-610-41-008101

    116-83-610-41-008101

    CONN IC DIP SOCKET 10POS GOLD

    Preci-Dip

    3,471
    116-83-610-41-008101

    规格书

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    614-83-316-41-001101

    614-83-316-41-001101

    CONN IC DIP SOCKET 16POS GOLD

    Preci-Dip

    1,856
    614-83-316-41-001101

    规格书

    614 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    115-87-432-41-001101

    115-87-432-41-001101

    CONN IC DIP SOCKET 32POS GOLD

    Preci-Dip

    1,869
    115-87-432-41-001101

    规格书

    115 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    DIP050-628-157B

    DIP050-628-157B

    DIP SOCKET 28 CTS

    Amphenol ICC (FCI)

    2,777
    DIP050-628-157B

    规格书

    - Bag Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
    110-83-424-41-001101

    110-83-424-41-001101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    3,279
    110-83-424-41-001101

    规格书

    110 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-83-316-41-105161

    110-83-316-41-105161

    CONN IC DIP SOCKET 16POS GOLD

    Preci-Dip

    3,062
    110-83-316-41-105161

    规格书

    110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    346-43-104-41-013000

    346-43-104-41-013000

    CONN SOCKET SIP 4POS GOLD

    Mill-Max Manufacturing Corp.

    4,475
    346-43-104-41-013000

    规格书

    346 Tube Active SIP 4 (1 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-87-624-41-105101

    110-87-624-41-105101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    4,191
    110-87-624-41-105101

    规格书

    110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-83-312-41-002101

    116-83-312-41-002101

    CONN IC DIP SOCKET 12POS GOLD

    Preci-Dip

    2,528
    116-83-312-41-002101

    规格书

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    115-83-320-41-003101

    115-83-320-41-003101

    CONN IC DIP SOCKET 20POS GOLD

    Preci-Dip

    3,070
    115-83-320-41-003101

    规格书

    115 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    115-83-420-41-003101

    115-83-420-41-003101

    CONN IC DIP SOCKET 20POS GOLD

    Preci-Dip

    2,765
    115-83-420-41-003101

    规格书

    115 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    818-AG11D-ES

    818-AG11D-ES

    CONN IC DIP SOCKET 18POS GOLD

    TE Connectivity AMP Connectors

    3,616
    818-AG11D-ES

    规格书

    800 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead - Copper Alloy Polyester -55°C ~ 105°C
    SIP1X20-041B

    SIP1X20-041B

    SIP1X20-041B-SIP SOCKET 20 CTS

    Amphenol ICC (FCI)

    4,786
    SIP1X20-041B

    规格书

    SIP1x Bulk Active SIP 20 (1 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
    110-87-312-41-105191

    110-87-312-41-105191

    CONN IC DIP SOCKET 12POS GOLD

    Preci-Dip

    4,083
    110-87-312-41-105191

    规格书

    110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-87-632-41-605101

    110-87-632-41-605101

    CONN IC DIP SOCKET 32POS GOLD

    Preci-Dip

    1,056
    110-87-632-41-605101

    规格书

    110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    15-0513-10T

    15-0513-10T

    CONN SOCKET SIP 15POS GOLD

    Aries Electronics

    4,034
    15-0513-10T

    规格书

    0513 Bulk Active SIP 15 (1 x 15) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    299-83-306-10-001101

    299-83-306-10-001101

    CONN IC DIP SOCKET 6POS GOLD

    Preci-Dip

    4,000
    299-83-306-10-001101

    规格书

    299 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-83-610-41-001101

    116-83-610-41-001101

    CONN IC DIP SOCKET 10POS GOLD

    Preci-Dip

    2,900
    116-83-610-41-001101

    规格书

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    1-1825094-6

    1-1825094-6

    CONN IC DIP SOCKET 20POS GOLD

    TE Connectivity AMP Connectors

    1,501
    1-1825094-6

    规格书

    Diplomate DL Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Thermoplastic, Glass Filled -55°C ~ 125°C
    110-83-322-41-005101

    110-83-322-41-005101

    CONN IC DIP SOCKET 22POS GOLD

    Preci-Dip

    1,803
    110-83-322-41-005101

    规格书

    110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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