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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    116-87-422-41-009101

    116-87-422-41-009101

    CONN IC DIP SOCKET 22POS GOLD

    Preci-Dip

    2,530
    116-87-422-41-009101

    规格书

    116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    514-AG12D-LF

    514-AG12D-LF

    CONN IC DIP SOCKET 14POS TIN

    TE Connectivity AMP Connectors

    2,528
    514-AG12D-LF

    规格书

    500 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 105°C
    22-3513-10

    22-3513-10

    CONN IC DIP SOCKET 22POS GOLD

    Aries Electronics

    4,047
    22-3513-10

    规格书

    Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    116-83-210-41-013101

    116-83-210-41-013101

    CONN IC DIP SOCKET 10POS GOLD

    Preci-Dip

    3,652
    116-83-210-41-013101

    规格书

    116 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-83-640-41-001151

    110-83-640-41-001151

    CONN IC DIP SOCKET 40POS GOLD

    Preci-Dip

    1,122
    110-83-640-41-001151

    规格书

    110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame, No Center Bar Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-83-328-41-006101

    116-83-328-41-006101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    1,652
    116-83-328-41-006101

    规格书

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    24-0513-10

    24-0513-10

    CONN SOCKET SIP 24POS GOLD

    Aries Electronics

    3,894
    24-0513-10

    规格书

    0513 Bulk Active SIP 24 (1 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    HLS-0203-G-11

    HLS-0203-G-11

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    1,517
    HLS-0203-G-11

    规格书

    HLS Tube Active SIP 6 (2 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    116-83-420-41-008101

    116-83-420-41-008101

    CONN IC DIP SOCKET 20POS GOLD

    Preci-Dip

    2,904
    116-83-420-41-008101

    规格书

    116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    AR 28-HZL/01-7-TT

    AR 28-HZL/01-7-TT

    SOCKET

    Assmann WSW Components

    4,967
    AR 28-HZL/01-7-TT

    规格书

    AR Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    510-87-072-11-001101

    510-87-072-11-001101

    CONN SOCKET PGA 72POS GOLD

    Preci-Dip

    3,126
    510-87-072-11-001101

    规格书

    510 Bulk Active PGA 72 (11 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-87-072-11-041101

    510-87-072-11-041101

    CONN SOCKET PGA 72POS GOLD

    Preci-Dip

    3,730
    510-87-072-11-041101

    规格书

    510 Bulk Active PGA 72 (11 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-87-072-11-061101

    510-87-072-11-061101

    CONN SOCKET PGA 72POS GOLD

    Preci-Dip

    4,270
    510-87-072-11-061101

    规格书

    510 Bulk Active PGA 72 (11 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    PLCC-032-TM-N-TR

    PLCC-032-TM-N-TR

    CONN SOCKET PLCC 32POS TIN

    Samtec Inc.

    1,162
    PLCC-032-TM-N-TR

    规格书

    PLCC Tape & Reel (TR) Obsolete PLCC 32 (2 x 7, 2 x 9) 0.050" (1.27mm) Tin - Beryllium Copper Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    A-ICS-254-20-TT50

    A-ICS-254-20-TT50

    IC SOCKET, MACHINED PIN, 7.62MM,

    Assmann WSW Components

    4,002
    A-ICS-254-20-TT50

    规格书

    - Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 0.100" (2.54mm) Nickel 78.7µin (2.00µm) Beryllium Copper Through Hole, Right Angle Open Frame Solder 0.100" (2.54mm) Tin 78.7µin (2.00µm) Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    ICO-324-STT

    ICO-324-STT

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    3,523
    ICO-324-STT

    规格书

    ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
    ICO-624-STT

    ICO-624-STT

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    4,611
    ICO-624-STT

    规格书

    ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
    12-1518-00

    12-1518-00

    CONN IC DIP SOCKET 12POS GOLD

    Aries Electronics

    3,485
    12-1518-00

    规格书

    518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    25-0518-10

    25-0518-10

    CONN SOCKET SIP 25POS GOLD

    Aries Electronics

    2,594
    25-0518-10

    规格书

    518 Bulk Active SIP 25 (1 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    116-83-310-41-013101

    116-83-310-41-013101

    CONN IC DIP SOCKET 10POS GOLD

    Preci-Dip

    1,513
    116-83-310-41-013101

    规格书

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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