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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    C8120-04

    C8120-04

    CONN IC DIP SOCKET 20POS TIN

    Aries Electronics

    1,669
    C8120-04

    规格书

    Edge-Grip™, C81 Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    612-83-428-41-001101

    612-83-428-41-001101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    2,124
    612-83-428-41-001101

    规格书

    612 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-83-628-41-105161

    110-83-628-41-105161

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    4,612
    110-83-628-41-105161

    规格书

    110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-87-642-41-105101

    110-87-642-41-105101

    CONN IC DIP SOCKET 42POS GOLD

    Preci-Dip

    3,690
    110-87-642-41-105101

    规格书

    110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    117-87-656-41-005101

    117-87-656-41-005101

    CONN IC DIP SOCKET 56POS GOLD

    Preci-Dip

    3,616
    117-87-656-41-005101

    规格书

    117 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 56 (2 x 28) 0.070" (1.78mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    518-AG11D-ES

    518-AG11D-ES

    CONN IC DIP SOCKET 18POS GOLD

    TE Connectivity AMP Connectors

    2,009
    518-AG11D-ES

    规格书

    500 Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 25.0µin (0.63µm) Beryllium Copper Polyester -55°C ~ 125°C
    07-0503-20

    07-0503-20

    CONN SOCKET SIP 7POS GOLD

    Aries Electronics

    2,196
    07-0503-20

    规格书

    0503 Bulk Active SIP 7 (1 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled -
    07-0503-30

    07-0503-30

    CONN SOCKET SIP 7POS GOLD

    Aries Electronics

    3,954
    07-0503-30

    规格书

    0503 Bulk Active SIP 7 (1 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled -
    14-0518-11H

    14-0518-11H

    CONN SOCKET SIP 14POS GOLD

    Aries Electronics

    4,182
    14-0518-11H

    规格书

    518 Bulk Active SIP 14 (1 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    14-1518-11H

    14-1518-11H

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    4,047
    14-1518-11H

    规格书

    518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    35-0518-10

    35-0518-10

    CONN SOCKET SIP 35POS GOLD

    Aries Electronics

    2,692
    35-0518-10

    规格书

    518 Bulk Active SIP 35 (1 x 35) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    121-83-420-41-001101

    121-83-420-41-001101

    CONN IC DIP SOCKET 20POS GOLD

    Preci-Dip

    4,320
    121-83-420-41-001101

    规格书

    121 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-87-318-41-004101

    116-87-318-41-004101

    CONN IC DIP SOCKET 18POS GOLD

    Preci-Dip

    4,524
    116-87-318-41-004101

    规格书

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-83-628-41-006101

    116-83-628-41-006101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    4,658
    116-83-628-41-006101

    规格书

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    612-87-640-41-001101

    612-87-640-41-001101

    CONN IC DIP SOCKET 40POS GOLD

    Preci-Dip

    4,722
    612-87-640-41-001101

    规格书

    612 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-83-322-41-007101

    116-83-322-41-007101

    CONN IC DIP SOCKET 22POS GOLD

    Preci-Dip

    4,633
    116-83-322-41-007101

    规格书

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-87-084-10-001101

    510-87-084-10-001101

    CONN SOCKET PGA 84POS GOLD

    Preci-Dip

    4,002
    510-87-084-10-001101

    规格书

    510 Bulk Active PGA 84 (10 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-87-084-10-031101

    510-87-084-10-031101

    CONN SOCKET PGA 84POS GOLD

    Preci-Dip

    1,112
    510-87-084-10-031101

    规格书

    510 Bulk Active PGA 84 (10 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    HLS-0112-S-2

    HLS-0112-S-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    4,555
    HLS-0112-S-2

    规格书

    HLS Tube Active SIP 12 (1 x 12) 0.100" (2.54mm) Gold - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    146-83-320-41-036101

    146-83-320-41-036101

    CONN IC DIP SOCKET 20POS GOLD

    Preci-Dip

    2,440
    146-83-320-41-036101

    规格书

    146 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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