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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    13-0518-00

    13-0518-00

    CONN SOCKET SIP 13POS GOLD

    Aries Electronics

    4,293
    13-0518-00

    规格书

    518 Bulk Active SIP 13 (1 x 13) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    26-0518-10

    26-0518-10

    CONN SOCKET SIP 26POS GOLD

    Aries Electronics

    3,573
    26-0518-10

    规格书

    518 Bulk Active SIP 26 (1 x 26) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    299-87-314-10-001101

    299-87-314-10-001101

    CONN IC DIP SOCKET 14POS GOLD

    Preci-Dip

    3,990
    299-87-314-10-001101

    规格书

    299 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    28-6513-10T

    28-6513-10T

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    4,228
    28-6513-10T

    规格书

    Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    20-4518-11

    20-4518-11

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    4,171
    20-4518-11

    规格书

    518 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    36-0518-10

    36-0518-10

    CONN SOCKET SIP 36POS GOLD

    Aries Electronics

    3,173
    36-0518-10

    规格书

    518 Bulk Active SIP 36 (1 x 36) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    36-1518-10

    36-1518-10

    CONN IC DIP SOCKET 36POS GOLD

    Aries Electronics

    2,352
    36-1518-10

    规格书

    518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    10-6511-10

    10-6511-10

    SOCKET 10 POS SOLDER TAIL TIN

    Aries Electronics

    1,239
    10-6511-10

    规格书

    511 - Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    ICF-624-TM-O-TR

    ICF-624-TM-O-TR

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    2,143
    ICF-624-TM-O-TR

    规格书

    ICF Tape & Reel (TR) Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    110-87-950-41-001101

    110-87-950-41-001101

    CONN IC DIP SOCKET 50POS GOLD

    Preci-Dip

    1,997
    110-87-950-41-001101

    规格书

    110 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    08-0511-10

    08-0511-10

    CONN SOCKET SIP 8POS TIN

    Aries Electronics

    2,556
    08-0511-10

    规格书

    511 Bulk Active SIP 8 (1 x 8) 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole - Solder 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    110-83-642-41-001101

    110-83-642-41-001101

    CONN IC DIP SOCKET 42POS GOLD

    Preci-Dip

    1,791
    110-83-642-41-001101

    规格书

    110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    643655-8

    643655-8

    CONN SOCKET SIP 23POS TIN

    TE Connectivity AMP Connectors

    4,289
    643655-8

    规格书

    Diplomate DL Tray Obsolete SIP 23 (1 x 23) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Thermoplastic, Glass Filled -55°C ~ 105°C
    116-87-428-41-002101

    116-87-428-41-002101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    3,069
    116-87-428-41-002101

    规格书

    116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    AR 42-HZL/07-TT

    AR 42-HZL/07-TT

    SOCKET

    Assmann WSW Components

    1,480
    AR 42-HZL/07-TT

    规格书

    AR Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    116-87-324-41-001101

    116-87-324-41-001101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    1,195
    116-87-324-41-001101

    规格书

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    HLS-0108-T-30

    HLS-0108-T-30

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    4,532
    HLS-0108-T-30

    规格书

    HLS Tube Active SIP 8 (1 x 8) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    D0822-01

    D0822-01

    CONN IC DIP SOCKET 22POS GOLD

    Harwin Inc.

    2,079
    D0822-01

    规格书

    D0 Bulk Obsolete DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 196.9µin (5.00µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    33-0518-10T

    33-0518-10T

    CONN SOCKET SIP 33POS GOLD

    Aries Electronics

    3,796
    33-0518-10T

    规格书

    518 Bulk Active SIP 33 (1 x 33) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    117-87-652-41-005101

    117-87-652-41-005101

    CONN IC DIP SOCKET 52POS GOLD

    Preci-Dip

    3,747
    117-87-652-41-005101

    规格书

    117 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.070" (1.78mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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