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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    20-3513-11

    20-3513-11

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    3,156
    20-3513-11

    规格书

    Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    110-83-950-41-001101

    110-83-950-41-001101

    CONN IC DIP SOCKET 50POS GOLD

    Preci-Dip

    1,534
    110-83-950-41-001101

    规格书

    110 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    117-87-642-41-105101

    117-87-642-41-105101

    CONN IC DIP SOCKET 42POS GOLD

    Preci-Dip

    1,202
    117-87-642-41-105101

    规格书

    117 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.070" (1.78mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    21-0518-00

    21-0518-00

    CONN SOCKET SIP 21POS GOLD

    Aries Electronics

    4,409
    21-0518-00

    规格书

    518 Bulk Active SIP 21 (1 x 21) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    117-87-428-41-105101

    117-87-428-41-105101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    1,440
    117-87-428-41-105101

    规格书

    117 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.070" (1.78mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-87-064-01-505101

    110-87-064-01-505101

    CONN IC DIP SOCKET 64POS GOLD

    Preci-Dip

    4,974
    110-87-064-01-505101

    规格书

    110 Bulk Active - 64 (2 x 32) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-83-632-41-003101

    116-83-632-41-003101

    CONN IC DIP SOCKET 32POS GOLD

    Preci-Dip

    3,551
    116-83-632-41-003101

    规格书

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    XR2A-1601-N

    XR2A-1601-N

    IC CONNECTOR

    Omron Electronics Inc-EMC Div

    1,835
    XR2A-1601-N

    规格书

    * Bulk Active - - - - - - - - - - - - - - -
    510-87-100-15-001101

    510-87-100-15-001101

    CONN SOCKET PGA 100POS GOLD

    Preci-Dip

    1,520
    510-87-100-15-001101

    规格书

    510 Bulk Active PGA 100 (15 x 15) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-87-100-15-101101

    510-87-100-15-101101

    CONN SOCKET PGA 100POS GOLD

    Preci-Dip

    1,096
    510-87-100-15-101101

    规格书

    510 Bulk Active PGA 100 (15 x 15) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-87-648-41-006101

    116-87-648-41-006101

    CONN IC DIP SOCKET 48POS GOLD

    Preci-Dip

    3,920
    116-87-648-41-006101

    规格书

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    916715-3

    916715-3

    CONN SOCKET PGA ZIF 321POS GOLD

    TE Connectivity AMP Connectors

    3,312
    916715-3

    规格书

    - Tray Obsolete PGA, ZIF (ZIP) 321 (19 x 19) 0.100" (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Liquid Crystal Polymer (LCP) -
    37-0518-10H

    37-0518-10H

    CONN SOCKET SIP 37POS GOLD

    Aries Electronics

    3,800
    37-0518-10H

    规格书

    518 Bulk Active SIP 37 (1 x 37) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    HLS-0108-T-32

    HLS-0108-T-32

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    4,064
    HLS-0108-T-32

    规格书

    HLS Tube Active SIP 8 (1 x 8) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    16-3518-10H

    16-3518-10H

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    3,923
    16-3518-10H

    规格书

    518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    27-0518-10H

    27-0518-10H

    CONN SOCKET SIP 27POS GOLD

    Aries Electronics

    2,421
    27-0518-10H

    规格书

    518 Bulk Active SIP 27 (1 x 27) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    08-822-90T

    08-822-90T

    CONN IC DIP SOCKET 8POS TIN

    Aries Electronics

    3,339
    08-822-90T

    规格书

    Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
    612-87-650-41-001101

    612-87-650-41-001101

    CONN IC DIP SOCKET 50POS GOLD

    Preci-Dip

    4,432
    612-87-650-41-001101

    规格书

    612 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICA-314-WTT-2

    ICA-314-WTT-2

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    3,141
    ICA-314-WTT-2

    规格书

    ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
    3-1437536-4

    3-1437536-4

    CONN IC DIP SOCKET 22POS GOLD

    TE Connectivity AMP Connectors

    1,411
    3-1437536-4

    规格书

    500 Tube Obsolete DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) - - Brass - -55°C ~ 125°C
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