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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    814-AG10D-ES

    814-AG10D-ES

    CONN IC DIP SOCKET 14POS GOLD

    TE Connectivity AMP Connectors

    3,223
    814-AG10D-ES

    规格书

    800 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) - - Copper Alloy Polyester -55°C ~ 105°C
    123-83-428-41-001101

    123-83-428-41-001101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    1,045
    123-83-428-41-001101

    规格书

    123 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    PLCC-032-T-N-TR

    PLCC-032-T-N-TR

    CONN SOCKET PLCC 32POS TIN

    Samtec Inc.

    2,556
    PLCC-032-T-N-TR

    规格书

    PLCC Tape & Reel (TR) Obsolete PLCC 32 (2 x 7, 2 x 9) 0.050" (1.27mm) Tin - Beryllium Copper Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    116-87-322-41-004101

    116-87-322-41-004101

    CONN IC DIP SOCKET 22POS GOLD

    Preci-Dip

    4,647
    116-87-322-41-004101

    规格书

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-87-328-41-009101

    116-87-328-41-009101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    2,569
    116-87-328-41-009101

    规格书

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-83-632-41-105191

    110-83-632-41-105191

    CONN IC DIP SOCKET 32POS GOLD

    Preci-Dip

    1,903
    110-83-632-41-105191

    规格书

    110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    AR 50-HZL/07-TT

    AR 50-HZL/07-TT

    SOCKET

    Assmann WSW Components

    4,808
    AR 50-HZL/07-TT

    规格书

    AR Bulk Active DIP, 0.9" (22.86mm) Row Spacing 50 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    ICO-318-CTT

    ICO-318-CTT

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    1,331
    ICO-318-CTT

    规格书

    ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
    916788-1

    916788-1

    CONN SOCKET PGA ZIF 462POS TIN

    TE Connectivity AMP Connectors

    3,233
    916788-1

    规格书

    - Tray Obsolete PGA, ZIF (ZIP) 462 (19 x 19) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Liquid Crystal Polymer (LCP) -
    XR2A-1425

    XR2A-1425

    CONN IC DIP SOCKET 14POS GOLD

    Omron Electronics Inc-EMC Div

    3,172
    XR2A-1425

    规格书

    XR2 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 125°C
    C9118-00

    C9118-00

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    1,162
    C9118-00

    规格书

    Edge-Grip™, C91 Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    20-9513-10

    20-9513-10

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    3,293
    20-9513-10

    规格书

    Lo-PRO®file, 513 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    30-6513-10T

    30-6513-10T

    CONN IC DIP SOCKET 30POS GOLD

    Aries Electronics

    3,979
    30-6513-10T

    规格书

    Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 30 (2 x 15) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    22-0513-10H

    22-0513-10H

    CONN SOCKET SIP 22POS GOLD

    Aries Electronics

    1,016
    22-0513-10H

    规格书

    0513 Bulk Active SIP 22 (1 x 22) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    40-1518-10T

    40-1518-10T

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    4,146
    40-1518-10T

    规格书

    518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    ICO-308-SGG-L

    ICO-308-SGG-L

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    4,680
    ICO-308-SGG-L

    规格书

    ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    ICA-308-SGG-L

    ICA-308-SGG-L

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    1,962
    ICA-308-SGG-L

    规格书

    ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    ICA-308-ZWGT-2

    ICA-308-ZWGT-2

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    2,771
    ICA-308-ZWGT-2

    规格书

    ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    HLS-0112-T-22

    HLS-0112-T-22

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    2,971
    HLS-0112-T-22

    规格书

    HLS Tube Active SIP 12 (1 x 12) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    116-83-424-41-009101

    116-83-424-41-009101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    1,542
    116-83-424-41-009101

    规格书

    116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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