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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    117-43-620-41-005000

    117-43-620-41-005000

    CONN IC DIP SOCKET 20POS GOLD

    Mill-Max Manufacturing Corp.

    1,148
    117-43-620-41-005000

    规格书

    117 Tube Active DIP, 0.6" (15.24mm) Row Spacing 20 (2 x 10) 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    APO-320-T-J

    APO-320-T-J

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    3,404
    APO-320-T-J

    规格书

    APO Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    APO-308-T-R

    APO-308-T-R

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    4,579
    APO-308-T-R

    规格书

    APO Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    30-0518-10T

    30-0518-10T

    CONN SOCKET SIP 30POS GOLD

    Aries Electronics

    3,684
    30-0518-10T

    规格书

    518 Bulk Active SIP 30 (1 x 30) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    HLS-0108-G-22

    HLS-0108-G-22

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    3,681
    HLS-0108-G-22

    规格书

    HLS Tube Active SIP 8 (1 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    110-83-652-41-001101

    110-83-652-41-001101

    CONN IC DIP SOCKET 52POS GOLD

    Preci-Dip

    2,355
    110-83-652-41-001101

    规格书

    110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    117-83-430-41-105101

    117-83-430-41-105101

    CONN IC DIP SOCKET 30POS GOLD

    Preci-Dip

    3,734
    117-83-430-41-105101

    规格书

    117 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 30 (2 x 15) 0.070" (1.78mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICA-628-ZSTT

    ICA-628-ZSTT

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    2,605
    ICA-628-ZSTT

    规格书

    ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
    ICO-308-ZNGT

    ICO-308-ZNGT

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    4,822
    ICO-308-ZNGT

    规格书

    ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    20-6513-11

    20-6513-11

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    3,296
    20-6513-11

    规格书

    Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    20-0513-11

    20-0513-11

    CONN SOCKET SIP 20POS GOLD

    Aries Electronics

    1,013
    20-0513-11

    规格书

    0513 Bulk Active SIP 20 (1 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    23-0513-10H

    23-0513-10H

    CONN SOCKET SIP 23POS GOLD

    Aries Electronics

    2,179
    23-0513-10H

    规格书

    0513 Bulk Active SIP 23 (1 x 23) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    20-4518-10M

    20-4518-10M

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    2,854
    20-4518-10M

    规格书

    518 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    38-0518-10H

    38-0518-10H

    CONN SOCKET SIP 38POS GOLD

    Aries Electronics

    2,736
    38-0518-10H

    规格书

    518 Bulk Active SIP 38 (1 x 38) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    38-1518-10H

    38-1518-10H

    CONN IC DIP SOCKET 38POS GOLD

    Aries Electronics

    4,117
    38-1518-10H

    规格书

    518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 38 (2 x 19) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    510-87-108-12-051101

    510-87-108-12-051101

    CONN SOCKET PGA 108POS GOLD

    Preci-Dip

    3,380
    510-87-108-12-051101

    规格书

    510 Bulk Active PGA 108 (12 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    HLS-0106-G-32

    HLS-0106-G-32

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    3,549
    HLS-0106-G-32

    规格书

    HLS Tube Active SIP 6 (1 x 6) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    116-87-632-41-007101

    116-87-632-41-007101

    CONN IC DIP SOCKET 32POS GOLD

    Preci-Dip

    2,603
    116-87-632-41-007101

    规格书

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    PLCC-052-T-N

    PLCC-052-T-N

    CONN SOCKET PLCC 52POS TIN

    Samtec Inc.

    1,370
    PLCC-052-T-N

    规格书

    PLCC Tube Obsolete PLCC 52 (4 x 13) 0.050" (1.27mm) Tin - Beryllium Copper Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    APA-320-T-J

    APA-320-T-J

    ADAPTER PLUG

    Samtec Inc.

    2,043
    APA-320-T-J

    规格书

    APA Tube Active - 20 (2 x 10) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
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