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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    38-3513-10

    38-3513-10

    CONN IC DIP SOCKET 38POS GOLD

    Aries Electronics

    3,289
    38-3513-10

    规格书

    Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 38 (2 x 19) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    29-0518-00

    29-0518-00

    CONN SOCKET SIP 29POS GOLD

    Aries Electronics

    4,279
    29-0518-00

    规格书

    518 Bulk Active SIP 29 (1 x 29) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    25-0518-11H

    25-0518-11H

    CONN SOCKET SIP 25POS GOLD

    Aries Electronics

    2,528
    25-0518-11H

    规格书

    518 Bulk Active SIP 25 (1 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    32-C212-10T

    32-C212-10T

    CONN IC DIP SOCKET 32POS TIN

    Aries Electronics

    2,804
    32-C212-10T

    规格书

    EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    8060-1G3

    8060-1G3

    CONN TRANSIST TO-5 3POS GOLD

    TE Connectivity AMP Connectors

    1,438
    8060-1G3

    规格书

    8060 Bulk Obsolete Transistor, TO-5 3 (Round) - Gold - Beryllium Copper Through Hole Closed Frame Solder - Gold - Beryllium Copper Polytetrafluoroethylene (PTFE) -55°C ~ 125°C
    ICO-314-SGG-L

    ICO-314-SGG-L

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    1,778
    ICO-314-SGG-L

    规格书

    ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    APO-314-T-T

    APO-314-T-T

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    3,576
    APO-314-T-T

    规格书

    APO Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    ICA-628-WTT-3

    ICA-628-WTT-3

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    3,546
    ICA-628-WTT-3

    规格书

    ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
    122-87-652-41-001101

    122-87-652-41-001101

    CONN IC DIP SOCKET 52POS GOLD

    Preci-Dip

    2,001
    122-87-652-41-001101

    规格书

    122 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    123-87-652-41-001101

    123-87-652-41-001101

    CONN IC DIP SOCKET 52POS GOLD

    Preci-Dip

    2,371
    123-87-652-41-001101

    规格书

    123 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    23-0513-11H

    23-0513-11H

    CONN SOCKET SIP 23POS GOLD

    Aries Electronics

    4,849
    23-0513-11H

    规格书

    0513 Bulk Active SIP 23 (1 x 23) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    522-AG10D

    522-AG10D

    CONN IC DIP SOCKET 22POS GOLD

    TE Connectivity AMP Connectors

    4,135
    522-AG10D

    规格书

    500 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold - Copper Alloy Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Copper Alloy - -55°C ~ 125°C
    116-83-642-41-007101

    116-83-642-41-007101

    CONN IC DIP SOCKET 42POS GOLD

    Preci-Dip

    1,128
    116-83-642-41-007101

    规格书

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    7-1437532-1

    7-1437532-1

    CONN IC DIP SOCKET 36POS GOLD

    TE Connectivity AMP Connectors

    4,237
    7-1437532-1

    规格书

    500 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Polyester -55°C ~ 125°C
    22-4513-10H

    22-4513-10H

    CONN IC DIP SOCKET 22POS GOLD

    Aries Electronics

    4,799
    22-4513-10H

    规格书

    Lo-PRO®file, 513 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    08-81000-310C

    08-81000-310C

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    2,283
    08-81000-310C

    规格书

    8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    08-81000-610C

    08-81000-610C

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    4,022
    08-81000-610C

    规格书

    8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    08-81250-310C

    08-81250-310C

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    4,260
    08-81250-310C

    规格书

    8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    08-8240-310C

    08-8240-310C

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    4,236
    08-8240-310C

    规格书

    8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    08-8240-610C

    08-8240-610C

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    3,398
    08-8240-610C

    规格书

    8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
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