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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    08-8900-310C

    08-8900-310C

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    2,868
    08-8900-310C

    规格书

    8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    08-8937-610C

    08-8937-610C

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    1,494
    08-8937-610C

    规格书

    8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    28-6513-11

    28-6513-11

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    1,865
    28-6513-11

    规格书

    Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    14-3518-10E

    14-3518-10E

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    3,845
    14-3518-10E

    规格书

    518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    116-83-650-41-006101

    116-83-650-41-006101

    CONN IC DIP SOCKET 50POS GOLD

    Preci-Dip

    4,631
    116-83-650-41-006101

    规格书

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    8114LB603

    8114LB603

    THM,11692 REV J

    Boyd Laconia, LLC

    2,619
    8114LB603

    规格书

    - Bulk Active - - - - - - - - - - - - - - -
    117-87-668-41-105101

    117-87-668-41-105101

    CONN IC DIP SOCKET 68POS GOLD

    Preci-Dip

    2,202
    117-87-668-41-105101

    规格书

    117 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 68 (2 x 34) 0.070" (1.78mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICA-308-WGG-3

    ICA-308-WGG-3

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    2,156
    ICA-308-WGG-3

    规格书

    ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    ICA-624-ZSST

    ICA-624-ZSST

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    3,173
    ICA-624-ZSST

    规格书

    ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 125°C
    HLS-0314-TT-2

    HLS-0314-TT-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    4,397
    HLS-0314-TT-2

    规格书

    HLS Tube Active SIP 42 (3 x 14) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - - Thermoplastic -55°C ~ 140°C
    08-6501-21

    08-6501-21

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    3,469
    08-6501-21

    规格书

    501 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    116-87-650-41-007101

    116-87-650-41-007101

    CONN IC DIP SOCKET 50POS GOLD

    Preci-Dip

    3,152
    116-87-650-41-007101

    规格书

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    346-93-119-41-013000

    346-93-119-41-013000

    CONN SOCKET SIP 19POS GOLD

    Mill-Max Manufacturing Corp.

    4,355
    346-93-119-41-013000

    规格书

    346 Bulk Active SIP 19 (1 x 19) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    346-43-119-41-013000

    346-43-119-41-013000

    CONN SOCKET SIP 19POS GOLD

    Mill-Max Manufacturing Corp.

    3,318
    346-43-119-41-013000

    规格书

    346 Bulk Active SIP 19 (1 x 19) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    ICF-328-S-O-TR

    ICF-328-S-O-TR

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    2,526
    ICF-328-S-O-TR

    规格书

    ICF Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    08-6501-31

    08-6501-31

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    1,676
    08-6501-31

    规格书

    501 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    08-0508-21

    08-0508-21

    CONN SOCKET SIP 8POS GOLD

    Aries Electronics

    3,802
    08-0508-21

    规格书

    508 Bulk Active SIP 8 (1 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    08-0508-31

    08-0508-31

    CONN SOCKET SIP 8POS GOLD

    Aries Electronics

    4,982
    08-0508-31

    规格书

    508 Bulk Active SIP 8 (1 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    08-1508-21

    08-1508-21

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    4,503
    08-1508-21

    规格书

    508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    08-1508-31

    08-1508-31

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    2,573
    08-1508-31

    规格书

    508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
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