您好,欢迎来到双灏业商城!
    双灏业商城0755-83179664

    IC 插座

    制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

    全部重置
    应用所有
    结果:
    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    346-93-121-41-013000

    346-93-121-41-013000

    CONN SOCKET SIP 21POS GOLD

    Mill-Max Manufacturing Corp.

    4,048
    346-93-121-41-013000

    规格书

    346 Bulk Active SIP 21 (1 x 21) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    346-43-121-41-013000

    346-43-121-41-013000

    CONN SOCKET SIP 21POS GOLD

    Mill-Max Manufacturing Corp.

    3,167
    346-43-121-41-013000

    规格书

    346 Bulk Active SIP 21 (1 x 21) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    299-93-316-11-001000

    299-93-316-11-001000

    CONN IC DIP SOCKET 16POS GOLD

    Mill-Max Manufacturing Corp.

    2,689
    299-93-316-11-001000

    规格书

    299 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    8058-1G32

    8058-1G32

    CONN TRANSIST TO-5 8POS GOLD

    TE Connectivity AMP Connectors

    2,946
    8058-1G32

    规格书

    8058 Bulk Obsolete Transistor, TO-5 8 (Round) - Gold - Beryllium Copper Through Hole Closed Frame Solder - Gold - Brass Polytetrafluoroethylene (PTFE) -55°C ~ 125°C
    114-47-304-41-117000

    114-47-304-41-117000

    STANDRD SOLDRTL DBL SKT

    Mill-Max Manufacturing Corp.

    1,663
    114-47-304-41-117000

    规格书

    114 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    APA-324-T-A

    APA-324-T-A

    ADAPTER PLUG

    Samtec Inc.

    2,479
    APA-324-T-A

    规格书

    APA Bulk Active - 24 (2 x 12) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    APO-624-T-A

    APO-624-T-A

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    2,407
    APO-624-T-A

    规格书

    APO Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    510-83-109-12-051101

    510-83-109-12-051101

    CONN SOCKET PGA 109POS GOLD

    Preci-Dip

    3,597
    510-83-109-12-051101

    规格书

    510 Bulk Active PGA 109 (12 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    APA-318-T-N

    APA-318-T-N

    ADAPTER PLUG

    Samtec Inc.

    1,763
    APA-318-T-N

    规格书

    APA Tube Active - 18 (2 x 9) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    32-1518-00

    32-1518-00

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    1,027
    32-1518-00

    规格书

    518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    32-6513-11

    32-6513-11

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    2,844
    32-6513-11

    规格书

    Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    D95040-42

    D95040-42

    CONN IC DIP SOCKET 42POS GOLD

    Harwin Inc.

    2,139
    D95040-42

    规格书

    D95 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 196.9µin (5.00µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICO-640-STT-L

    ICO-640-STT-L

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    1,167
    ICO-640-STT-L

    规格书

    ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
    111-47-304-41-001000

    111-47-304-41-001000

    STANDRD SOLDRTL DBL SKT

    Mill-Max Manufacturing Corp.

    2,416
    111-47-304-41-001000

    规格书

    111 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    09-0503-31

    09-0503-31

    CONN SOCKET SIP 9POS GOLD

    Aries Electronics

    3,579
    09-0503-31

    规格书

    0503 Bulk Active SIP 9 (1 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled -
    ICO-318-ZSGG

    ICO-318-ZSGG

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    1,647
    ICO-318-ZSGG

    规格书

    ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    HLS-0112-G-31

    HLS-0112-G-31

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    4,501
    HLS-0112-G-31

    规格书

    HLS Tube Active SIP 12 (1 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    18-3518-111

    18-3518-111

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    4,565
    18-3518-111

    规格书

    518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    20-3518-102

    20-3518-102

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    4,320
    20-3518-102

    规格书

    518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    514-AG7D

    514-AG7D

    CONN IC DIP SOCKET 14POS GOLD

    TE Connectivity AMP Connectors

    2,906
    514-AG7D

    规格书

    - Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin-Lead 25.0µin (0.63µm) Brass - -
    联系我们 获取更多产品资讯!
    双灏业商城

    首页

    双灏业商城

    产品中心

    双灏业商城

    电话

    双灏业商城

    会员中心

    品种齐全,轻松购物
    品种齐全,轻松购物
    多仓直发,极速配送
    多仓直发,极速配送
    正品行货,精致服务
    正品行货,精致服务
    天天低价,畅选无忧
    天天低价,畅选无忧
    版权所有©2025 双灏业商城