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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    1-1437538-1

    1-1437538-1

    CONN IC DIP SOCKET 28POS TIN

    TE Connectivity AMP Connectors

    2,623
    1-1437538-1

    规格书

    800 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin - Copper Alloy Surface Mount Open Frame Solder 0.100" (2.54mm) - - - Polyester -55°C ~ 105°C
    ICA-324-ZWTT

    ICA-324-ZWTT

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    1,799
    ICA-324-ZWTT

    规格书

    ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
    117-83-656-41-105101

    117-83-656-41-105101

    CONN IC DIP SOCKET 56POS GOLD

    Preci-Dip

    4,127
    117-83-656-41-105101

    规格书

    117 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 56 (2 x 28) 0.070" (1.78mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    8060-1G4

    8060-1G4

    CONN TRANSIST TO-5 4POS GOLD

    TE Connectivity AMP Connectors

    2,238
    8060-1G4

    规格书

    8060 Bulk Obsolete Transistor, TO-5 4 (Round) - Gold - Beryllium Copper Through Hole Closed Frame Solder - Gold - Beryllium Copper Polytetrafluoroethylene (PTFE) -55°C ~ 125°C
    123-43-628-41-001000

    123-43-628-41-001000

    CONN IC DIP SOCKET 28POS GOLD

    Mill-Max Manufacturing Corp.

    1,808
    123-43-628-41-001000

    规格书

    123 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    ICO-314-MGG

    ICO-314-MGG

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    1,326
    ICO-314-MGG

    规格书

    ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    114-93-304-41-117000

    114-93-304-41-117000

    CONN IC DIP SOCKET 4POS GOLD

    Mill-Max Manufacturing Corp.

    4,208
    114-93-304-41-117000

    规格书

    114 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    114-43-304-41-117000

    114-43-304-41-117000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,064
    114-43-304-41-117000

    规格书

    114 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    18-3518-112

    18-3518-112

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    2,696
    18-3518-112

    规格书

    518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    08-3503-31

    08-3503-31

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    4,290
    08-3503-31

    规格书

    503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    14-810-90TWR

    14-810-90TWR

    CONN IC DIP SOCKET 14POS TIN

    Aries Electronics

    4,359
    14-810-90TWR

    规格书

    Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
    8-1437504-1

    8-1437504-1

    CONN TRANSIST TO-3 3POS TIN

    TE Connectivity AMP Connectors

    3,928
    8-1437504-1

    规格书

    8080 Bulk Obsolete Transistor, TO-3 3 (Oval) - Tin - Beryllium Copper Chassis Mount Closed Frame Solder - Tin - Beryllium Copper Polytetrafluoroethylene (PTFE) -55°C ~ 125°C
    ICA-320-WGT-2

    ICA-320-WGT-2

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    1,561
    ICA-320-WGT-2

    规格书

    ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    ICA-628-ZSGT

    ICA-628-ZSGT

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    3,023
    ICA-628-ZSGT

    规格书

    ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    299-83-324-10-001101

    299-83-324-10-001101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    1,432
    299-83-324-10-001101

    规格书

    299 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICA-632-WTT-2

    ICA-632-WTT-2

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    1,092
    ICA-632-WTT-2

    规格书

    ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
    510-83-114-13-061101

    510-83-114-13-061101

    CONN SOCKET PGA 114POS GOLD

    Preci-Dip

    4,164
    510-83-114-13-061101

    规格书

    510 Bulk Active PGA 114 (13 x 13) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    APA-308-G-A1

    APA-308-G-A1

    ADAPTER PLUG

    Samtec Inc.

    4,543
    APA-308-G-A1

    规格书

    APA Bulk Active - 8 (2 x 4) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    ICF-624-TL-I

    ICF-624-TL-I

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    1,224
    ICF-624-TL-I

    规格书

    ICF Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    ICF-624-TL-O

    ICF-624-TL-O

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    3,493
    ICF-624-TL-O

    规格书

    ICF Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
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