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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    PGA168H003B1-1706R

    PGA168H003B1-1706R

    PGA SOCKET 168 CTS

    Amphenol ICC (FCI)

    4,697
    PGA168H003B1-1706R

    规格书

    - - Active PGA 168 (17 x 17) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Open Frame - - - - - - -
    116-83-628-41-004101

    116-83-628-41-004101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    4,583
    116-83-628-41-004101

    规格书

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICO-318-ZNGT

    ICO-318-ZNGT

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    3,824
    ICO-318-ZNGT

    规格书

    ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    APA-316-G-J

    APA-316-G-J

    ADAPTER PLUG

    Samtec Inc.

    4,372
    APA-316-G-J

    规格书

    APA Tube Active - 16 (2 x 8) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    116-83-652-41-003101

    116-83-652-41-003101

    CONN IC DIP SOCKET 52POS GOLD

    Preci-Dip

    1,388
    116-83-652-41-003101

    规格书

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    714-43-117-31-018000

    714-43-117-31-018000

    CONN SOCKET SIP 17POS GOLD

    Mill-Max Manufacturing Corp.

    4,825
    714-43-117-31-018000

    规格书

    714 Bulk Active SIP 17 (1 x 17) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    50-9513-10T

    50-9513-10T

    CONN IC DIP SOCKET 50POS GOLD

    Aries Electronics

    2,961
    50-9513-10T

    规格书

    Lo-PRO®file, 513 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    09-0508-21

    09-0508-21

    CONN SOCKET SIP 9POS GOLD

    Aries Electronics

    3,330
    09-0508-21

    规格书

    508 Bulk Active SIP 9 (1 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    09-0508-31

    09-0508-31

    CONN SOCKET SIP 9POS GOLD

    Aries Electronics

    2,770
    09-0508-31

    规格书

    508 Bulk Active SIP 9 (1 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    10-2822-90C

    10-2822-90C

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    2,858
    10-2822-90C

    规格书

    Vertisockets™ 800 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    50-9518-10T

    50-9518-10T

    CONN IC DIP SOCKET 50POS GOLD

    Aries Electronics

    4,980
    50-9518-10T

    规格书

    518 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    28-3518-10M

    28-3518-10M

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    3,329
    28-3518-10M

    规格书

    518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    612-83-950-41-001101

    612-83-950-41-001101

    CONN IC DIP SOCKET 50POS GOLD

    Preci-Dip

    4,705
    612-83-950-41-001101

    规格书

    612 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    33-0518-00

    33-0518-00

    CONN SOCKET SIP 33POS GOLD

    Aries Electronics

    4,540
    33-0518-00

    规格书

    518 Bulk Active SIP 33 (1 x 33) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    ICO-314-ZCGT

    ICO-314-ZCGT

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    3,582
    ICO-314-ZCGT

    规格书

    ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    ICF-632-SM-O-TR

    ICF-632-SM-O-TR

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    3,294
    ICF-632-SM-O-TR

    规格书

    ICF Tape & Reel (TR) Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    HLS-0209-G-2

    HLS-0209-G-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    4,721
    HLS-0209-G-2

    规格书

    HLS Tube Active SIP 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    1-1437508-7

    1-1437508-7

    CONN SOCKET TRANSIST TO-5 8POS

    TE Connectivity AMP Connectors

    4,725
    1-1437508-7

    规格书

    8058 Bulk Obsolete Transistor, TO-5 8 (Round) - Gold - Beryllium Copper Through Hole Closed Frame Solder - Gold - Brass Polytetrafluoroethylene (PTFE) -55°C ~ 125°C
    48-6513-10

    48-6513-10

    CONN IC DIP SOCKET 48POS GOLD

    Aries Electronics

    4,463
    48-6513-10

    规格书

    Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    24-3513-10H

    24-3513-10H

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    3,139
    24-3513-10H

    规格书

    Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
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