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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    16-820-90C

    16-820-90C

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    3,218
    16-820-90C

    规格书

    Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    16-822-90C

    16-822-90C

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    2,763
    16-822-90C

    规格书

    Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    16-823-90C

    16-823-90C

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    3,164
    16-823-90C

    规格书

    Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    APA-628-T-N

    APA-628-T-N

    ADAPTER PLUG

    Samtec Inc.

    2,529
    APA-628-T-N

    规格书

    APA Tube Active - 28 (2 x 14) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    116-83-652-41-002101

    116-83-652-41-002101

    CONN IC DIP SOCKET 52POS GOLD

    Preci-Dip

    2,153
    116-83-652-41-002101

    规格书

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    HLS-0214-T-2

    HLS-0214-T-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    2,179
    HLS-0214-T-2

    规格书

    HLS Tube Active SIP 28 (2 x 14) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    4727

    4727

    SMT SOCKET - WIDE SOIC-16

    Adafruit Industries LLC

    3,438
    4727

    规格书

    - Bulk Active SOIC 16 (2 x 8) 0.050" (1.27mm) Tin 100.0µin (2.54µm) Copper Alloy Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 100.0µin (2.54µm) Copper Alloy Thermoplastic -
    APO-316-T-T

    APO-316-T-T

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    1,655
    APO-316-T-T

    规格书

    APO Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    ICO-628-ZLGT

    ICO-628-ZLGT

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    4,959
    ICO-628-ZLGT

    规格书

    ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    612-43-304-41-003000

    612-43-304-41-003000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    2,832
    612-43-304-41-003000

    规格书

    612 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-93-304-41-003000

    612-93-304-41-003000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    2,284
    612-93-304-41-003000

    规格书

    612 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    ICA-324-ZWGT-2

    ICA-324-ZWGT-2

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    1,924
    ICA-324-ZWGT-2

    规格书

    ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    ICA-624-ZWGT-2

    ICA-624-ZWGT-2

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    1,769
    ICA-624-ZWGT-2

    规格书

    ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    24-3513-11H

    24-3513-11H

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    2,075
    24-3513-11H

    规格书

    Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    10-2823-90C

    10-2823-90C

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    4,066
    10-2823-90C

    规格书

    Vertisockets™ 800 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    64-9518-10T

    64-9518-10T

    CONN IC DIP SOCKET 64POS GOLD

    Aries Electronics

    1,105
    64-9518-10T

    规格书

    518 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    510-83-144-15-081101

    510-83-144-15-081101

    CONN SOCKET PGA 144POS GOLD

    Preci-Dip

    4,327
    510-83-144-15-081101

    规格书

    510 Bulk Active PGA 144 (15 x 15) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    30-3513-11

    30-3513-11

    CONN IC DIP SOCKET 30POS GOLD

    Aries Electronics

    1,323
    30-3513-11

    规格书

    Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 30 (2 x 15) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    HLS-0318-TT-22

    HLS-0318-TT-22

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    4,633
    HLS-0318-TT-22

    规格书

    HLS Tube Active SIP 54 (3 x 18) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - - Thermoplastic -55°C ~ 140°C
    ICO-324-SGT

    ICO-324-SGT

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    2,198
    ICO-324-SGT

    规格书

    ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
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