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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    12-7500-10

    12-7500-10

    CONN SOCKET SIP 12POS TIN

    Aries Electronics

    4,108
    12-7500-10

    规格书

    700 Elevator Strip-Line™ Bulk Active SIP 12 (1 x 12) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    12-7550-10

    12-7550-10

    CONN SOCKET SIP 12POS TIN

    Aries Electronics

    1,118
    12-7550-10

    规格书

    700 Elevator Strip-Line™ Bulk Active SIP 12 (1 x 12) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    12-7590-10

    12-7590-10

    CONN SOCKET SIP 12POS TIN

    Aries Electronics

    4,267
    12-7590-10

    规格书

    700 Elevator Strip-Line™ Bulk Active SIP 12 (1 x 12) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    12-7750-10

    12-7750-10

    CONN SOCKET SIP 12POS TIN

    Aries Electronics

    4,978
    12-7750-10

    规格书

    700 Elevator Strip-Line™ Bulk Active SIP 12 (1 x 12) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    22-1508-20

    22-1508-20

    CONN IC DIP SOCKET 22POS GOLD

    Aries Electronics

    3,092
    22-1508-20

    规格书

    508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    APA-324-T-C

    APA-324-T-C

    ADAPTER PLUG

    Samtec Inc.

    3,528
    APA-324-T-C

    规格书

    APA Bulk Active - 24 (2 x 12) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    APA-624-T-C

    APA-624-T-C

    ADAPTER PLUG

    Samtec Inc.

    3,361
    APA-624-T-C

    规格书

    APA Bulk Active - 24 (2 x 12) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    APO-324-T-C

    APO-324-T-C

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    1,222
    APO-324-T-C

    规格书

    APO Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    28-0518-11H

    28-0518-11H

    CONN SOCKET SIP 28POS GOLD

    Aries Electronics

    3,030
    28-0518-11H

    规格书

    518 Bulk Active SIP 28 (1 x 28) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    28-1518-11H

    28-1518-11H

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    2,484
    28-1518-11H

    规格书

    518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    116-83-628-41-013101

    116-83-628-41-013101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    2,332
    116-83-628-41-013101

    规格书

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICA-316-ZHGT

    ICA-316-ZHGT

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    3,207
    ICA-316-ZHGT

    规格书

    ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    ICA-640-WTT-3

    ICA-640-WTT-3

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    4,039
    ICA-640-WTT-3

    规格书

    ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
    40-9513-10T

    40-9513-10T

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    1,573
    40-9513-10T

    规格书

    Lo-PRO®file, 513 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    116-83-650-41-008101

    116-83-650-41-008101

    CONN IC DIP SOCKET 50POS GOLD

    Preci-Dip

    2,749
    116-83-650-41-008101

    规格书

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    APO-632-T-A

    APO-632-T-A

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    4,029
    APO-632-T-A

    规格书

    APO Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    ICF-318-STL-O

    ICF-318-STL-O

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    2,896
    ICF-318-STL-O

    规格书

    ICF Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    08-0511-11

    08-0511-11

    CONN SOCKET SIP 8POS GOLD

    Aries Electronics

    1,393
    08-0511-11

    规格书

    511 Bulk Active SIP 8 (1 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    123-47-304-41-001000

    123-47-304-41-001000

    STANDARD WIRE WRAP DBL SKT

    Mill-Max Manufacturing Corp.

    1,279
    123-47-304-41-001000

    规格书

    123 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    18-0503-20

    18-0503-20

    CONN SOCKET SIP 18POS GOLD

    Aries Electronics

    1,216
    18-0503-20

    规格书

    0503 Bulk Active SIP 18 (1 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled -
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