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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    38-3513-10H

    38-3513-10H

    CONN IC DIP SOCKET 38POS GOLD

    Aries Electronics

    4,797
    38-3513-10H

    规格书

    Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 38 (2 x 19) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    20-823-90T

    20-823-90T

    CONN IC DIP SOCKET 20POS TIN

    Aries Electronics

    3,354
    20-823-90T

    规格书

    Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    510-83-143-15-081101

    510-83-143-15-081101

    CONN SOCKET PGA 143POS GOLD

    Preci-Dip

    1,379
    510-83-143-15-081101

    规格书

    510 Bulk Active PGA 143 (15 x 15) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    HLS-0116-G-12

    HLS-0116-G-12

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    3,832
    HLS-0116-G-12

    规格书

    HLS Tube Active SIP 16 (1 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    4-1437508-0

    4-1437508-0

    CONN TRANSIST TO-5 8POS GOLD

    TE Connectivity AMP Connectors

    2,024
    4-1437508-0

    规格书

    8058 Bulk Obsolete Transistor, TO-5 8 (Round) - Gold - Beryllium Copper Through Hole Closed Frame Solder - Gold - Beryllium Copper Polytetrafluoroethylene (PTFE) -55°C ~ 125°C
    ICA-422-ZSGG

    ICA-422-ZSGG

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    1,623
    ICA-422-ZSGG

    规格书

    ICA Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    ICO-422-ZSGG

    ICO-422-ZSGG

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    1,046
    ICO-422-ZSGG

    规格书

    ICO Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    510-83-159-16-071101

    510-83-159-16-071101

    CONN SOCKET PGA 159POS GOLD

    Preci-Dip

    3,361
    510-83-159-16-071101

    规格书

    510 Bulk Active PGA 159 (16 x 16) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    18-3508-20

    18-3508-20

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    4,669
    18-3508-20

    规格书

    508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    18-3508-30

    18-3508-30

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    4,262
    18-3508-30

    规格书

    508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    APO-322-T-R

    APO-322-T-R

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    2,303
    APO-322-T-R

    规格书

    APO Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    116-83-652-41-011101

    116-83-652-41-011101

    CONN IC DIP SOCKET 52POS GOLD

    Preci-Dip

    1,729
    116-83-652-41-011101

    规格书

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICA-316-WGG-2

    ICA-316-WGG-2

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    4,738
    ICA-316-WGG-2

    规格书

    ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    ICA-318-ZWGG-3

    ICA-318-ZWGG-3

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    1,503
    ICA-318-ZWGG-3

    规格书

    ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    126-93-304-41-003000

    126-93-304-41-003000

    CONN IC DIP SOCKET 4POS GOLD

    Mill-Max Manufacturing Corp.

    4,303
    126-93-304-41-003000

    规格书

    126 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    126-43-304-41-003000

    126-43-304-41-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,005
    126-43-304-41-003000

    规格书

    126 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    14-6501-21

    14-6501-21

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    2,115
    14-6501-21

    规格书

    501 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    14-6501-31

    14-6501-31

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    1,562
    14-6501-31

    规格书

    501 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    510-83-144-15-001101

    510-83-144-15-001101

    CONN SOCKET PGA 144POS GOLD

    Preci-Dip

    4,465
    510-83-144-15-001101

    规格书

    510 Bulk Active PGA 144 (15 x 15) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    28-3518-11H

    28-3518-11H

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    4,640
    28-3518-11H

    规格书

    518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
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