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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    510-83-160-15-061101

    510-83-160-15-061101

    CONN SOCKET PGA 160POS GOLD

    Preci-Dip

    4,805
    510-83-160-15-061101

    规格书

    510 Bulk Active PGA 160 (15 x 15) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-83-160-13-001101

    510-83-160-13-001101

    CONN SOCKET PGA 160POS GOLD

    Preci-Dip

    1,107
    510-83-160-13-001101

    规格书

    510 Bulk Active PGA 160 (13 x 13) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-83-160-14-001101

    510-83-160-14-001101

    CONN SOCKET PGA 160POS GOLD

    Preci-Dip

    2,121
    510-83-160-14-001101

    规格书

    510 Bulk Active PGA 160 (14 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    HLS-0209-G-38

    HLS-0209-G-38

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    2,284
    HLS-0209-G-38

    规格书

    HLS Tube Active SIP 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    510-83-160-16-081101

    510-83-160-16-081101

    CONN SOCKET PGA 160POS GOLD

    Preci-Dip

    4,057
    510-83-160-16-081101

    规格书

    510 Bulk Active PGA 160 (16 x 16) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    124-41-304-41-002000

    124-41-304-41-002000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,432
    124-41-304-41-002000

    规格书

    124 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    124-91-304-41-002000

    124-91-304-41-002000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,989
    124-91-304-41-002000

    规格书

    124 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    11-71000-10

    11-71000-10

    CONN SOCKET SIP 11POS TIN

    Aries Electronics

    2,651
    11-71000-10

    规格书

    700 Elevator Strip-Line™ Bulk Active SIP 11 (1 x 11) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    11-7400-10

    11-7400-10

    CONN SOCKET SIP 11POS TIN

    Aries Electronics

    1,289
    11-7400-10

    规格书

    700 Elevator Strip-Line™ Bulk Active SIP 11 (1 x 11) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    11-7587-10

    11-7587-10

    CONN SOCKET SIP 11POS TIN

    Aries Electronics

    1,493
    11-7587-10

    规格书

    700 Elevator Strip-Line™ Bulk Active SIP 11 (1 x 11) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    08-6621-30

    08-6621-30

    CONN IC DIP SOCKET 8POS TIN

    Aries Electronics

    2,599
    08-6621-30

    规格书

    6621 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Bottom Entry; Through Board Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    09-0501-30

    09-0501-30

    CONN SOCKET SIP 9POS TIN

    Aries Electronics

    3,514
    09-0501-30

    规格书

    501 Bulk Active SIP 9 (1 x 9) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    ICO-320-CGG

    ICO-320-CGG

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    4,774
    ICO-320-CGG

    规格书

    ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    546-87-085-11-002135

    546-87-085-11-002135

    CONN SOCKET PGA 85POS GOLD

    Preci-Dip

    4,328
    546-87-085-11-002135

    规格书

    546 Bulk Active PGA 85 (11 x 11) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    30-9513-11

    30-9513-11

    CONN IC DIP SOCKET 30POS GOLD

    Aries Electronics

    2,320
    30-9513-11

    规格书

    Lo-PRO®file, 513 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 30 (2 x 15) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    13-0508-21

    13-0508-21

    CONN SOCKET SIP 13POS GOLD

    Aries Electronics

    1,615
    13-0508-21

    规格书

    508 Bulk Active SIP 13 (1 x 13) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    13-0508-31

    13-0508-31

    CONN SOCKET SIP 13POS GOLD

    Aries Electronics

    4,117
    13-0508-31

    规格书

    508 Bulk Active SIP 13 (1 x 13) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    18-3508-301

    18-3508-301

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    2,738
    18-3508-301

    规格书

    508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    14-6823-90

    14-6823-90

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    4,343
    14-6823-90

    规格书

    Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
    550-80-069-11-001101

    550-80-069-11-001101

    PGA SOLDER TAIL

    Preci-Dip

    4,499
    550-80-069-11-001101

    规格书

    550 Bulk Active PGA 69 (11 x 11) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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