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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    18-3501-21

    18-3501-21

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    4,932
    18-3501-21

    规格书

    501 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    110-93-304-61-001000

    110-93-304-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    1,836
    110-93-304-61-001000

    规格书

    110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    23-0508-30

    23-0508-30

    CONN SOCKET SIP 23POS GOLD

    Aries Electronics

    1,383
    23-0508-30

    规格书

    508 Bulk Active SIP 23 (1 x 23) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    210-44-306-41-001000

    210-44-306-41-001000

    STANDRD SOLDRTL DBL SKT

    Mill-Max Manufacturing Corp.

    4,408
    210-44-306-41-001000

    规格书

    210 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    210-99-306-41-001000

    210-99-306-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,892
    210-99-306-41-001000

    规格书

    210 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    510-83-168-17-001101

    510-83-168-17-001101

    CONN SOCKET PGA 168POS GOLD

    Preci-Dip

    2,236
    510-83-168-17-001101

    规格书

    510 Bulk Active PGA 168 (17 x 17) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    15-7350-10

    15-7350-10

    CONN SOCKET SIP 15POS TIN

    Aries Electronics

    3,503
    15-7350-10

    规格书

    700 Elevator Strip-Line™ Bulk Active SIP 15 (1 x 15) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    15-7450-10

    15-7450-10

    CONN SOCKET SIP 15POS TIN

    Aries Electronics

    1,810
    15-7450-10

    规格书

    700 Elevator Strip-Line™ Bulk Active SIP 15 (1 x 15) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    15-7500-10

    15-7500-10

    CONN SOCKET SIP 15POS TIN

    Aries Electronics

    1,539
    15-7500-10

    规格书

    700 Elevator Strip-Line™ Bulk Active SIP 15 (1 x 15) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    15-7540-10

    15-7540-10

    CONN SOCKET SIP 15POS TIN

    Aries Electronics

    1,267
    15-7540-10

    规格书

    700 Elevator Strip-Line™ Bulk Active SIP 15 (1 x 15) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    15-7635-10

    15-7635-10

    CONN SOCKET SIP 15POS TIN

    Aries Electronics

    4,719
    15-7635-10

    规格书

    700 Elevator Strip-Line™ Bulk Active SIP 15 (1 x 15) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    15-7695-10

    15-7695-10

    CONN SOCKET SIP 15POS TIN

    Aries Electronics

    2,792
    15-7695-10

    规格书

    700 Elevator Strip-Line™ Bulk Active SIP 15 (1 x 15) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    15-7850-10

    15-7850-10

    CONN SOCKET SIP 15POS TIN

    Aries Electronics

    2,805
    15-7850-10

    规格书

    700 Elevator Strip-Line™ Bulk Active SIP 15 (1 x 15) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    10-6810-90TWR

    10-6810-90TWR

    CONN IC DIP SOCKET 10POS TIN

    Aries Electronics

    4,649
    10-6810-90TWR

    规格书

    Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
    ICA-628-WGT-2

    ICA-628-WGT-2

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    1,830
    ICA-628-WGT-2

    规格书

    ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    24-6820-90C

    24-6820-90C

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    2,204
    24-6820-90C

    规格书

    Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    24-6823-90C

    24-6823-90C

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    4,530
    24-6823-90C

    规格书

    Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    APH-0906-G-R

    APH-0906-G-R

    APH-0906-G-R

    Samtec Inc.

    3,038
    APH-0906-G-R

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-1906-G-R

    APH-1906-G-R

    APH-1906-G-R

    Samtec Inc.

    4,603
    APH-1906-G-R

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-1006-G-R

    APH-1006-G-R

    APH-1006-G-R

    Samtec Inc.

    4,899
    APH-1006-G-R

    规格书

    * - Active - - - - - - - - - - - - - - -
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