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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    APO-308-G-B

    APO-308-G-B

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    3,973
    APO-308-G-B

    规格书

    APO Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    25-0508-20

    25-0508-20

    CONN SOCKET SIP 25POS GOLD

    Aries Electronics

    1,917
    25-0508-20

    规格书

    508 Bulk Active SIP 25 (1 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    25-0508-30

    25-0508-30

    CONN SOCKET SIP 25POS GOLD

    Aries Electronics

    4,668
    25-0508-30

    规格书

    508 Bulk Active SIP 25 (1 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    40-3513-11

    40-3513-11

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    4,588
    40-3513-11

    规格书

    Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    22-4508-20

    22-4508-20

    CONN IC DIP SOCKET 22POS GOLD

    Aries Electronics

    3,936
    22-4508-20

    规格书

    508 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    22-4508-30

    22-4508-30

    CONN IC DIP SOCKET 22POS GOLD

    Aries Electronics

    4,917
    22-4508-30

    规格书

    508 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    14-6810-90C

    14-6810-90C

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    3,776
    14-6810-90C

    规格书

    Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Vertical Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    836-AG11D

    836-AG11D

    CONN IC DIP SOCKET 36POS GOLD

    TE Connectivity AMP Connectors

    3,130
    836-AG11D

    规格书

    800 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) - - - Polyester -55°C ~ 105°C
    115-41-306-41-001000

    115-41-306-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,324
    115-41-306-41-001000

    规格书

    115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    115-91-306-41-001000

    115-91-306-41-001000

    SKT IC OPEN LOWPRO

    Mill-Max Manufacturing Corp.

    2,229
    115-91-306-41-001000

    规格书

    115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    32-6518-11H

    32-6518-11H

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    4,174
    32-6518-11H

    规格书

    518 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    550-10-056-09-041101

    550-10-056-09-041101

    PGA SOLDER TAIL

    Preci-Dip

    1,182
    550-10-056-09-041101

    规格书

    550 Bulk Active PGA 56 (9 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    40-C182-11

    40-C182-11

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    4,390
    40-C182-11

    规格书

    EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    40-C212-11

    40-C212-11

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    1,404
    40-C212-11

    规格书

    EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    40-C300-11

    40-C300-11

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    4,850
    40-C300-11

    规格书

    EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    40-6513-10H

    40-6513-10H

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    3,037
    40-6513-10H

    规格书

    Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    ICA-628-WGT

    ICA-628-WGT

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    3,639
    ICA-628-WGT

    规格书

    ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    APH-0512-T-H

    APH-0512-T-H

    APH-0512-T-H

    Samtec Inc.

    4,081
    APH-0512-T-H

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-1512-T-H

    APH-1512-T-H

    APH-1512-T-H

    Samtec Inc.

    4,491
    APH-1512-T-H

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-0612-T-H

    APH-0612-T-H

    APH-0612-T-H

    Samtec Inc.

    1,213
    APH-0612-T-H

    规格书

    * - Active - - - - - - - - - - - - - - -
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