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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    APH-0212-T-H

    APH-0212-T-H

    APH-0212-T-H

    Samtec Inc.

    3,593
    APH-0212-T-H

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-0312-T-H

    APH-0312-T-H

    APH-0312-T-H

    Samtec Inc.

    1,327
    APH-0312-T-H

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-1312-T-H

    APH-1312-T-H

    APH-1312-T-H

    Samtec Inc.

    2,857
    APH-1312-T-H

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-1212-T-H

    APH-1212-T-H

    APH-1212-T-H

    Samtec Inc.

    1,304
    APH-1212-T-H

    规格书

    * - Active - - - - - - - - - - - - - - -
    ICA-422-ZHGT

    ICA-422-ZHGT

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    4,948
    ICA-422-ZHGT

    规格书

    ICA Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    18-81000-310C

    18-81000-310C

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    3,828
    18-81000-310C

    规格书

    8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    18-81250-310C

    18-81250-310C

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    3,299
    18-81250-310C

    规格书

    8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    18-8250-310C

    18-8250-310C

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    4,012
    18-8250-310C

    规格书

    8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    18-8300-310C

    18-8300-310C

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    1,161
    18-8300-310C

    规格书

    8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    18-8375-310C

    18-8375-310C

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    4,771
    18-8375-310C

    规格书

    8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    18-8400-310C

    18-8400-310C

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    3,371
    18-8400-310C

    规格书

    8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    18-8406-310C

    18-8406-310C

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    1,545
    18-8406-310C

    规格书

    8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    18-8500-310C

    18-8500-310C

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    4,613
    18-8500-310C

    规格书

    8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    18-8545-310C

    18-8545-310C

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    1,429
    18-8545-310C

    规格书

    8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    18-8600-310C

    18-8600-310C

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    4,308
    18-8600-310C

    规格书

    8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    18-8670-310C

    18-8670-310C

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    4,254
    18-8670-310C

    规格书

    8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    18-8750-310C

    18-8750-310C

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    3,347
    18-8750-310C

    规格书

    8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    APA-316-G-M

    APA-316-G-M

    ADAPTER PLUG

    Samtec Inc.

    2,971
    APA-316-G-M

    规格书

    APA Tube Active - 16 (2 x 8) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    14-0501-20

    14-0501-20

    CONN SOCKET SIP 14POS TIN

    Aries Electronics

    3,815
    14-0501-20

    规格书

    501 Bulk Active SIP 14 (1 x 14) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    14-0501-30

    14-0501-30

    CONN SOCKET SIP 14POS TIN

    Aries Electronics

    1,162
    14-0501-30

    规格书

    501 Bulk Active SIP 14 (1 x 14) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
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