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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    18-8685-610C

    18-8685-610C

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    4,857
    18-8685-610C

    规格书

    8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    18-8700-610C

    18-8700-610C

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    2,206
    18-8700-610C

    规格书

    8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    18-8750-610C

    18-8750-610C

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    3,461
    18-8750-610C

    规格书

    8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    18-8870-610C

    18-8870-610C

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    1,687
    18-8870-610C

    规格书

    8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    HLS-0610-TT-22

    HLS-0610-TT-22

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    1,052
    HLS-0610-TT-22

    规格书

    HLS Bulk Active SIP 60 (6 x 10) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - - Thermoplastic -55°C ~ 140°C
    20-0501-21

    20-0501-21

    CONN SOCKET SIP 20POS GOLD

    Aries Electronics

    3,198
    20-0501-21

    规格书

    501 Bulk Active SIP 20 (1 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    20-0501-31

    20-0501-31

    CONN SOCKET SIP 20POS GOLD

    Aries Electronics

    3,836
    20-0501-31

    规格书

    501 Bulk Active SIP 20 (1 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    614-87-084-10-001112

    614-87-084-10-001112

    CONN SOCKET PGA 84POS GOLD

    Preci-Dip

    4,585
    614-87-084-10-001112

    规格书

    614 Bulk Active PGA 84 (10 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    614-87-084-10-031112

    614-87-084-10-031112

    CONN SOCKET PGA 84POS GOLD

    Preci-Dip

    2,420
    614-87-084-10-031112

    规格书

    614 Bulk Active PGA 84 (10 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    40-6513-11H

    40-6513-11H

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    1,345
    40-6513-11H

    规格书

    Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    APO-628-T-R

    APO-628-T-R

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    2,465
    APO-628-T-R

    规格书

    APO Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    APH-0916-T-H

    APH-0916-T-H

    APH-0916-T-H

    Samtec Inc.

    3,289
    APH-0916-T-H

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-0516-T-H

    APH-0516-T-H

    APH-0516-T-H

    Samtec Inc.

    4,053
    APH-0516-T-H

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-1516-T-H

    APH-1516-T-H

    APH-1516-T-H

    Samtec Inc.

    1,397
    APH-1516-T-H

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-0616-T-H

    APH-0616-T-H

    APH-0616-T-H

    Samtec Inc.

    1,826
    APH-0616-T-H

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-1116-T-H

    APH-1116-T-H

    APH-1116-T-H

    Samtec Inc.

    3,939
    APH-1116-T-H

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-1316-T-H

    APH-1316-T-H

    APH-1316-T-H

    Samtec Inc.

    1,219
    APH-1316-T-H

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-0816-T-H

    APH-0816-T-H

    APH-0816-T-H

    Samtec Inc.

    1,277
    APH-0816-T-H

    规格书

    * - Active - - - - - - - - - - - - - - -
    110-99-210-41-001000

    110-99-210-41-001000

    CONN IC DIP SOCKET 10POS TINLEAD

    Mill-Max Manufacturing Corp.

    1,728
    110-99-210-41-001000

    规格书

    110 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-44-210-41-001000

    110-44-210-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,811
    110-44-210-41-001000

    规格书

    110 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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