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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    APH-0222-T-T

    APH-0222-T-T

    APH-0222-T-T

    Samtec Inc.

    2,916
    APH-0222-T-T

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-0822-T-T

    APH-0822-T-T

    APH-0822-T-T

    Samtec Inc.

    1,123
    APH-0822-T-T

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-1822-T-T

    APH-1822-T-T

    APH-1822-T-T

    Samtec Inc.

    3,870
    APH-1822-T-T

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-1322-T-T

    APH-1322-T-T

    APH-1322-T-T

    Samtec Inc.

    2,980
    APH-1322-T-T

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-0422-T-T

    APH-0422-T-T

    APH-0422-T-T

    Samtec Inc.

    2,289
    APH-0422-T-T

    规格书

    * - Active - - - - - - - - - - - - - - -
    1761505-1

    1761505-1

    CONN SOCKET PGA ZIF 604POS GOLD

    TE Connectivity AMP Connectors

    1,508
    1761505-1

    规格书

    - Tray Obsolete PGA, ZIF (ZIP) 604 (25 x 31) 0.050" (1.27mm) Gold 30.0µin (0.76µm) - Surface Mount Open Frame - - - - - - -
    22-0501-20

    22-0501-20

    CONN SOCKET SIP 22POS TIN

    Aries Electronics

    3,674
    22-0501-20

    规格书

    501 Bulk Active SIP 22 (1 x 22) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    317-47-103-41-005000

    317-47-103-41-005000

    STANDRD SOLDRTL SNG SKT

    Mill-Max Manufacturing Corp.

    4,843
    317-47-103-41-005000

    规格书

    317 Bulk Active SIP 3 (1 x 3) 0.070" (1.78mm) Gold Flash Beryllium Copper Through Hole - Solder 0.070" (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    12-6810-90

    12-6810-90

    CONN IC DIP SOCKET 12POS GOLD

    Aries Electronics

    4,197
    12-6810-90

    规格书

    Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
    ICO-318-BGG

    ICO-318-BGG

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    1,455
    ICO-318-BGG

    规格书

    ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    346-93-142-41-013000

    346-93-142-41-013000

    CONN SOCKET SIP 42POS GOLD

    Mill-Max Manufacturing Corp.

    1,684
    346-93-142-41-013000

    规格书

    346 Bulk Active SIP 42 (1 x 42) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    346-43-142-41-013000

    346-43-142-41-013000

    CONN SOCKET SIP 42POS GOLD

    Mill-Max Manufacturing Corp.

    3,058
    346-43-142-41-013000

    规格书

    346 Bulk Active SIP 42 (1 x 42) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    16-6810-90

    16-6810-90

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    1,236
    16-6810-90

    规格书

    Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
    210-11-306-41-001000

    210-11-306-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,007
    210-11-306-41-001000

    规格书

    210 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-87-085-11-041112

    614-87-085-11-041112

    CONN SOCKET PGA 85POS GOLD

    Preci-Dip

    3,326
    614-87-085-11-041112

    规格书

    614 Bulk Active PGA 85 (11 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    317-47-107-41-005000

    317-47-107-41-005000

    STANDRD SOLDRTL SNG SKT

    Mill-Max Manufacturing Corp.

    3,609
    317-47-107-41-005000

    规格书

    317 Bulk Active SIP 7 (1 x 7) 0.070" (1.78mm) Gold Flash Beryllium Copper Through Hole - Solder 0.070" (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    510-83-201-15-041101

    510-83-201-15-041101

    CONN SOCKET PGA 201POS GOLD

    Preci-Dip

    3,067
    510-83-201-15-041101

    规格书

    510 Bulk Active PGA 201 (15 x 15) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    146-41-306-41-013000

    146-41-306-41-013000

    CONN SKT DBL

    Mill-Max Manufacturing Corp.

    3,511
    146-41-306-41-013000

    规格书

    146 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    146-91-306-41-013000

    146-91-306-41-013000

    CONN SKT DBL

    Mill-Max Manufacturing Corp.

    3,355
    146-91-306-41-013000

    规格书

    146 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-47-310-41-105000

    110-47-310-41-105000

    STANDRD SOLDRTL

    Mill-Max Manufacturing Corp.

    1,243
    110-47-310-41-105000

    规格书

    110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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