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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    17-0508-21

    17-0508-21

    CONN SOCKET SIP 17POS GOLD

    Aries Electronics

    3,174
    17-0508-21

    规格书

    508 Bulk Active SIP 17 (1 x 17) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    17-0508-31

    17-0508-31

    CONN SOCKET SIP 17POS GOLD

    Aries Electronics

    2,408
    17-0508-31

    规格书

    508 Bulk Active SIP 17 (1 x 17) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    110-41-308-41-105000

    110-41-308-41-105000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    1,516
    110-41-308-41-105000

    规格书

    110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-91-308-41-105000

    110-91-308-41-105000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,358
    110-91-308-41-105000

    规格书

    110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    09-0511-11

    09-0511-11

    CONN SOCKET SIP 9POS GOLD

    Aries Electronics

    3,243
    09-0511-11

    规格书

    511 Bulk Active SIP 9 (1 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    HLS-0214-G-2

    HLS-0214-G-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    1,140
    HLS-0214-G-2

    规格书

    HLS Tube Active SIP 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    19-71080-10

    19-71080-10

    CONN SOCKET SIP 19POS TIN

    Aries Electronics

    2,970
    19-71080-10

    规格书

    700 Elevator Strip-Line™ Bulk Active SIP 19 (1 x 19) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    19-7375-10

    19-7375-10

    CONN SOCKET SIP 19POS TIN

    Aries Electronics

    2,432
    19-7375-10

    规格书

    700 Elevator Strip-Line™ Bulk Active SIP 19 (1 x 19) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    19-7400-10

    19-7400-10

    CONN SOCKET SIP 19POS TIN

    Aries Electronics

    2,252
    19-7400-10

    规格书

    700 Elevator Strip-Line™ Bulk Active SIP 19 (1 x 19) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    19-7650-10

    19-7650-10

    CONN SOCKET SIP 19POS TIN

    Aries Electronics

    2,964
    19-7650-10

    规格书

    700 Elevator Strip-Line™ Bulk Active SIP 19 (1 x 19) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    19-7750-10

    19-7750-10

    CONN SOCKET SIP 19POS TIN

    Aries Electronics

    3,062
    19-7750-10

    规格书

    700 Elevator Strip-Line™ Bulk Active SIP 19 (1 x 19) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    20-81000-310C

    20-81000-310C

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    1,420
    20-81000-310C

    规格书

    8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    20-81156-310C

    20-81156-310C

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    4,914
    20-81156-310C

    规格书

    8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    20-81200-310C

    20-81200-310C

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    3,312
    20-81200-310C

    规格书

    8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    20-81250-310C

    20-81250-310C

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    4,819
    20-81250-310C

    规格书

    8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    20-8190-310C

    20-8190-310C

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    1,158
    20-8190-310C

    规格书

    8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    20-8240-310C

    20-8240-310C

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    2,333
    20-8240-310C

    规格书

    8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    20-8260-310C

    20-8260-310C

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    3,193
    20-8260-310C

    规格书

    8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    20-8280-310C

    20-8280-310C

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    3,968
    20-8280-310C

    规格书

    8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    20-8300-310C

    20-8300-310C

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    1,259
    20-8300-310C

    规格书

    8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
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