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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    APH-1122-T-H

    APH-1122-T-H

    APH-1122-T-H

    Samtec Inc.

    3,184
    APH-1122-T-H

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-0222-T-H

    APH-0222-T-H

    APH-0222-T-H

    Samtec Inc.

    4,883
    APH-0222-T-H

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-1722-T-H

    APH-1722-T-H

    APH-1722-T-H

    Samtec Inc.

    1,863
    APH-1722-T-H

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-1222-T-H

    APH-1222-T-H

    APH-1222-T-H

    Samtec Inc.

    1,669
    APH-1222-T-H

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-1622-T-H

    APH-1622-T-H

    APH-1622-T-H

    Samtec Inc.

    1,754
    APH-1622-T-H

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-0722-T-H

    APH-0722-T-H

    APH-0722-T-H

    Samtec Inc.

    2,764
    APH-0722-T-H

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-0322-T-H

    APH-0322-T-H

    APH-0322-T-H

    Samtec Inc.

    3,560
    APH-0322-T-H

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-1322-T-H

    APH-1322-T-H

    APH-1322-T-H

    Samtec Inc.

    4,509
    APH-1322-T-H

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-0822-T-H

    APH-0822-T-H

    APH-0822-T-H

    Samtec Inc.

    2,866
    APH-0822-T-H

    规格书

    * - Active - - - - - - - - - - - - - - -
    ICO-632-ZCGT

    ICO-632-ZCGT

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    3,802
    ICO-632-ZCGT

    规格书

    ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    28-6511-11

    28-6511-11

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    1,415
    28-6511-11

    规格书

    511 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    116-47-308-41-006000

    116-47-308-41-006000

    STANDRD SOLDRTL DBL SKT

    Mill-Max Manufacturing Corp.

    2,666
    116-47-308-41-006000

    规格书

    116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-41-306-41-008000

    116-41-306-41-008000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,088
    116-41-306-41-008000

    规格书

    116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-91-306-41-008000

    116-91-306-41-008000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,442
    116-91-306-41-008000

    规格书

    116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    HLS-0211-G-11

    HLS-0211-G-11

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    3,947
    HLS-0211-G-11

    规格书

    HLS Tube Active SIP 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    828-AG12D

    828-AG12D

    CONN IC DIP SOCKET 28POS TINLEAD

    TE Connectivity AMP Connectors

    4,407
    828-AG12D

    规格书

    800 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin-Lead - Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead - Copper Alloy Polyester -55°C ~ 105°C
    24-3503-30

    24-3503-30

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    1,197
    24-3503-30

    规格书

    503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    22-0503-20

    22-0503-20

    CONN SOCKET SIP 22POS GOLD

    Aries Electronics

    3,765
    22-0503-20

    规格书

    0503 Bulk Active SIP 22 (1 x 22) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled -
    22-0503-30

    22-0503-30

    CONN SOCKET SIP 22POS GOLD

    Aries Electronics

    2,235
    22-0503-30

    规格书

    0503 Bulk Active SIP 22 (1 x 22) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled -
    317-91-106-41-005000

    317-91-106-41-005000

    CONN SKT SNG

    Mill-Max Manufacturing Corp.

    2,881
    317-91-106-41-005000

    规格书

    317 Bulk Active SIP 6 (1 x 6) 0.070" (1.78mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.070" (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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