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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    APH-1124-T-T

    APH-1124-T-T

    APH-1124-T-T

    Samtec Inc.

    1,016
    APH-1124-T-T

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-1324-T-T

    APH-1324-T-T

    APH-1324-T-T

    Samtec Inc.

    1,857
    APH-1324-T-T

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-0724-T-T

    APH-0724-T-T

    APH-0724-T-T

    Samtec Inc.

    1,238
    APH-0724-T-T

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-1624-T-T

    APH-1624-T-T

    APH-1624-T-T

    Samtec Inc.

    3,620
    APH-1624-T-T

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-1824-T-T

    APH-1824-T-T

    APH-1824-T-T

    Samtec Inc.

    1,387
    APH-1824-T-T

    规格书

    * - Active - - - - - - - - - - - - - - -
    614-93-306-31-018000

    614-93-306-31-018000

    SOCKET CARRIER LOWPRO .300 6POS

    Mill-Max Manufacturing Corp.

    3,075
    614-93-306-31-018000

    规格书

    614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-43-306-31-018000

    614-43-306-31-018000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    2,213
    614-43-306-31-018000

    规格书

    614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    21-7438-10

    21-7438-10

    CONN SOCKET SIP 21POS TIN

    Aries Electronics

    4,843
    21-7438-10

    规格书

    700 Elevator Strip-Line™ Bulk Active SIP 21 (1 x 21) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    21-7530-10

    21-7530-10

    CONN SOCKET SIP 21POS TIN

    Aries Electronics

    4,575
    21-7530-10

    规格书

    700 Elevator Strip-Line™ Bulk Active SIP 21 (1 x 21) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    21-7562-10

    21-7562-10

    CONN SOCKET SIP 21POS TIN

    Aries Electronics

    3,347
    21-7562-10

    规格书

    700 Elevator Strip-Line™ Bulk Active SIP 21 (1 x 21) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    22-6823-90

    22-6823-90

    CONN IC DIP SOCKET 22POS GOLD

    Aries Electronics

    2,010
    22-6823-90

    规格书

    Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
    26-6823-90T

    26-6823-90T

    CONN IC DIP SOCKET 26POS TIN

    Aries Electronics

    3,010
    26-6823-90T

    规格书

    Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 26 (2 x 13) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
    346-93-146-41-013000

    346-93-146-41-013000

    CONN SOCKET SIP 46POS GOLD

    Mill-Max Manufacturing Corp.

    4,018
    346-93-146-41-013000

    规格书

    346 Bulk Active SIP 46 (1 x 46) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    346-43-146-41-013000

    346-43-146-41-013000

    CONN SOCKET SIP 46POS GOLD

    Mill-Max Manufacturing Corp.

    2,064
    346-43-146-41-013000

    规格书

    346 Bulk Active SIP 46 (1 x 46) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    ICF-322-STL-O

    ICF-322-STL-O

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    1,263
    ICF-322-STL-O

    规格书

    ICF Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    36-3513-10H

    36-3513-10H

    CONN IC DIP SOCKET 36POS GOLD

    Aries Electronics

    3,127
    36-3513-10H

    规格书

    Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    24-3570-10

    24-3570-10

    CONN IC DIP SOCKET ZIF 24POS TIN

    Aries Electronics

    2,845
    24-3570-10

    规格书

    57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    24-6570-10

    24-6570-10

    CONN IC DIP SOCKET ZIF 24POS TIN

    Aries Electronics

    3,844
    24-6570-10

    规格书

    57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    116-41-310-41-007000

    116-41-310-41-007000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    1,687
    116-41-310-41-007000

    规格书

    116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-91-310-41-007000

    116-91-310-41-007000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,901
    116-91-310-41-007000

    规格书

    116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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