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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    317-93-107-41-005000

    317-93-107-41-005000

    CONN SKT SNG

    Mill-Max Manufacturing Corp.

    1,874
    317-93-107-41-005000

    规格书

    317 Bulk Active SIP 7 (1 x 7) 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.070" (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    210-41-320-41-001000

    210-41-320-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,323
    210-41-320-41-001000

    规格书

    210 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    210-91-320-41-001000

    210-91-320-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    1,996
    210-91-320-41-001000

    规格书

    210 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-47-308-41-007000

    116-47-308-41-007000

    STANDRD SOLDRTL DBL SKT

    Mill-Max Manufacturing Corp.

    3,011
    116-47-308-41-007000

    规格书

    116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-41-306-41-001000

    116-41-306-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,066
    116-41-306-41-001000

    规格书

    116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-91-306-41-001000

    116-91-306-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,298
    116-91-306-41-001000

    规格书

    116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    16-6503-21

    16-6503-21

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    2,295
    16-6503-21

    规格书

    503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    16-6503-31

    16-6503-31

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    3,579
    16-6503-31

    规格书

    503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    18-0503-21

    18-0503-21

    CONN SOCKET SIP 18POS GOLD

    Aries Electronics

    2,010
    18-0503-21

    规格书

    0503 Bulk Active SIP 18 (1 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled -
    18-0503-31

    18-0503-31

    CONN SOCKET SIP 18POS GOLD

    Aries Electronics

    2,316
    18-0503-31

    规格书

    0503 Bulk Active SIP 18 (1 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled -
    ICA-632-WGT-2

    ICA-632-WGT-2

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    4,549
    ICA-632-WGT-2

    规格书

    ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    115-44-320-41-003000

    115-44-320-41-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,800
    115-44-320-41-003000

    规格书

    115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    714-43-220-31-018000

    714-43-220-31-018000

    CONN IC DIP SOCKET 20POS GOLD

    Mill-Max Manufacturing Corp.

    3,351
    714-43-220-31-018000

    规格书

    714 Bulk Active DIP, 0.1" (2.54mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    210-41-316-41-001000

    210-41-316-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,357
    210-41-316-41-001000

    规格书

    210 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    210-91-316-41-001000

    210-91-316-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    1,731
    210-91-316-41-001000

    规格书

    210 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    317-93-104-41-005000

    317-93-104-41-005000

    CONN SKT SNG

    Mill-Max Manufacturing Corp.

    1,584
    317-93-104-41-005000

    规格书

    317 Bulk Active SIP 4 (1 x 4) 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.070" (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    510-83-225-18-091101

    510-83-225-18-091101

    CONN SOCKET PGA 225POS GOLD

    Preci-Dip

    1,729
    510-83-225-18-091101

    规格书

    510 Bulk Active PGA 225 (18 x 18) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    614-93-306-31-007000

    614-93-306-31-007000

    CONN IC DIP SOCKET 6POS GOLD

    Mill-Max Manufacturing Corp.

    2,893
    614-93-306-31-007000

    规格书

    614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-43-306-31-007000

    614-43-306-31-007000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    4,280
    614-43-306-31-007000

    规格书

    614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    115-44-316-41-003000

    115-44-316-41-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,720
    115-44-316-41-003000

    规格书

    115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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