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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    110-41-324-41-605000

    110-41-324-41-605000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,425
    110-41-324-41-605000

    规格书

    110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-41-624-41-605000

    110-41-624-41-605000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    1,560
    110-41-624-41-605000

    规格书

    110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-91-324-41-605000

    110-91-324-41-605000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,525
    110-91-324-41-605000

    规格书

    110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-91-624-41-605000

    110-91-624-41-605000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,948
    110-91-624-41-605000

    规格书

    110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    605-43-308-11-480000

    605-43-308-11-480000

    SKT CARRIER LOWPRO

    Mill-Max Manufacturing Corp.

    2,163
    605-43-308-11-480000

    规格书

    605 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-13-314-10-001000

    110-13-314-10-001000

    CONN IC DIP SOCKET 14POS GOLD

    Mill-Max Manufacturing Corp.

    2,971
    110-13-314-10-001000

    规格书

    110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7), 4 Loaded 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    714-43-138-31-018000

    714-43-138-31-018000

    CONN SOCKET SIP 38POS GOLD

    Mill-Max Manufacturing Corp.

    3,366
    714-43-138-31-018000

    规格书

    714 Bulk Active SIP 38 (1 x 38) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    317-91-113-41-005000

    317-91-113-41-005000

    CONN SKT SNG

    Mill-Max Manufacturing Corp.

    2,920
    317-91-113-41-005000

    规格书

    317 Bulk Active SIP 13 (1 x 13) 0.070" (1.78mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.070" (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    123-47-210-41-001000

    123-47-210-41-001000

    STANDARD WIRE WRAP DBL SKT

    Mill-Max Manufacturing Corp.

    3,500
    123-47-210-41-001000

    规格书

    123 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    24-6822-90C

    24-6822-90C

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    3,740
    24-6822-90C

    规格书

    Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    110-44-304-61-001000

    110-44-304-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,203
    110-44-304-61-001000

    规格书

    110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-43-306-41-003000

    612-43-306-41-003000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    3,793
    612-43-306-41-003000

    规格书

    612 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-93-306-41-003000

    612-93-306-41-003000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    4,358
    612-93-306-41-003000

    规格书

    612 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    115-91-324-41-003000

    115-91-324-41-003000

    SOCKET IC OPEN LOWPRO .300 24POS

    Mill-Max Manufacturing Corp.

    1,412
    115-91-324-41-003000

    规格书

    115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Thermoplastic -55°C ~ 125°C
    115-91-624-41-003000

    115-91-624-41-003000

    SOCKET IC OPEN LOWPRO .600 24POS

    Mill-Max Manufacturing Corp.

    4,986
    115-91-624-41-003000

    规格书

    115 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Thermoplastic -55°C ~ 125°C
    115-41-324-41-003000

    115-41-324-41-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,696
    115-41-324-41-003000

    规格书

    115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    115-41-624-41-003000

    115-41-624-41-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,523
    115-41-624-41-003000

    规格书

    115 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-41-310-41-001000

    614-41-310-41-001000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    4,525
    614-41-310-41-001000

    规格书

    614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-91-310-41-001000

    614-91-310-41-001000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    2,057
    614-91-310-41-001000

    规格书

    614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    8-1437504-3

    8-1437504-3

    CONN TRANSIST TO-3 3POS TIN

    TE Connectivity AMP Connectors

    3,712
    8-1437504-3

    规格书

    8080 Bulk Obsolete Transistor, TO-3 3 (Oval) - Tin 200.0µin (5.08µm) Beryllium Copper Chassis Mount Closed Frame Solder - Tin 200.0µin (5.08µm) Beryllium Copper Polytetrafluoroethylene (PTFE) -55°C ~ 125°C
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