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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    APH-1606-G-H

    APH-1606-G-H

    APH-1606-G-H

    Samtec Inc.

    4,412
    APH-1606-G-H

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-1206-G-H

    APH-1206-G-H

    APH-1206-G-H

    Samtec Inc.

    3,278
    APH-1206-G-H

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-0406-G-H

    APH-0406-G-H

    APH-0406-G-H

    Samtec Inc.

    2,152
    APH-0406-G-H

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-1706-G-H

    APH-1706-G-H

    APH-1706-G-H

    Samtec Inc.

    3,930
    APH-1706-G-H

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-1806-G-H

    APH-1806-G-H

    APH-1806-G-H

    Samtec Inc.

    4,192
    APH-1806-G-H

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-0706-G-H

    APH-0706-G-H

    APH-0706-G-H

    Samtec Inc.

    4,172
    APH-0706-G-H

    规格书

    * - Active - - - - - - - - - - - - - - -
    HLS-0215-G-10

    HLS-0215-G-10

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    3,283
    HLS-0215-G-10

    规格书

    HLS Tube Active SIP 30 (2 x 15) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    18-6810-90

    18-6810-90

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    2,900
    18-6810-90

    规格书

    Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
    22-81150-610C

    22-81150-610C

    CONN IC DIP SOCKET 22POS GOLD

    Aries Electronics

    3,653
    22-81150-610C

    规格书

    8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    22-81250-310C

    22-81250-310C

    CONN IC DIP SOCKET 22POS GOLD

    Aries Electronics

    4,564
    22-81250-310C

    规格书

    8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    22-81250-610C

    22-81250-610C

    CONN IC DIP SOCKET 22POS GOLD

    Aries Electronics

    2,863
    22-81250-610C

    规格书

    8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    22-8500-610C

    22-8500-610C

    CONN IC DIP SOCKET 22POS GOLD

    Aries Electronics

    3,625
    22-8500-610C

    规格书

    8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    22-8600-610C

    22-8600-610C

    CONN IC DIP SOCKET 22POS GOLD

    Aries Electronics

    4,533
    22-8600-610C

    规格书

    8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    22-8850-610C

    22-8850-610C

    CONN IC DIP SOCKET 22POS GOLD

    Aries Electronics

    2,794
    22-8850-610C

    规格书

    8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    605-93-310-11-480000

    605-93-310-11-480000

    SOCKET CARRIER LOWPRO .300 10POS

    Mill-Max Manufacturing Corp.

    3,369
    605-93-310-11-480000

    规格书

    605 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    605-43-310-11-480000

    605-43-310-11-480000

    SKT CARRIER LOWPRO

    Mill-Max Manufacturing Corp.

    3,462
    605-43-310-11-480000

    规格书

    605 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-91-428-41-001000

    110-91-428-41-001000

    CONN IC DIP SOCKET 28POS GOLD

    Mill-Max Manufacturing Corp.

    2,206
    110-91-428-41-001000

    规格书

    110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-41-428-41-001000

    110-41-428-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,644
    110-41-428-41-001000

    规格书

    110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-93-310-41-008000

    116-93-310-41-008000

    CONN IC DIP SOCKET 10POS GOLD

    Mill-Max Manufacturing Corp.

    2,603
    116-93-310-41-008000

    规格书

    116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    126-93-310-41-001000

    126-93-310-41-001000

    CONN IC DIP SOCKET 10POS GOLD

    Mill-Max Manufacturing Corp.

    1,084
    126-93-310-41-001000

    规格书

    126 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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