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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    APH-0908-G-H

    APH-0908-G-H

    APH-0908-G-H

    Samtec Inc.

    1,469
    APH-0908-G-H

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-1408-G-H

    APH-1408-G-H

    APH-1408-G-H

    Samtec Inc.

    1,896
    APH-1408-G-H

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-1808-G-H

    APH-1808-G-H

    APH-1808-G-H

    Samtec Inc.

    4,075
    APH-1808-G-H

    规格书

    * - Active - - - - - - - - - - - - - - -
    116-47-210-41-001000

    116-47-210-41-001000

    STANDRD SOLDRTL DBL SKT

    Mill-Max Manufacturing Corp.

    1,687
    116-47-210-41-001000

    规格书

    116 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    32-3513-11H

    32-3513-11H

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    3,208
    32-3513-11H

    规格书

    Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    28-6503-20

    28-6503-20

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    1,982
    28-6503-20

    规格书

    503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    28-6503-30

    28-6503-30

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    3,285
    28-6503-30

    规格书

    503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    116-93-210-41-008000

    116-93-210-41-008000

    CONN IC DIP SOCKET 10POS GOLD

    Mill-Max Manufacturing Corp.

    1,478
    116-93-210-41-008000

    规格书

    116 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-43-210-41-008000

    116-43-210-41-008000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,537
    116-43-210-41-008000

    规格书

    116 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    510-83-236-17-061101

    510-83-236-17-061101

    CONN SOCKET PGA 236POS GOLD

    Preci-Dip

    1,253
    510-83-236-17-061101

    规格书

    510 Bulk Active PGA 236 (17 x 17) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-83-236-17-062101

    510-83-236-17-062101

    CONN SOCKET PGA 236POS GOLD

    Preci-Dip

    3,655
    510-83-236-17-062101

    规格书

    510 Bulk Active PGA 236 (17 x 17) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-43-304-61-001000

    110-43-304-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    1,516
    110-43-304-61-001000

    规格书

    110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    104-11-210-41-770000

    104-11-210-41-770000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,614
    104-11-210-41-770000

    规格书

    104 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    121-11-310-41-001000

    121-11-310-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,522
    121-11-310-41-001000

    规格书

    121 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) - - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-43-316-41-605000

    110-43-316-41-605000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,771
    110-43-316-41-605000

    规格书

    110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    123-91-306-41-001000

    123-91-306-41-001000

    SOCKET IC OPEN 3 LVL .300 6POS

    Mill-Max Manufacturing Corp.

    3,289
    123-91-306-41-001000

    规格书

    123 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    123-41-306-41-001000

    123-41-306-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,134
    123-41-306-41-001000

    规格书

    123 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    HLS-0510-S-2

    HLS-0510-S-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    4,800
    HLS-0510-S-2

    规格书

    HLS Bulk Active SIP 50 (5 x 10) 0.100" (2.54mm) Gold - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    25-71000-10

    25-71000-10

    CONN SOCKET SIP 25POS TIN

    Aries Electronics

    1,602
    25-71000-10

    规格书

    700 Elevator Strip-Line™ Bulk Active SIP 25 (1 x 25) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    25-71219-10

    25-71219-10

    CONN SOCKET SIP 25POS TIN

    Aries Electronics

    4,609
    25-71219-10

    规格书

    700 Elevator Strip-Line™ Bulk Active SIP 25 (1 x 25) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
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