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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    HLS-0111-G-3

    HLS-0111-G-3

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    2,804
    HLS-0111-G-3

    规格书

    HLS Bulk Active SIP 11 (1 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    38-3503-20

    38-3503-20

    CONN IC DIP SOCKET 38POS GOLD

    Aries Electronics

    1,472
    38-3503-20

    规格书

    503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 38 (2 x 19) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    38-3503-30

    38-3503-30

    CONN IC DIP SOCKET 38POS GOLD

    Aries Electronics

    1,947
    38-3503-30

    规格书

    503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 38 (2 x 19) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    40-6503-30

    40-6503-30

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    4,322
    40-6503-30

    规格书

    503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    24-516-11M

    24-516-11M

    CONN IC DIP SOCKET ZIF 24POS GLD

    Aries Electronics

    2,770
    24-516-11M

    规格书

    516 Bulk Active DIP, ZIF (ZIP) 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled -
    115-47-652-41-001000

    115-47-652-41-001000

    STANDRD SOLDRTL DBL SKT

    Mill-Max Manufacturing Corp.

    3,884
    115-47-652-41-001000

    规格书

    115 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    42-1508-20

    42-1508-20

    CONN IC DIP SOCKET 42POS GOLD

    Aries Electronics

    2,109
    42-1508-20

    规格书

    508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    ICO-628-CGG

    ICO-628-CGG

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    1,896
    ICO-628-CGG

    规格书

    ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    APA-628-G-J

    APA-628-G-J

    ADAPTER PLUG

    Samtec Inc.

    2,150
    APA-628-G-J

    规格书

    APA Bulk Active - 28 (2 x 14) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    111-41-640-41-001000

    111-41-640-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,065
    111-41-640-41-001000

    规格书

    111 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    111-91-640-41-001000

    111-91-640-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,876
    111-91-640-41-001000

    规格书

    111 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    104-13-314-41-780000

    104-13-314-41-780000

    CONN IC DIP SOCKET 14POS GOLD

    Mill-Max Manufacturing Corp.

    3,184
    104-13-314-41-780000

    规格书

    104 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Thermoplastic -
    16-C280-20

    16-C280-20

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    4,293
    16-C280-20

    规格书

    EJECT-A-DIP™ Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    24-6508-202

    24-6508-202

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    2,914
    24-6508-202

    规格书

    508 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    146-93-422-41-012000

    146-93-422-41-012000

    CONN IC DIP SOCKET 22POS GOLD

    Mill-Max Manufacturing Corp.

    4,690
    146-93-422-41-012000

    规格书

    146 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    146-43-422-41-012000

    146-43-422-41-012000

    CONN SKT DBL

    Mill-Max Manufacturing Corp.

    1,708
    146-43-422-41-012000

    规格书

    146 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    APH-0930-T-T

    APH-0930-T-T

    APH-0930-T-T

    Samtec Inc.

    1,471
    APH-0930-T-T

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-0530-T-T

    APH-0530-T-T

    APH-0530-T-T

    Samtec Inc.

    1,233
    APH-0530-T-T

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-0630-T-T

    APH-0630-T-T

    APH-0630-T-T

    Samtec Inc.

    4,750
    APH-0630-T-T

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-1230-T-T

    APH-1230-T-T

    APH-1230-T-T

    Samtec Inc.

    3,052
    APH-1230-T-T

    规格书

    * - Active - - - - - - - - - - - - - - -
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