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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    APH-0230-T-T

    APH-0230-T-T

    APH-0230-T-T

    Samtec Inc.

    4,010
    APH-0230-T-T

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-0730-T-T

    APH-0730-T-T

    APH-0730-T-T

    Samtec Inc.

    1,897
    APH-0730-T-T

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-1130-T-T

    APH-1130-T-T

    APH-1130-T-T

    Samtec Inc.

    4,452
    APH-1130-T-T

    规格书

    * - Active - - - - - - - - - - - - - - -
    317-43-118-41-005000

    317-43-118-41-005000

    CONN SKT STRIP

    Mill-Max Manufacturing Corp.

    3,572
    317-43-118-41-005000

    规格书

    317 Bulk Active SIP 18 (1 x 18) 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.070" (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    605-93-316-11-480000

    605-93-316-11-480000

    SOCKET CARRIER LOWPRO .300 16POS

    Mill-Max Manufacturing Corp.

    3,503
    605-93-316-11-480000

    规格书

    605 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    605-43-316-11-480000

    605-43-316-11-480000

    SKT CARRIER LOWPRO

    Mill-Max Manufacturing Corp.

    1,799
    605-43-316-11-480000

    规格书

    605 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    17-0501-21

    17-0501-21

    CONN SOCKET SIP 17POS GOLD

    Aries Electronics

    1,486
    17-0501-21

    规格书

    501 Bulk Active SIP 17 (1 x 17) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    24-4518-10E

    24-4518-10E

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    1,035
    24-4518-10E

    规格书

    518 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    510-83-262-20-091101

    510-83-262-20-091101

    CONN SOCKET PGA 262POS GOLD

    Preci-Dip

    3,718
    510-83-262-20-091101

    规格书

    510 Bulk Active PGA 262 (20 x 20) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-99-950-41-001000

    110-99-950-41-001000

    CONN IC DIP SOCKET 50POS TINLEAD

    Mill-Max Manufacturing Corp.

    2,485
    110-99-950-41-001000

    规格书

    110 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-44-950-41-001000

    110-44-950-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,271
    110-44-950-41-001000

    规格书

    110 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    346-93-120-41-012000

    346-93-120-41-012000

    SOCKET SLDRLSS PRESSFIT SIP20POS

    Mill-Max Manufacturing Corp.

    4,901
    346-93-120-41-012000

    规格书

    346 Tube Active SIP 20 (1 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    317-93-119-41-005000

    317-93-119-41-005000

    CONN SKT SNG

    Mill-Max Manufacturing Corp.

    2,691
    317-93-119-41-005000

    规格书

    317 Bulk Active SIP 19 (1 x 19) 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.070" (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    104-11-316-41-780000

    104-11-316-41-780000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    1,754
    104-11-316-41-780000

    规格书

    104 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    146-41-628-41-012000

    146-41-628-41-012000

    CONN SKT DBL

    Mill-Max Manufacturing Corp.

    3,696
    146-41-628-41-012000

    规格书

    146 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    146-91-628-41-012000

    146-91-628-41-012000

    CONN SKT DBL

    Mill-Max Manufacturing Corp.

    4,218
    146-91-628-41-012000

    规格书

    146 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-93-320-41-007000

    116-93-320-41-007000

    CONN IC DIP SOCKET 20POS GOLD

    Mill-Max Manufacturing Corp.

    1,002
    116-93-320-41-007000

    规格书

    116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-93-420-41-007000

    116-93-420-41-007000

    CONN IC DIP SOCKET 20POS GOLD

    Mill-Max Manufacturing Corp.

    3,356
    116-93-420-41-007000

    规格书

    116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-43-320-41-007000

    116-43-320-41-007000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,774
    116-43-320-41-007000

    规格书

    116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-43-420-41-007000

    116-43-420-41-007000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,805
    116-43-420-41-007000

    规格书

    116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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