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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    116-93-328-41-003000

    116-93-328-41-003000

    CONN IC DIP SOCKET 28POS GOLD

    Mill-Max Manufacturing Corp.

    3,264
    116-93-328-41-003000

    规格书

    116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-93-428-41-003000

    116-93-428-41-003000

    CONN IC DIP SOCKET 28POS GOLD

    Mill-Max Manufacturing Corp.

    1,596
    116-93-428-41-003000

    规格书

    116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-93-628-41-003000

    116-93-628-41-003000

    CONN IC DIP SOCKET 28POS GOLD

    Mill-Max Manufacturing Corp.

    1,187
    116-93-628-41-003000

    规格书

    116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-43-328-41-003000

    116-43-328-41-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,148
    116-43-328-41-003000

    规格书

    116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-43-428-41-003000

    116-43-428-41-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,178
    116-43-428-41-003000

    规格书

    116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    38-6820-90C

    38-6820-90C

    CONN IC DIP SOCKET 38POS GOLD

    Aries Electronics

    3,446
    38-6820-90C

    规格书

    Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 38 (2 x 19) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    38-6822-90C

    38-6822-90C

    CONN IC DIP SOCKET 38POS GOLD

    Aries Electronics

    3,698
    38-6822-90C

    规格书

    Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 38 (2 x 19) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    38-6823-90C

    38-6823-90C

    CONN IC DIP SOCKET 38POS GOLD

    Aries Electronics

    3,154
    38-6823-90C

    规格书

    Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 38 (2 x 19) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    714-43-150-31-018000

    714-43-150-31-018000

    CONN SOCKET SIP 50POS GOLD

    Mill-Max Manufacturing Corp.

    3,676
    714-43-150-31-018000

    规格书

    714 Bulk Active SIP 50 (1 x 50) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    APO-314-G-H

    APO-314-G-H

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    3,918
    APO-314-G-H

    规格书

    APO Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    126-93-318-41-002000

    126-93-318-41-002000

    CONN IC DIP SOCKET 18POS GOLD

    Mill-Max Manufacturing Corp.

    3,562
    126-93-318-41-002000

    规格书

    126 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    126-43-318-41-002000

    126-43-318-41-002000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    1,055
    126-43-318-41-002000

    规格书

    126 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    ICF-640-STL-O

    ICF-640-STL-O

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    1,590
    ICF-640-STL-O

    规格书

    ICF Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    ICF-640-STL-I

    ICF-640-STL-I

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    3,787
    ICF-640-STL-I

    规格书

    ICF Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    APA-324-G-M

    APA-324-G-M

    ADAPTER PLUG

    Samtec Inc.

    1,166
    APA-324-G-M

    规格书

    APA Tube Active - 24 (2 x 12) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    APA-624-G-M

    APA-624-G-M

    ADAPTER PLUG

    Samtec Inc.

    1,468
    APA-624-G-M

    规格书

    APA Tube Active - 24 (2 x 12) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    14-3508-212

    14-3508-212

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    2,843
    14-3508-212

    规格书

    508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    14-3508-312

    14-3508-312

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    4,813
    14-3508-312

    规格书

    508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    ICA-648-ZSGG

    ICA-648-ZSGG

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    2,537
    ICA-648-ZSGG

    规格书

    ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    110-11-636-41-001000

    110-11-636-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    1,247
    110-11-636-41-001000

    规格书

    110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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