您好,欢迎来到双灏业商城!
    双灏业商城0755-83179664

    IC 插座

    制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

    全部重置
    应用所有
    结果:
    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    APH-0226-T-T

    APH-0226-T-T

    APH-0226-T-T

    Samtec Inc.

    3,260
    APH-0226-T-T

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-1326-T-T

    APH-1326-T-T

    APH-1326-T-T

    Samtec Inc.

    2,185
    APH-1326-T-T

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-0326-T-T

    APH-0326-T-T

    APH-0326-T-T

    Samtec Inc.

    4,144
    APH-0326-T-T

    规格书

    * - Active - - - - - - - - - - - - - - -
    100-PGM13061-10

    100-PGM13061-10

    CONN SOCKET PGA GOLD

    Aries Electronics

    1,164
    100-PGM13061-10

    规格书

    PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    104-13-324-41-770000

    104-13-324-41-770000

    CONN IC DIP SOCKET 24POS GOLD

    Mill-Max Manufacturing Corp.

    4,389
    104-13-324-41-770000

    规格书

    104 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Thermoplastic -
    104-13-424-41-770000

    104-13-424-41-770000

    CONN IC DIP SOCKET 24POS GOLD

    Mill-Max Manufacturing Corp.

    1,455
    104-13-424-41-770000

    规格书

    104 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Thermoplastic -
    104-13-624-41-770000

    104-13-624-41-770000

    CONN IC DIP SOCKET 24POS GOLD

    Mill-Max Manufacturing Corp.

    1,110
    104-13-624-41-770000

    规格书

    104 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Thermoplastic -
    517-87-320-19-131111

    517-87-320-19-131111

    CONN SOCKET PGA 320POS GOLD

    Preci-Dip

    4,183
    517-87-320-19-131111

    规格书

    517 Bulk Active PGA 320 (19 x 19) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    HLS-0218-T-12

    HLS-0218-T-12

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    4,586
    HLS-0218-T-12

    规格书

    HLS Tube Active SIP 36 (2 x 18) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    20-9503-21

    20-9503-21

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    1,382
    20-9503-21

    规格书

    503 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    20-9503-31

    20-9503-31

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    4,152
    20-9503-31

    规格书

    503 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    APA-422-G-C

    APA-422-G-C

    ADAPTER PLUG

    Samtec Inc.

    3,613
    APA-422-G-C

    规格书

    APA Bulk Active - 22 (2 x 11) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    APO-322-G-C

    APO-322-G-C

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    4,612
    APO-322-G-C

    规格书

    APO Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    APA-632-G-A1

    APA-632-G-A1

    ADAPTER PLUG

    Samtec Inc.

    3,221
    APA-632-G-A1

    规格书

    APA Bulk Active - 32 (2 x 16) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    210-11-636-41-001000

    210-11-636-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    1,269
    210-11-636-41-001000

    规格书

    210 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-41-642-41-006000

    116-41-642-41-006000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,684
    116-41-642-41-006000

    规格书

    116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-91-642-41-006000

    116-91-642-41-006000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    1,612
    116-91-642-41-006000

    规格书

    116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    114-41-652-41-117000

    114-41-652-41-117000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,009
    114-41-652-41-117000

    规格书

    114 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    114-91-652-41-117000

    114-91-652-41-117000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,211
    114-91-652-41-117000

    规格书

    114 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    114-93-636-41-117000

    114-93-636-41-117000

    CONN IC DIP SOCKET 36POS GOLD

    Mill-Max Manufacturing Corp.

    2,027
    114-93-636-41-117000

    规格书

    114 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    联系我们 获取更多产品资讯!
    双灏业商城

    首页

    双灏业商城

    产品中心

    双灏业商城

    电话

    双灏业商城

    会员中心

    品种齐全,轻松购物
    品种齐全,轻松购物
    多仓直发,极速配送
    多仓直发,极速配送
    正品行货,精致服务
    正品行货,精致服务
    天天低价,畅选无忧
    天天低价,畅选无忧
    版权所有©2025 双灏业商城