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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    614-43-424-41-001000

    614-43-424-41-001000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    4,838
    614-43-424-41-001000

    规格书

    614 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-43-624-41-001000

    614-43-624-41-001000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    4,873
    614-43-624-41-001000

    规格书

    614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    APO-318-G-R

    APO-318-G-R

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    4,852
    APO-318-G-R

    规格书

    APO Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    ICA-640-ZSGG-L

    ICA-640-ZSGG-L

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    4,642
    ICA-640-ZSGG-L

    规格书

    ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    612-43-320-41-004000

    612-43-320-41-004000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    3,653
    612-43-320-41-004000

    规格书

    612 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-43-420-41-004000

    612-43-420-41-004000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    3,340
    612-43-420-41-004000

    规格书

    612 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-93-320-41-004000

    612-93-320-41-004000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    4,741
    612-93-320-41-004000

    规格书

    612 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-93-420-41-004000

    612-93-420-41-004000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    4,685
    612-93-420-41-004000

    规格书

    612 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    510-83-300-21-001101

    510-83-300-21-001101

    CONN SOCKET PGA 300POS GOLD

    Preci-Dip

    4,204
    510-83-300-21-001101

    规格书

    510 Bulk Active PGA 300 (21 x 21) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-11-642-41-001000

    110-11-642-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    1,964
    110-11-642-41-001000

    规格书

    110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    315-13-132-41-003000

    315-13-132-41-003000

    SOCKET LOW PROFILE SIP 32POS

    Mill-Max Manufacturing Corp.

    4,209
    315-13-132-41-003000

    规格书

    315 Tube Active SIP 32 (1 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    27-7500-10

    27-7500-10

    CONN SOCKET SIP 27POS TIN

    Aries Electronics

    2,154
    27-7500-10

    规格书

    700 Elevator Strip-Line™ Bulk Active SIP 27 (1 x 27) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    27-7530-10

    27-7530-10

    CONN SOCKET SIP 27POS TIN

    Aries Electronics

    1,141
    27-7530-10

    规格书

    700 Elevator Strip-Line™ Bulk Active SIP 27 (1 x 27) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    27-7550-10

    27-7550-10

    CONN SOCKET SIP 27POS TIN

    Aries Electronics

    2,245
    27-7550-10

    规格书

    700 Elevator Strip-Line™ Bulk Active SIP 27 (1 x 27) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    27-7650-10

    27-7650-10

    CONN SOCKET SIP 27POS TIN

    Aries Electronics

    2,804
    27-7650-10

    规格书

    700 Elevator Strip-Line™ Bulk Active SIP 27 (1 x 27) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    612-11-320-41-001000

    612-11-320-41-001000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    2,285
    612-11-320-41-001000

    规格书

    612 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) - - Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    121-11-324-41-001000

    121-11-324-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,015
    121-11-324-41-001000

    规格书

    121 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) - - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    121-11-424-41-001000

    121-11-424-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,219
    121-11-424-41-001000

    规格书

    121 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) - - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    121-11-624-41-001000

    121-11-624-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,052
    121-11-624-41-001000

    规格书

    121 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) - - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    HLS-0314-G-22

    HLS-0314-G-22

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    4,602
    HLS-0314-G-22

    规格书

    HLS Tube Active SIP 42 (3 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
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