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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    614-93-428-31-007000

    614-93-428-31-007000

    SOCKET CARRIER LOWPRO .400 28POS

    Mill-Max Manufacturing Corp.

    1,565
    614-93-428-31-007000

    规格书

    614 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-93-628-31-007000

    614-93-628-31-007000

    CONN IC DIP SOCKET 28POS GOLD

    Mill-Max Manufacturing Corp.

    4,179
    614-93-628-31-007000

    规格书

    614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-43-328-31-007000

    614-43-328-31-007000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    3,199
    614-43-328-31-007000

    规格书

    614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-43-428-31-007000

    614-43-428-31-007000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    2,459
    614-43-428-31-007000

    规格书

    614 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-43-628-31-007000

    614-43-628-31-007000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    1,701
    614-43-628-31-007000

    规格书

    614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-13-306-61-001000

    110-13-306-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,125
    110-13-306-61-001000

    规格书

    110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-41-306-61-001000

    110-41-306-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,525
    110-41-306-61-001000

    规格书

    110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-91-306-61-001000

    110-91-306-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,249
    110-91-306-61-001000

    规格书

    110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-93-306-61-001000

    110-93-306-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,672
    110-93-306-61-001000

    规格书

    110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-99-306-61-001000

    110-99-306-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,613
    110-99-306-61-001000

    规格书

    110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    48-6518-11H

    48-6518-11H

    CONN IC DIP SOCKET 48POS GOLD

    Aries Electronics

    2,048
    48-6518-11H

    规格书

    518 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    32-6501-31

    32-6501-31

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    2,405
    32-6501-31

    规格书

    501 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    326-93-120-41-002000

    326-93-120-41-002000

    SOCKET WRAP SOLDERTAIL SIP 20POS

    Mill-Max Manufacturing Corp.

    4,878
    326-93-120-41-002000

    规格书

    326 Tube Active SIP 20 (1 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-41-636-41-007000

    116-41-636-41-007000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,176
    116-41-636-41-007000

    规格书

    116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-91-636-41-007000

    116-91-636-41-007000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    1,249
    116-91-636-41-007000

    规格书

    116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    HLS-0410-G-2

    HLS-0410-G-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    4,714
    HLS-0410-G-2

    规格书

    HLS Bulk Active SIP 40 (4 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    32-6556-20

    32-6556-20

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    2,825
    32-6556-20

    规格书

    6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
    32-6556-30

    32-6556-30

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    2,984
    32-6556-30

    规格书

    6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
    115-47-952-41-001000

    115-47-952-41-001000

    STANDRD SOLDRTL DBL SKT

    Mill-Max Manufacturing Corp.

    1,443
    115-47-952-41-001000

    规格书

    115 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    115-93-648-41-003000

    115-93-648-41-003000

    CONN IC DIP SOCKET 48POS GOLD

    Mill-Max Manufacturing Corp.

    1,265
    115-93-648-41-003000

    规格书

    115 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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