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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    APH-1218-G-R

    APH-1218-G-R

    APH-1218-G-R

    Samtec Inc.

    2,311
    APH-1218-G-R

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-0818-G-R

    APH-0818-G-R

    APH-0818-G-R

    Samtec Inc.

    2,630
    APH-0818-G-R

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-0418-G-R

    APH-0418-G-R

    APH-0418-G-R

    Samtec Inc.

    1,220
    APH-0418-G-R

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-1318-G-R

    APH-1318-G-R

    APH-1318-G-R

    Samtec Inc.

    1,209
    APH-1318-G-R

    规格书

    * - Active - - - - - - - - - - - - - - -
    612-43-640-41-003000

    612-43-640-41-003000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    1,385
    612-43-640-41-003000

    规格书

    612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-93-640-41-003000

    612-93-640-41-003000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    2,298
    612-93-640-41-003000

    规格书

    612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-41-652-41-001000

    614-41-652-41-001000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    2,336
    614-41-652-41-001000

    规格书

    614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-91-652-41-001000

    614-91-652-41-001000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    3,785
    614-91-652-41-001000

    规格书

    614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    605-93-950-11-480000

    605-93-950-11-480000

    SOCKET CARRIER LOWPRO .900 50POS

    Mill-Max Manufacturing Corp.

    2,920
    605-93-950-11-480000

    规格书

    605 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    605-43-950-11-480000

    605-43-950-11-480000

    SKT CARRIER LOWPRO

    Mill-Max Manufacturing Corp.

    2,243
    605-43-950-11-480000

    规格书

    605 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-44-210-61-001000

    110-44-210-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    1,456
    110-44-210-61-001000

    规格书

    110 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-93-650-31-012000

    614-93-650-31-012000

    SOCKET CARRIER LOWPRO .600 50POS

    Mill-Max Manufacturing Corp.

    3,551
    614-93-650-31-012000

    规格书

    614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-43-650-31-012000

    614-43-650-31-012000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    4,387
    614-43-650-31-012000

    规格书

    614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-93-950-41-003000

    116-93-950-41-003000

    CONN IC DIP SOCKET 50POS GOLD

    Mill-Max Manufacturing Corp.

    2,283
    116-93-950-41-003000

    规格书

    116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-43-950-41-003000

    116-43-950-41-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    1,257
    116-43-950-41-003000

    规格书

    116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    64-9518-10E

    64-9518-10E

    CONN IC DIP SOCKET 64POS GOLD

    Aries Electronics

    2,433
    64-9518-10E

    规格书

    518 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    104-11-950-41-770000

    104-11-950-41-770000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,395
    104-11-950-41-770000

    规格书

    104 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    115-43-320-61-001000

    115-43-320-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,676
    115-43-320-61-001000

    规格书

    115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    115-43-420-61-001000

    115-43-420-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,197
    115-43-420-61-001000

    规格书

    115 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    115-93-320-61-001000

    115-93-320-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    1,957
    115-93-320-61-001000

    规格书

    115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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