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    制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    APH-0414-G-R

    APH-0414-G-R

    APH-0414-G-R

    Samtec Inc.

    2,491
    APH-0414-G-R

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-1314-G-R

    APH-1314-G-R

    APH-1314-G-R

    Samtec Inc.

    2,533
    APH-1314-G-R

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-1214-G-R

    APH-1214-G-R

    APH-1214-G-R

    Samtec Inc.

    4,193
    APH-1214-G-R

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-0314-G-R

    APH-0314-G-R

    APH-0314-G-R

    Samtec Inc.

    4,367
    APH-0314-G-R

    规格书

    * - Active - - - - - - - - - - - - - - -
    84-PGM13042-50

    84-PGM13042-50

    CONN SOCKET PGA GOLD

    Aries Electronics

    4,256
    84-PGM13042-50

    规格书

    PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    84-PGM13053-50

    84-PGM13053-50

    CONN SOCKET PGA GOLD

    Aries Electronics

    3,179
    84-PGM13053-50

    规格书

    PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    123-13-318-41-801000

    123-13-318-41-801000

    CONN IC DIP SOCKET 18POS GOLD

    Mill-Max Manufacturing Corp.

    2,130
    123-13-318-41-801000

    规格书

    123 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    84-PGM11010-11H

    84-PGM11010-11H

    CONN SOCKET PGA GOLD

    Aries Electronics

    4,110
    84-PGM11010-11H

    规格书

    PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    714-43-238-31-018000

    714-43-238-31-018000

    CONN IC DIP SOCKET 38POS GOLD

    Mill-Max Manufacturing Corp.

    1,161
    714-43-238-31-018000

    规格书

    714 Bulk Active DIP, 0.1" (2.54mm) Row Spacing 38 (2 x 19) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-13-952-41-001000

    110-13-952-41-001000

    CONN IC DIP SOCKET 52POS GOLD

    Mill-Max Manufacturing Corp.

    4,478
    110-13-952-41-001000

    规格书

    110 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    115-43-320-61-003000

    115-43-320-61-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    1,906
    115-43-320-61-003000

    规格书

    115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    115-93-320-61-003000

    115-93-320-61-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,098
    115-93-320-61-003000

    规格书

    115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-91-328-61-001000

    110-91-328-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,771
    110-91-328-61-001000

    规格书

    110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-91-428-61-001000

    110-91-428-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    1,561
    110-91-428-61-001000

    规格书

    110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-93-648-41-008000

    116-93-648-41-008000

    CONN IC DIP SOCKET 48POS GOLD

    Mill-Max Manufacturing Corp.

    4,495
    116-93-648-41-008000

    规格书

    116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-43-648-41-008000

    116-43-648-41-008000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,791
    116-43-648-41-008000

    规格书

    116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-41-648-41-001000

    612-41-648-41-001000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    1,470
    612-41-648-41-001000

    规格书

    612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-91-648-41-001000

    612-91-648-41-001000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    3,980
    612-91-648-41-001000

    规格书

    612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    115-43-318-61-001000

    115-43-318-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,488
    115-43-318-61-001000

    规格书

    115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    115-93-318-61-001000

    115-93-318-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,501
    115-93-318-61-001000

    规格书

    115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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