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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    243-28-1-06

    243-28-1-06

    CONN IC DIP SOCKET 28POS TIN

    CNC Tech

    1,524
    243-28-1-06

    规格书

    - Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin 100.0µin (2.54µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    1-2199298-6

    1-2199298-6

    CONN IC DIP SOCKET 20POS TIN

    TE Connectivity AMP Connectors

    2,473
    1-2199298-6

    规格书

    Diplomate DL Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass, Copper Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    D01-9970242

    D01-9970242

    CONN SOCKET SIP 2POS GOLD

    Harwin Inc.

    16,032
    D01-9970242

    规格书

    D01-997 Bag Active SIP 2 (1 x 2) 0.100" (2.54mm) Gold Flash Beryllium Copper Threaded - Solder 0.100" (2.54mm) Tin 196.9µin (5.00µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    XR2C-0311-N

    XR2C-0311-N

    CONN SOCKET SIP 3POS GOLD

    Omron Electronics Inc-EMC Div

    3,654
    XR2C-0311-N

    规格书

    XR2 Bulk Active SIP 3 (1 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 125°C
    245-24-1-06

    245-24-1-06

    CONN IC DIP SOCKET 24POS TIN

    CNC Tech

    2,060
    245-24-1-06

    规格书

    - Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole, Kinked Pin Open Frame Solder 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    110-44-306-41-001000

    110-44-306-41-001000

    CONN IC DIP SOCKET 6POS TIN

    Mill-Max Manufacturing Corp.

    1,701
    110-44-306-41-001000

    规格书

    110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    AR 08-HZL/01-TT

    AR 08-HZL/01-TT

    CONN IC DIP SOCKET 8POS GOLD

    Assmann WSW Components

    6,895
    AR 08-HZL/01-TT

    规格书

    - Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
    D01-9970642

    D01-9970642

    CONN SOCKET SIP 6POS GOLD

    Harwin Inc.

    28,251
    D01-9970642

    规格书

    D01-997 Tube Active SIP 6 (1 x 6) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 196.9µin (5.00µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    AR 20-HZL-TT

    AR 20-HZL-TT

    CONN IC DIP SOCKET 20POS TIN

    Assmann WSW Components

    1,980
    AR 20-HZL-TT

    规格书

    - Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
    245-28-1-06

    245-28-1-06

    CONN IC DIP SOCKET 28POS TIN

    CNC Tech

    1,068
    245-28-1-06

    规格书

    - Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole, Kinked Pin Open Frame Solder 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    D01-9970542

    D01-9970542

    CONN SOCKET SIP 5POS GOLD

    Harwin Inc.

    2,593
    D01-9970542

    规格书

    D01-997 Tube Active SIP 5 (1 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 196.9µin (5.00µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    210-1-08-003

    210-1-08-003

    CONN IC DIP SOCKET 8POS GOLD

    CNC Tech

    2,927
    210-1-08-003

    规格书

    - Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT) -40°C ~ 105°C
    4808-3000-CP

    4808-3000-CP

    CONN IC DIP SOCKET 8POS TIN

    3M

    24,688
    4808-3000-CP

    规格书

    4800 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin 35.4µin (0.90µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin 35.0µin (0.90µm) Phosphor Bronze Polyester, Glass Filled -25°C ~ 85°C
    243-40-1-06

    243-40-1-06

    CONN IC DIP SOCKET 40POS TIN

    CNC Tech

    1,711
    243-40-1-06

    规格书

    - Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin 100.0µin (2.54µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    4816-3000-CP

    4816-3000-CP

    CONN IC DIP SOCKET 16POS TIN

    3M

    11,180
    4816-3000-CP

    规格书

    4800 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin 35.4µin (0.90µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin 35.0µin (0.90µm) Phosphor Bronze Polyester, Glass Filled -25°C ~ 85°C
    4814-3004-CP

    4814-3004-CP

    CONN IC DIP SOCKET 14POS TIN

    3M

    9,841
    4814-3004-CP

    规格书

    4800 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin 35.4µin (0.90µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin 35.0µin (0.90µm) Phosphor Bronze Polyester, Glass Filled -25°C ~ 85°C
    4814-3000-CP

    4814-3000-CP

    CONN IC DIP SOCKET 14POS TIN

    3M

    8,797
    4814-3000-CP

    规格书

    4800 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin 35.4µin (0.90µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin 35.0µin (0.90µm) Phosphor Bronze Polyester, Glass Filled -25°C ~ 85°C
    SA103000

    SA103000

    CONN IC DIP SOCKET 10POS GOLD

    On Shore Technology Inc.

    3,976
    SA103000

    规格书

    SA Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Thermoplastic, Polyester, Glass Filled -40°C ~ 105°C
    110-99-308-41-001000

    110-99-308-41-001000

    CONN IC DIP SOCKET 8POS TIN-LEAD

    Mill-Max Manufacturing Corp.

    2,011
    110-99-308-41-001000

    规格书

    110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    1-2199298-8

    1-2199298-8

    CONN IC DIP SOCKET 24POS TIN

    TE Connectivity AMP Connectors

    1,238
    1-2199298-8

    规格书

    Diplomate DL Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass, Copper Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
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