您好,欢迎来到双灏业商城!
    双灏业商城0755-83179664

    IC 插座

    制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

    全部重置
    应用所有
    结果:
    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    ICM-314-1-GT-HT

    ICM-314-1-GT-HT

    MACHINE PIN SOCKET, IC, DIP, 14P

    Adam Tech

    1,458
    ICM-314-1-GT-HT

    规格书

    ICM Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Polyphenylene Sulfide (PPS) -40°C ~ 105°C
    DILB28P-223TLF

    DILB28P-223TLF

    CONN IC DIP SOCKET 28POS TIN

    Amphenol ICC (FCI)

    2,755
    DILB28P-223TLF

    规格书

    - Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) Tin 100.0µin (2.54µm) Copper Alloy Polyamide (PA), Nylon -55°C ~ 105°C
    4816-3004-CP

    4816-3004-CP

    CONN IC DIP SOCKET 16POS TIN

    3M

    11,641
    4816-3004-CP

    规格书

    4800 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin 35.4µin (0.90µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin 35.0µin (0.90µm) Phosphor Bronze Polyester, Glass Filled -25°C ~ 85°C
    110-47-308-41-001000

    110-47-308-41-001000

    CONN IC DIP SOCKET 8POS GOLD

    Mill-Max Manufacturing Corp.

    1,261
    110-47-308-41-001000

    规格书

    110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    4820-3000-CP

    4820-3000-CP

    CONN IC DIP SOCKET 20POS TIN

    3M

    4,510
    4820-3000-CP

    规格书

    4800 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Tin 35.4µin (0.90µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin 35.0µin (0.90µm) Phosphor Bronze Polyester, Glass Filled -25°C ~ 85°C
    1-2199299-2

    1-2199299-2

    28P,DIP SKT,600 CL,LDR,PB FREE

    TE Connectivity AMP Connectors

    3,376
    1-2199299-2

    规格书

    Diplomate DL Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin 60.0µin (1.52µm) Nickel Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    1-2199298-9

    1-2199298-9

    CONN IC DIP SOCKET 28POS TIN

    TE Connectivity AMP Connectors

    2,752
    1-2199298-9

    规格书

    Diplomate DL Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass, Copper Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    08-3518-10

    08-3518-10

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    2,190
    08-3518-10

    规格书

    518 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    ICM-316-1-GT-HT

    ICM-316-1-GT-HT

    MACHINE PIN SOCKET, IC, DIP, 16P

    Adam Tech

    2,836
    ICM-316-1-GT-HT

    规格书

    ICM Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Polyphenylene Sulfide (PPS) -40°C ~ 105°C
    245-40-1-06

    245-40-1-06

    CONN IC DIP SOCKET 40POS TIN

    CNC Tech

    2,230
    245-40-1-06

    规格书

    - Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole, Kinked Pin Open Frame Solder 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    110-87-310-41-001101

    110-87-310-41-001101

    CONN IC DIP SOCKET 10POS GOLD

    Preci-Dip

    1,346
    110-87-310-41-001101

    规格书

    110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-87-314-41-001101

    110-87-314-41-001101

    CONN IC DIP SOCKET 14POS GOLD

    Preci-Dip

    5,221
    110-87-314-41-001101

    规格书

    110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    214-44-308-01-670800

    214-44-308-01-670800

    CONN IC DIP SOCKET 8POS TIN

    Mill-Max Manufacturing Corp.

    54,591
    214-44-308-01-670800

    规格书

    214 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    D2808-42

    D2808-42

    CONN IC DIP SOCKET 8POS GOLD

    Harwin Inc.

    29,484
    D2808-42

    规格书

    D2 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 196.9µin (5.00µm) Brass Plastic -55°C ~ 125°C
    1-2199300-2

    1-2199300-2

    CONN IC DIP SOCKET 32POS TINLEAD

    TE Connectivity AMP Connectors

    3,112
    1-2199300-2

    规格书

    Diplomate DL Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin-Lead 60.0µin (1.52µm) Phosphor Bronze Through Hole Open Frame, No Center Bar Solder 0.100" (2.54mm) Tin-Lead 60.0µin (1.52µm) Brass, Copper Polyester -55°C ~ 125°C
    4824-6000-CP

    4824-6000-CP

    CONN IC DIP SOCKET 24POS TIN

    3M

    1,866
    4824-6000-CP

    规格书

    4800 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin 35.4µin (0.90µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin 35.0µin (0.90µm) Phosphor Bronze Polyester, Glass Filled -25°C ~ 85°C
    PLCC-44-AT-SMT

    PLCC-44-AT-SMT

    PLCC SOCKET 44P SMT

    Adam Tech

    2,286
    PLCC-44-AT-SMT

    规格书

    PLCC Tube Active PLCC 44 (4 x 11) 0.050" (1.27mm) Tin 80.0µin (2.03µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 80.0µin (2.03µm) Phosphor Bronze Thermoplastic -55°C ~ 105°C
    ICM-318-1-GT-HT

    ICM-318-1-GT-HT

    MACHINE PIN SOCKET, IC, DIP, 18P

    Adam Tech

    2,175
    ICM-318-1-GT-HT

    规格书

    ICM Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Polyphenylene Sulfide (PPS) -40°C ~ 105°C
    2485264-1

    2485264-1

    DIP IC SOCKET 8P,GOLD FLASH

    TE Connectivity AMP Connectors

    4,766
    2485264-1

    规格书

    - Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 0.100" (2.54mm) Gold Flash Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) Tin 78.7µin (2.00µm) Copper Alloy Thermoplastic -55°C ~ 125°C
    05-0513-10T

    05-0513-10T

    CONN SOCKET SIP 5POS GOLD

    Aries Electronics

    1,152
    05-0513-10T

    规格书

    0513 Bulk Active SIP 5 (1 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    共 19086 记录«上一页1... 56789101112...955下一页»
    联系我们 获取更多产品资讯!
    双灏业商城

    首页

    双灏业商城

    产品中心

    双灏业商城

    电话

    双灏业商城

    会员中心

    品种齐全,轻松购物
    品种齐全,轻松购物
    多仓直发,极速配送
    多仓直发,极速配送
    正品行货,精致服务
    正品行货,精致服务
    天天低价,畅选无忧
    天天低价,畅选无忧
    版权所有©2025 双灏业商城