您好,欢迎来到双灏业商城!
    双灏业商城0755-83179664

    IC 插座

    制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

    全部重置
    应用所有
    结果:
    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    APH-1522-G-H

    APH-1522-G-H

    APH-1522-G-H

    Samtec Inc.

    1,319
    APH-1522-G-H

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-1022-G-H

    APH-1022-G-H

    APH-1022-G-H

    Samtec Inc.

    2,857
    APH-1022-G-H

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-0222-G-H

    APH-0222-G-H

    APH-0222-G-H

    Samtec Inc.

    1,331
    APH-0222-G-H

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-0322-G-H

    APH-0322-G-H

    APH-0322-G-H

    Samtec Inc.

    1,082
    APH-0322-G-H

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-0422-G-H

    APH-0422-G-H

    APH-0422-G-H

    Samtec Inc.

    4,417
    APH-0422-G-H

    规格书

    * - Active - - - - - - - - - - - - - - -
    121-13-964-41-001000

    121-13-964-41-001000

    CONN IC DIP SOCKET 64POS GOLD

    Mill-Max Manufacturing Corp.

    1,841
    121-13-964-41-001000

    规格书

    121 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-93-648-61-006000

    116-93-648-61-006000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,952
    116-93-648-61-006000

    规格书

    116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    HLS-0520-S-2

    HLS-0520-S-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    4,240
    HLS-0520-S-2

    规格书

    HLS Bulk Active SIP 100 (5 x 20) 0.100" (2.54mm) Gold - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    117-93-652-61-005000

    117-93-652-61-005000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,344
    117-93-652-61-005000

    规格书

    117 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    546-83-225-17-003135

    546-83-225-17-003135

    CONN SOCKET PGA 225POS GOLD

    Preci-Dip

    2,999
    546-83-225-17-003135

    规格书

    546 Bulk Active PGA 225 (17 x 17) 0.050" (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-13-648-61-001000

    110-13-648-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,963
    110-13-648-61-001000

    规格书

    110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-43-964-61-001000

    110-43-964-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    1,818
    110-43-964-61-001000

    规格书

    110 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    HLS-0320-T-18

    HLS-0320-T-18

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    4,203
    HLS-0320-T-18

    规格书

    HLS Tube Active SIP 60 (3 x 20) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    110-43-640-61-801000

    110-43-640-61-801000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,562
    110-43-640-61-801000

    规格书

    110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-93-640-61-801000

    110-93-640-61-801000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,199
    110-93-640-61-801000

    规格书

    110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    510-93-176-15-061002

    510-93-176-15-061002

    CONN PGA SOCKET 176PIN 15X15

    Mill-Max Manufacturing Corp.

    3,312
    510-93-176-15-061002

    规格书

    510 Tube Active PGA 176 (15 x 15) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-93-642-61-007000

    116-93-642-61-007000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    1,963
    116-93-642-61-007000

    规格书

    116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-87-238-19-101112

    614-87-238-19-101112

    CONN SOCKET PGA 238POS GOLD

    Preci-Dip

    2,881
    614-87-238-19-101112

    规格书

    614 Bulk Active PGA 238 (19 x 19) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    517-87-565-21-111111

    517-87-565-21-111111

    CONN SOCKET PGA 565POS GOLD

    Preci-Dip

    3,514
    517-87-565-21-111111

    规格书

    517 Bulk Active PGA 565 (21 x 21) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    36-3570-11

    36-3570-11

    CONN IC DIP SOCKET ZIF 36POS GLD

    Aries Electronics

    3,928
    36-3570-11

    规格书

    57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    联系我们 获取更多产品资讯!
    双灏业商城

    首页

    双灏业商城

    产品中心

    双灏业商城

    电话

    双灏业商城

    会员中心

    品种齐全,轻松购物
    品种齐全,轻松购物
    多仓直发,极速配送
    多仓直发,极速配送
    正品行货,精致服务
    正品行货,精致服务
    天天低价,畅选无忧
    天天低价,畅选无忧
    版权所有©2025 双灏业商城