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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    36-3575-11

    36-3575-11

    CONN IC DIP SOCKET ZIF 36POS TIN

    Aries Electronics

    4,100
    36-3575-11

    规格书

    57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    36-6573-11

    36-6573-11

    CONN IC DIP SOCKET ZIF 36POS TIN

    Aries Electronics

    3,717
    36-6573-11

    规格书

    57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    36-6574-11

    36-6574-11

    CONN IC DIP SOCKET ZIF 36POS TIN

    Aries Electronics

    1,284
    36-6574-11

    规格书

    57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    44-6552-11

    44-6552-11

    CONN IC DIP SOCKET ZIF 44POS GLD

    Aries Electronics

    2,269
    44-6552-11

    规格书

    55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    44-6553-11

    44-6553-11

    CONN IC DIP SOCKET ZIF 44POS GLD

    Aries Electronics

    2,495
    44-6553-11

    规格书

    55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    550-10-192M16-001152

    550-10-192M16-001152

    BGA SOLDER TAIL

    Preci-Dip

    4,666
    550-10-192M16-001152

    规格书

    550 Bulk Active BGA 192 (16 x 16) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
    115-43-950-61-001000

    115-43-950-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,847
    115-43-950-61-001000

    规格书

    115 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    441-PPG21001-10

    441-PPG21001-10

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    3,239
    441-PPG21001-10

    规格书

    - Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    116-43-650-61-001000

    116-43-650-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,654
    116-43-650-61-001000

    规格书

    116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    322-13-164-41-001000

    322-13-164-41-001000

    SOCKET 2 LEVEL WRAPOST SIP 64POS

    Mill-Max Manufacturing Corp.

    2,555
    322-13-164-41-001000

    规格书

    322 Tube Active SIP 64 (1 x 64) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    HLS-0512-G-2

    HLS-0512-G-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    3,812
    HLS-0512-G-2

    规格书

    HLS Bulk Active SIP 60 (5 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    110-13-624-61-801000

    110-13-624-61-801000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,397
    110-13-624-61-801000

    规格书

    110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-93-650-61-006000

    116-93-650-61-006000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,547
    116-93-650-61-006000

    规格书

    116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    714-43-258-31-018000

    714-43-258-31-018000

    CONN IC DIP SOCKET 58POS GOLD

    Mill-Max Manufacturing Corp.

    1,545
    714-43-258-31-018000

    规格书

    714 Bulk Active DIP, 0.1" (2.54mm) Row Spacing 58 (2 x 29) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    122-11-964-41-001000

    122-11-964-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,086
    122-11-964-41-001000

    规格书

    122 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) - - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    APO-628-G-R

    APO-628-G-R

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    2,796
    APO-628-G-R

    规格书

    APO Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    517-83-411-20-111111

    517-83-411-20-111111

    CONN SOCKET PGA 411POS GOLD

    Preci-Dip

    4,722
    517-83-411-20-111111

    规格书

    517 Bulk Active PGA 411 (20 x 20) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    APH-0430-G-H

    APH-0430-G-H

    APH-0430-G-H

    Samtec Inc.

    2,222
    APH-0430-G-H

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-1030-G-H

    APH-1030-G-H

    APH-1030-G-H

    Samtec Inc.

    3,946
    APH-1030-G-H

    规格书

    * - Active - - - - - - - - - - - - - - -
    APH-0630-G-H

    APH-0630-G-H

    APH-0630-G-H

    Samtec Inc.

    4,062
    APH-0630-G-H

    规格书

    * - Active - - - - - - - - - - - - - - -
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