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    图片 型号 库存 价格 数量 规格书 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
    AR16-HZL-TT

    AR16-HZL-TT

    CONN IC DIP SOCKET 16POS TIN

    Assmann WSW Components

    4,631
    AR16-HZL-TT

    规格书

    - Bag Obsolete DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
    A48-LC-TR

    A48-LC-TR

    CONN IC DIP SOCKET 48POS TIN

    Assmann WSW Components

    4,938
    A48-LC-TR

    规格书

    - Bag Obsolete DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT) -55°C ~ 85°C
    AW 127-15/Z-T

    AW 127-15/Z-T

    SOCKET 15 CONTACTS SINGLE ROW

    Assmann WSW Components

    1,797
    AW 127-15/Z-T

    规格书

    - - Active - - - - - - - - - - - - - - -
    116-87-304-41-003101

    116-87-304-41-003101

    CONN IC DIP SOCKET 4POS GOLD

    Preci-Dip

    1,171
    116-87-304-41-003101

    规格书

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    114-83-304-41-117101

    114-83-304-41-117101

    CONN IC DIP SOCKET 4POS GOLD

    Preci-Dip

    3,464
    114-83-304-41-117101

    规格书

    114 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    A 42-LC-TR

    A 42-LC-TR

    SOCKET

    Assmann WSW Components

    4,810
    A 42-LC-TR

    规格书

    A Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT) -55°C ~ 105°C
    114-87-306-41-117101

    114-87-306-41-117101

    CONN IC DIP SOCKET 6POS GOLD

    Preci-Dip

    4,657
    114-87-306-41-117101

    规格书

    114 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    114-87-306-41-134161

    114-87-306-41-134161

    CONN IC DIP SOCKET 6POS GOLD

    Preci-Dip

    3,857
    114-87-306-41-134161

    规格书

    114 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    SIP1X08-011B

    SIP1X08-011B

    SIP1X08-011B-SIP SOCKET 8 CTS

    Amphenol ICC (FCI)

    4,312
    SIP1X08-011B

    规格书

    SIP1x Bulk Active SIP 8 (1 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
    110-83-304-41-005101

    110-83-304-41-005101

    CONN IC DIP SOCKET 4POS GOLD

    Preci-Dip

    4,991
    110-83-304-41-005101

    规格书

    110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    01-0513-11

    01-0513-11

    CONN SOCKET SIP 1POS GOLD

    Aries Electronics

    3,018
    01-0513-11

    规格书

    0513 Bulk Active SIP 1 (1 x 1) - Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    02-1518-00

    02-1518-00

    CONN IC DIP SOCKET 2POS GOLD

    Aries Electronics

    3,116
    02-1518-00

    规格书

    518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 2 (1 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    115-87-306-41-001101

    115-87-306-41-001101

    CONN IC DIP SOCKET 6POS GOLD

    Preci-Dip

    1,530
    115-87-306-41-001101

    规格书

    115 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    AR 22-HZL-TT

    AR 22-HZL-TT

    SOCKET

    Assmann WSW Components

    1,301
    AR 22-HZL-TT

    规格书

    - Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 196.9µin (5.00µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    AW 127-16/Z-T

    AW 127-16/Z-T

    SOCKET 16 CONTACTS SINGLE ROW

    Assmann WSW Components

    4,917
    AW 127-16/Z-T

    规格书

    - - Active - - - - - - - - - - - - - - -
    AR08-HZL/07-TT

    AR08-HZL/07-TT

    CONN IC DIP SOCKET 8POS GOLD

    Assmann WSW Components

    3,681
    AR08-HZL/07-TT

    规格书

    - Bag Obsolete DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
    HLS-0101-T-10

    HLS-0101-T-10

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    2,654
    HLS-0101-T-10

    规格书

    HLS Tube Active SIP 1 (1 x 1) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    SA1000300000G

    SA1000300000G

    SA-7.43- 10P ; CLIP:TIN200U" PI

    Amphenol Anytek

    1,227
    SA1000300000G

    规格书

    SU Bulk Active SIP 10 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester, Glass Filled -40°C ~ 105°C
    02-0518-10H

    02-0518-10H

    CONN SOCKET SIP 2POS GOLD

    Aries Electronics

    1,175
    02-0518-10H

    规格书

    518 Bulk Active SIP 2 (1 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    02-0518-10T

    02-0518-10T

    CONN SOCKET SIP 2POS GOLD

    Aries Electronics

    1,196
    02-0518-10T

    规格书

    518 Bulk Active SIP 2 (1 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
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